Patents by Inventor Jin-Na Lee

Jin-Na Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240166611
    Abstract: The present invention relates to a novel triazole derivative or a salt thereof. The triazole derivative or the salt thereof according to the present invention induces or promotes browning of white adipocytes, and differentiates stem cells, embryonic cells, or preadipocytes to brown adipocytes or beige adipocytes. A composition comprising the triazole derivative or the salt thereof according to the present invention can treat, prevent, or alleviate obesity, obesity complications, diabetes, dyslipidemia, fatty liver, hypertension, metabolic syndrome, and insulin resistance syndrome.
    Type: Application
    Filed: December 22, 2023
    Publication date: May 23, 2024
    Applicant: GYEONGGIDO BUSINESS & SCIENCE ACCELERATOR
    Inventors: Jin-Mo KU, Jin-Kyung IN, Jung-Hun LEE, Han-Na CHA
  • Publication number: 20240117350
    Abstract: The present disclosure includes the use of miRNA inhibitor for treating a disease or condition associated with a decreased level of PSD95 and/or synaptophysin and/or an increased level of caspase 3 (e.g., dystonia, neuropsychiatric diseases, intellectual disability, and/or addiction). The miRNA inhibitor useful for the present disclosure can inhibit miR-485 expression and/or activity, which in turn can increase the level of PSD95 and/or synaptophysin protein of gene expression and decrease the level of caspase 3 protein or gene expression.
    Type: Application
    Filed: February 5, 2022
    Publication date: April 11, 2024
    Applicant: BIORCHESTRA CO., LTD.
    Inventors: Jin-Hyeob RYU, Hyo Jin LEE, Hyun Su MIN, Yu Na LIM
  • Patent number: 7847300
    Abstract: Disclosed is a light-emitting diode package. The light-emitting diode package includes an electrode pad on which a chip is placed; a housing having a window through which the chip is exposed; a housing wall defining the window; and an electrode lead extended from the electrode pad in a direction of the housing to be exposed outside a surface of the housing, wherein the housing wall formed in the direction comprises a first portion and a second portion thicker than the first portion to cover the electrode lead.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: December 7, 2010
    Assignee: Alti-Electronics Co., Ltd.
    Inventors: Sun-Hong Kim, Min-Sik Kim, Jin-Na Lee