Patents by Inventor JIN NENG WU
JIN NENG WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11970388Abstract: A package structure and its manufacturing method are provided. The package structure includes a substrate with a recess, and a first MEMS chip, a first intermediate chip, a second MEMS chip and a first capping plate sequentially formed on the substrate. The lower surface of the first MEMS chip has a first sensor or a microactuator. The upper surface of the second MEMS chip has a second sensor or a microactuator. The first intermediate chip has a through-substrate via, and includes a signal conversion unit, a logic operation unit, a control unit, or a combination thereof. The package structure includes at least one of the first sensor and the second sensor.Type: GrantFiled: December 14, 2021Date of Patent: April 30, 2024Assignee: WINBOND ELECTRONICS CORP.Inventor: Jin-Neng Wu
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Patent number: 11658138Abstract: Provided is a semiconductor device including a substrate, a passivation layer, and a connector. The passivation layer is disposed on the substrate. The connector is embedded in the passivation. An interface of the connector in contact with the passivation layer is uneven, thereby improving the structural stability of the connector. A method of manufacturing the semiconductor is also provided.Type: GrantFiled: February 24, 2022Date of Patent: May 23, 2023Assignee: Winbond Electronics Corp.Inventors: Yen-Jui Chu, Jin-Neng Wu
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Patent number: 11610857Abstract: Provided is a circuit structure including a substrate, a pad, a dielectric layer, a conductive layer, an adhesion layer, and a conductive bump. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The conductive layer contacts the pad and extends from the pad to cover a top surface of the dielectric layer. The adhesion layer is disposed between the dielectric layer and the conductive layer. The conductive bump extends in an upward manner from a top surface of the conductive layer. The conductive bump and the conductive layer are integrally formed. A method of manufacturing the circuit structure is also provided.Type: GrantFiled: September 8, 2021Date of Patent: March 21, 2023Assignee: Winbond Electronics Corp.Inventors: Jin-Neng Wu, Yen-Jui Chu
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Publication number: 20220185655Abstract: A package structure and its manufacturing method are provided. The package structure includes a substrate with a recess, and a first MEMS chip, a first intermediate chip, a second MEMS chip and a first capping plate sequentially formed on the substrate. The lower surface of the first MEMS chip has a first sensor or a microactuator. The upper surface of the second MEMS chip has a second sensor or a microactuator. The first intermediate chip has a through-substrate via, and includes a signal conversion unit, a logic operation unit, a control unit, or a combination thereof. The package structure includes at least one of the first sensor and the second sensor.Type: ApplicationFiled: December 14, 2021Publication date: June 16, 2022Inventor: Jin-Neng WU
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Publication number: 20220181282Abstract: Provided is a semiconductor device including a substrate, a passivation layer, and a connector. The passivation layer is disposed on the substrate. The connector is embedded in the passivation. An interface of the connector in contact with the passivation layer is uneven, thereby improving the structural stability of the connector. A method of manufacturing the semiconductor is also provided.Type: ApplicationFiled: February 24, 2022Publication date: June 9, 2022Applicant: Winbond Electronics Corp.Inventors: Yen-Jui Chu, Jin-Neng Wu
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Patent number: 11309267Abstract: Provided is a semiconductor device including a substrate, a passivation layer, and a connector. The passivation layer is disposed on the substrate. The connector is embedded in the passivation. An interface of the connector in contact with the passivation layer is uneven, thereby improving the structural stability of the connector. A method of manufacturing the semiconductor is also provided.Type: GrantFiled: July 15, 2020Date of Patent: April 19, 2022Assignee: Winbond Electronics Corp.Inventors: Yen-Jui Chu, Jin-Neng Wu
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Publication number: 20220059483Abstract: A conductive pillar bump includes a first conductive portion and a second conductive portion. The second conductive portion is located on the first conductive portion. A sidewall of the second conductive portion has at least one trench. The trench extends from a top portion of the second conductive portion to a bottom portion of the second conductive portion. The trench exposes a portion of a top surface of the first conductive portion.Type: ApplicationFiled: August 18, 2020Publication date: February 24, 2022Applicant: Winbond Electronics Corp.Inventor: Jin-Neng Wu
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Publication number: 20220020711Abstract: Provided is a semiconductor device including a substrate, a passivation layer, and a connector. The passivation layer is disposed on the substrate. The connector is embedded in the passivation. An interface of the connector in contact with the passivation layer is uneven, thereby improving the structural stability of the connector. A method of manufacturing the semiconductor is also provided.Type: ApplicationFiled: July 15, 2020Publication date: January 20, 2022Applicant: Winbond Electronics Corp.Inventors: Yen-Jui Chu, Jin-Neng Wu
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Publication number: 20210407946Abstract: Provided is a circuit structure including a substrate, a pad, a dielectric layer, a conductive layer, an adhesion layer, and a conductive bump. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The conductive layer contacts the pad and extends from the pad to cover a top surface of the dielectric layer. The adhesion layer is disposed between the dielectric layer and the conductive layer. The conductive bump extends in an upward manner from a top surface of the conductive layer. The conductive bump and the conductive layer are integrally formed. A method of manufacturing the circuit structure is also provided.Type: ApplicationFiled: September 8, 2021Publication date: December 30, 2021Applicant: Winbond Electronics Corp.Inventors: Jin-Neng Wu, Yen-Jui Chu
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Patent number: 11145627Abstract: Provided is a semiconductor package including first to third semiconductor dies, first to third RDL layers, conductive vias and an encapsulant, and a manufacturing method thereof. The first RDL layer is on an active surface of the first semiconductor die. The second semiconductor die is on the first RDL layer and electrically connected thereto through first TSVs. The conductive vias are on the first RDL layer and around the second semiconductor die. The encapsulant encapsulates the second semiconductor die and the conductive vias. The second RDL layer is on the encapsulant. The third semiconductor die is on the second RDL layer and electrically connected thereto through second TSVs. The third RDL layer is on the third semiconductor die. The area of the second semiconductor die is smaller than that of the first semiconductor die. The area of the third semiconductor die is larger than that of the second semiconductor die.Type: GrantFiled: October 4, 2019Date of Patent: October 12, 2021Assignee: Winbond Electronics Corp.Inventor: Jin-Neng Wu
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Patent number: 11063010Abstract: Provided is a redistribution layer (RDL) structure including a substrate, a pad, a dielectric layer, a self-aligned structure, a conductive layer, and a conductive connector. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The self-aligned structure is disposed on the dielectric layer. The conductive layer extends from the pad to conformally cover a surface of the self-aligned structure. The conductive connector is disposed on the self-aligned structure. A method of manufacturing the RDL structure is also provided.Type: GrantFiled: February 1, 2019Date of Patent: July 13, 2021Assignee: Winbond Electronics Corp.Inventors: Yen-Jui Chu, Jin-Neng Wu, Hsin-Hung Chou, Chun-Hung Lin
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Publication number: 20210104492Abstract: Provided is a semiconductor package including first to third semiconductor dies, first to third RDL layers, conductive vias and an encapsulant, and a manufacturing method thereof. The first RDL layer is on an active surface of the first semiconductor die. The second semiconductor die is on the first RDL layer and electrically connected thereto through first TSVs. The conductive vias are on the first RDL layer and around the second semiconductor die. The encapsulant encapsulates the second semiconductor die and the conductive vias. The second RDL layer is on the encapsulant. The third semiconductor die is on the second RDL layer and electrically connected thereto through second TSVs. The third RDL layer is on the third semiconductor die. The area of the second semiconductor die is smaller than that of the first semiconductor die. The area of the third semiconductor die is larger than that of the second semiconductor die.Type: ApplicationFiled: October 4, 2019Publication date: April 8, 2021Applicant: Winbond Electronics Corp.Inventor: Jin-Neng Wu
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Publication number: 20200350268Abstract: A wire bonding structure and a method of manufacturing the same are provided. The wire bonding structure includes a bonding pad structure, a protection layer and a bonding wire. The bonding pad structure includes a bonding pad and a conductive layer. The bonding pad has an opening. The conductive layer is electrically connected to the bonding pad. At least a portion of the conductive layer is located in the opening of the bonding pad and laterally surrounded by the bonding pad. The protection layer at least covers a portion of a surface of the bonding pad structure. The bonding wire is bonded to the conductive layer of the bonding pad structure.Type: ApplicationFiled: April 30, 2019Publication date: November 5, 2020Applicant: Winbond Electronics Corp.Inventors: Yen-Jui Chu, Jin-Neng Wu, Chun-Hung Lin, Hsin-Hung Chou
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Publication number: 20200251434Abstract: Provided is a redistribution layer (RDL) structure including a substrate, a pad, a dielectric layer, a self-aligned structure, a conductive layer, and a conductive connector. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The self-aligned structure is disposed on the dielectric layer. The conductive layer extends from the pad to conformally cover a surface of the self-aligned structure. The conductive connector is disposed on the self-aligned structure. A method of manufacturing the RDL structure is also provided.Type: ApplicationFiled: February 1, 2019Publication date: August 6, 2020Applicant: Winbond Electronics Corp.Inventors: Yen-Jui Chu, Jin-Neng Wu, Hsin-Hung Chou, Chun-Hung Lin
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Publication number: 20200251435Abstract: Provided is a circuit structure including a substrate, a pad, a dielectric layer, a conductive layer, an adhesion layer, and a conductive bump. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The conductive layer contacts the pad and extends from the pad to cover a top surface of the dielectric layer. The adhesion layer is disposed between the dielectric layer and the conductive layer. The conductive bump extends in an upward manner from a top surface of the conductive layer. The conductive bump and the conductive layer are integrally formed. A method of manufacturing the circuit structure is also provided.Type: ApplicationFiled: February 1, 2019Publication date: August 6, 2020Applicant: Winbond Electronics Corp.Inventors: Jin-Neng Wu, Yen-Jui Chu
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Patent number: 9535775Abstract: A session-based remote management system and a load balance controlling method are provided. The session-based remote management system includes a plurality of client servers, a load balancing server, a plurality of local databases, a shared database and a monitor server. The session-based remote management system is adapted for a plurality of clients coupling to a plurality of local databases and a shared database through a plurality of client servers. The load balance controlling method includes following steps. A computing performance of the clients and the client servers are analyzed. The clients are dispatched to the client servers based on the computing performance of the clients and the client servers. A crash probability of the client servers are dynamically predicted to obtain a health value.Type: GrantFiled: June 12, 2014Date of Patent: January 3, 2017Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Kuo-Ming Huang, Kuen-Min Lee, Jin-Neng Wu, Ping-Yu Chen, Mu-Kai Huang
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Publication number: 20150286519Abstract: A session-based remote management system and a load balance controlling method are provided. The session-based remote management system includes a plurality of client servers, a load balancing server, a plurality of local databases, a shared database and a monitor server. The session-based remote management system is adapted for a plurality of clients coupling to a plurality of local databases and a shared database through a plurality of client servers. The load balance controlling method includes following steps. A computing performance of the clients and the client servers are analyzed. The clients are dispatched to the client servers based on the computing performance of the clients and the client servers. A crash probability of the client servers are dynamically predicted to obtain a health value.Type: ApplicationFiled: June 12, 2014Publication date: October 8, 2015Inventors: Kuo-Ming HUANG, Kuen-Min LEE, Jin-Neng WU, Ping-Yu CHEN, Mu-Kai HUANG
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Patent number: 8938495Abstract: A remote management system with adaptive management mechanism is disclosed, by using an adaptive feedback session management decision (AFSMD) server to connect a plurality of clients and a plurality of cluster nodes respectively. AFSMD server includes a session ID map manager for recording mapping between session and cluster node forwarded to; a decision grade producer, for producing a decision grade to determine the session management manner required for the current session; a session connection number query (SCNQ) for communicating with a storage to obtain a total connection number of a client; a cluster node communication interface, for communicating with cluster nodes and for information cluster nodes if session needs duplication; and a session management decision controller for overseeing the entire session management decision flow to achieve higher efficiency.Type: GrantFiled: March 12, 2013Date of Patent: January 20, 2015Assignee: Industrial Technology Research InsituteInventors: Kuen-Min Lee, Jin-Neng Wu, Ping-Yu Chen, Yu-Chang Chao
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Patent number: 8819239Abstract: Distributed resource management systems and methods thereof are provided. Distributed resource management system at least includes resource managers (RMs) and resource consumers (RCs). RMs obtain current usage information of the resources of the distributed resource management system and generate first distributed resource graphs according to the current usage information of the resources. RMs obtain identification information of the RMs and generate second distributed resource graphs according to the identification information. RCs obtain a resource expense information regarding resource expense required by a plurality of jobs and generates third distributed resource graphs according to the resource expense information. A compound distributed resource graph (CDRG) is obtained by combining the first, second, and third distributed resource graphs and then the jobs to be performed by a corresponding amount of the resources within the distributed resource management system are determined according to the CDRG.Type: GrantFiled: July 11, 2012Date of Patent: August 26, 2014Assignee: Industrial Technology Research InstituteInventors: Jin-Neng Wu, Che-Wei Chang, Kuo-Ming Huang, Yao-Hsing Ko, Yu-Chang Chao
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Patent number: 8539054Abstract: A remote interface apparatus comprises a network interface, a peripheral device interface, an interface-providing mechanism and a network address setting mechanism. The network interface is configured to communicate with a remote host. The peripheral device interface is configured to connect to a peripheral device. The interface-providing mechanism cooperates with the network interface to transfer the peripheral device interface into a remote peripheral device connection port of the host. The network address setting mechanism is configured to automatically obtain a network address upon a connection to the network, and to broadcast information of the peripheral device interface.Type: GrantFiled: July 23, 2008Date of Patent: September 17, 2013Assignee: Industrial Technology Research InstituteInventors: Yung Shun Huang, Jin Neng Wu, Ping Yu Chen, Nien Chin Wu