Patents by Inventor JINOH AHN

JINOH AHN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230413424
    Abstract: A module board and a memory module are provided. The module board includes a first branch line for connecting a clock signal terminal disposed on at least one surface to a first branch point; a first signal line for connecting the first branch point to a first module clock signal terminal; a second signal line for connecting the first module clock signal terminal to the kth module clock signal terminal and a first termination resistance terminal; a third signal line for connecting the first branch point to a (k+1)th module clock signal terminal; and a fourth signal line for connecting the (k+1)th module clock signal terminal to a 2kth module clock signal terminal and the second termination resistance terminal, wherein a length of the third signal line is greater than a sum of a length of the first signal line and a length of the second signal line.
    Type: Application
    Filed: August 31, 2023
    Publication date: December 21, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wonseop LEE, Hwanwook Park, Jeonghoon Baek, Dohyung Kim, Seunghee Mun, Dongyoon Seo, Jinoh Ahn
  • Patent number: 11785710
    Abstract: A module board and a memory module are provided. The module board includes a first branch line for connecting a clock signal terminal disposed on at least one surface to a first branch point; a first signal line for connecting the first branch point to a first module clock signal terminal; a second signal line for connecting the first module clock signal terminal to the kth module clock signal terminal and a first termination resistance terminal; a third signal line for connecting the first branch point to a (k+1)th module clock signal terminal; and a fourth signal line for connecting the (k+1)th module clock signal terminal to a 2kth module clock signal terminal and the second termination resistance terminal, wherein a length of the third signal line is greater than a sum of a length of the first signal line and a length of the second signal line.
    Type: Grant
    Filed: September 19, 2022
    Date of Patent: October 10, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wonseop Lee, Hwanwook Park, Jeonghoon Baek, Dohyung Kim, Seunghee Mun, Dongyoon Seo, Jinoh Ahn
  • Publication number: 20230013064
    Abstract: A module board and a memory module are provided. The module board includes a first branch line for connecting a clock signal terminal disposed on at least one surface to a first branch point; a first signal line for connecting the first branch point to a first module clock signal terminal; a second signal line for connecting the first module clock signal terminal to the kth module clock signal terminal and a first termination resistance terminal; a third signal line for connecting the first branch point to a (k+1)th module clock signal terminal; and a fourth signal line for connecting the (k+1)th module clock signal terminal to a 2kth module clock signal terminal and the second termination resistance terminal, wherein a length of the third signal line is greater than a sum of a length of the first signal line and a length of the second signal line.
    Type: Application
    Filed: September 19, 2022
    Publication date: January 19, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wonseop LEE, Hwanwook PARK, Jeonghoon BAEK, Dohyung KIM, Seunghee MUN, Dongyoon SEO, Jinoh AHN
  • Patent number: 11477880
    Abstract: A module board and a memory module are provided. The module board includes a first branch line for connecting a clock signal terminal disposed on at least one surface to a first branch point; a first signal line for connecting the first branch point to a first module clock signal terminal; a second signal line for connecting the first module clock signal terminal to the kth module clock signal terminal and a first termination resistance terminal; a third signal line for connecting the first branch point to a (k+1)th module clock signal terminal; and a fourth signal line for connecting the (k+1)th module clock signal terminal to a 2kth module clock signal terminal and the second termination resistance terminal, wherein a length of the third signal line is greater than a sum of a length of the first signal line and a length of the second signal line.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: October 18, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wonseop Lee, Hwanwook Park, Jeonghoon Baek, Dohyung Kim, Seunghee Mun, Dongyoon Seo, Jinoh Ahn
  • Publication number: 20220159827
    Abstract: A module board and a memory module are provided. The module board includes a first branch line for connecting a clock signal terminal disposed on at least one surface to a first branch point; a first signal line for connecting the first branch point to a first module clock signal terminal; a second signal line for connecting the first module clock signal terminal to the kth module clock signal terminal and a first termination resistance terminal; a third signal line for connecting the first branch point to a (k+1)th module clock signal terminal; and a fourth signal line for connecting the (k+1)th module clock signal terminal to a 2kth module clock signal terminal and the second termination resistance terminal, wherein a length of the third signal line is greater than a sum of a length of the first signal line and a length of the second signal line.
    Type: Application
    Filed: June 3, 2021
    Publication date: May 19, 2022
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wonseop LEE, Hwanwook PARK, Jeonghoon BAEK, Dohyung KIM, Seunghee MUN, Dongyoon SEO, Jinoh AHN
  • Publication number: 20200084881
    Abstract: A semiconductor memory module may include a printed circuit board and semiconductor memory packages provided on the printed circuit board. The printed circuit board may include a connector provided at a side region of the printed circuit board and configured to be connected to an external device, signal lines configured to connect the connector to the semiconductor memory packages, a first element configured to provide a first capacitive coupling between first signal lines, which are closest to each other, among the signal lines, a second element configured to provide a second capacitive coupling between second signal lines, which are disposed adjacent to each other with one signal line interposed therebetween, among the signal lines, and a third element configured to provide a third capacitive coupling between third signal lines, which are disposed adjacent to each other with two signal lines interposed therebetween, among the signal lines.
    Type: Application
    Filed: May 25, 2019
    Publication date: March 12, 2020
    Inventors: SIHYUNG LEE, CHANGWOO KO, SEON-SIK KIM, JIYOON MOON, JINOH AHN