Patents by Inventor Jin OGIWARA

Jin OGIWARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230040233
    Abstract: Provided are a solid food, a compression molded body of a food powder, a solid milk, and a compression molded body of a powdered milk which can be produced with improved production efficiency while securing resistance to breakage. A solid food is a solid food having a solid form obtained by compression molding a food powder, in which a packing fraction of the solid food is configured such that an average value A from a surface of the solid food to a depth of 2 mm is larger than an average value C from a depth of 4 mm from the surface of the solid food to a depth of 6 mm, and a rate of increase (A?C)/C×100 of the packing fraction obtained by dividing a difference (A?C) between the average value A and the average value C by the average value C is 6.5% or less.
    Type: Application
    Filed: September 3, 2020
    Publication date: February 9, 2023
    Applicant: MEIJI CO., LTD.
    Inventors: Keigo HANYU, Tetsu KAMIYA, Koji YAMAMURA, Jin OGIWARA
  • Publication number: 20220408745
    Abstract: A solid food is a solid food having a solid form obtained by compression-molding a powder, the solid food including a body having a first face and a second face facing each other back to back. The body is provided with at least one hole penetrating the body from the first face to reach to the second face, and each of the first face, the second face, and an inner surface of the hole is an outer surface harder than an inner part of the body.
    Type: Application
    Filed: September 3, 2020
    Publication date: December 29, 2022
    Applicant: Meiji Co., Ltd.
    Inventors: Keigo HANYU, Aya KATO, Tetsu KAMIYA, Jin OGIWARA
  • Publication number: 20220346431
    Abstract: A solid food is a solid food having a solid form obtained by compression molding and hardening a food powder, in which a specific surface area voxel ratio of the solid food is configured such that an average value A from a surface of the solid food to a depth of 2 mm is smaller than an average value C from a depth of 4 mm from the surface of the solid food to a depth of 6 mm, and a rate of decrease (C?A)/C×100 of the specific surface area voxel ratio obtained by dividing a difference (C?A) between the average value C and the average value A by the average value C is 9.5% or less.
    Type: Application
    Filed: September 3, 2020
    Publication date: November 3, 2022
    Applicant: Meiji Co., Ltd.
    Inventors: Keigo HANYU, Tetsu KAMIYA, Koji YAMAMURA, Jin OGIWARA
  • Publication number: 20220330566
    Abstract: A method for producing a solid food having a solid form obtained by compression molding a food powder includes: compression molding the food powder to form a compression molded body of the food powder; and performing a hardening treatment on the compression molded body of the food powder, in which the hardening treatment includes placing the compression molded body of the food powder under an environment of a humidity of 100% RH or less and a temperature of higher than 100° C.
    Type: Application
    Filed: July 31, 2020
    Publication date: October 20, 2022
    Applicant: Meiji Co., Ltd.
    Inventors: Aya KATO, Keigo HANYU, Tetsu KAMIYA, Jin OGIWARA
  • Publication number: 20220322688
    Abstract: A solid food has a solid form obtained by compression molding a powder. Where a dissolution process from the solid food starting to dissolve until completely dissolving is measured over time on the basis of electric conductivity, times at which a dissolution ratio where electric conductivity at the time of finish of dissolution is 100%, reaches 20%, 63%, and 95% are t20, t63, and t95, and times (sec) at which the dissolution ratio of a reference solid food, formed under conditions in which a difference in weight with the solid food is within ±0.3%, a difference in surface area is within ±2%, a difference in hardness is within ±4%, and a humidification treatment temperature is 100° C. or lower, reaches 20%, 63%, and 95% are t20ref, t63ref, and t95ref, a solubility index (Id) represented by the following Formula (1) is less than 1.
    Type: Application
    Filed: September 3, 2020
    Publication date: October 13, 2022
    Applicant: Meiji Co., Ltd.
    Inventors: Aya KATO, Keigo HANYU, Tetsu KAMIYA, Jin OGIWARA