Patents by Inventor Jin Nishiyama

Jin Nishiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring circuit flexible substrate including a terminal section and a connecting section
    Patent number: 8995090
    Abstract: A wiring circuit substrate, comprising: a metal support layer; an insulating layer formed on the metal support layer; a conductive layer for wiring formed on the insulating layer; and an opening formed so as to open at a same location in the insulating layer and the conductive layer for wiring, wherein the metal support layer includes: a support section that supports the insulating layer and the conductive layer for wiring, and a terminal section that extends from one edge side to the other edge side of the opening, the terminal section being separated from the support section; and the conductive layer for wiring includes a wiring that is connected to the terminal section by a connecting section.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: March 31, 2015
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Jin Nishiyama, Yuji Narita
  • Suspension substrate, suspension, suspension with head, hard disk drive, and method of manufacturing suspension substrate
    Patent number: 8810969
    Abstract: A suspension substrate includes a metal substrate, a first insulating layer provided on the metal substrate, a first wiring line layer provided on the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring line layer, and a second wiring line layer provided on the second insulating layer. When a total of a thickness of the first wiring line layer and a thickness of the second insulating layer on the first wiring line layer is T1 and a thickness of the second insulating layer at a position where a surface of the second insulating layer is flat and which is away from the first wiring line layer by a predetermined distance is T2, T1?T2<4.5 ?m is satisfied.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: August 19, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Jin Nishiyama, Yuji Narita, Hiroki Furushou
  • WIRING CIRCUIT SUBSTRATE, FLEXIBLE SUBSTRATE FOR SUSPENSION, AND METHOD OF PRODUCING FLEXIBLE SUBSTRATE FOR SUSPENSION
    Publication number: 20130342936
    Abstract: A wiring circuit substrate, comprising: a metal support layer; an insulating layer formed on the metal support layer; a conductive layer for wiring formed on the insulating layer; and an opening formed so as to open at a same location in the insulating layer and the conductive layer for wiring, wherein the metal support layer includes: a support section that supports the insulating layer and the conductive layer for wiring, and a terminal section that extends from one edge side to the other edge side of the opening, the terminal section being separated from the support section; and the conductive layer for wiring includes a wiring that is connected to the terminal section by a connecting section.
    Type: Application
    Filed: February 24, 2012
    Publication date: December 26, 2013
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Jin Nishiyama, Yuji Narita
  • SUSPENSION SUBSTRATE, SUSPENSION, SUSPENSION WITH HEAD, HARD DISK DRIVE, AND METHOD OF MANUFACTURING SUSPENSION SUBSTRATE
    Publication number: 20130201581
    Abstract: A suspension substrate includes a metal substrate, a first insulating layer provided on the metal substrate, a first wiring line layer provided on the first insulating layer, a second insulating layer provided on the first insulating layer and the first wiring line layer, and a second wiring line layer provided on the second insulating layer. When a total of a thickness of the first wiring line layer and a thickness of the second insulating layer on the first wiring line layer is T1 and a thickness of the second insulating layer at a position where a surface of the second insulating layer is flat and which is away from the first wiring line layer by a predetermined distance is T2, T1?T2<4.5 ?m is satisfied.
    Type: Application
    Filed: November 2, 2011
    Publication date: August 8, 2013
    Inventors: Jin Nishiyama, Yuji Narita, Hiroki Furushou