Abstract: An image interpolation method interpolating image information of a point in a space constructed by a plurality of planes. According to the method, a reliable interpolated value can be rapidly obtained by searching for the nearest plane to the point, obtaining information about a plane facing the nearest plane using image information of one or more vertices of the plane facing the nearest plane, and interpolating the image information of the point using the image information of the one or more vertices of the nearest plane and the obtained information about the plane facing the nearest plane.

Abstract: A signal quality measuring method and apparatus in which a quality of a signal detected from an RF signal read out from a disk or a communications channel is measured by using eye pattern signals of the detected RF signals. Eye pattern signals representing time change of a waveform of the detected signal are generated and a signal quality value is generated based on an eye depth and/or an eye width measured from the eye pattern signals. A histogram of the eye pattern signals is used to identify a plurality of main level values which are used as a reference value in measuring the signal quality. Accordingly, signal characteristics in a high-density storage medium system or communication system may be accurately represented.

Abstract: A dual-view liquid crystal display device includes a display panel to display images; and a switching panel including first and second regions, the first and second regions controlled to represent a single image or different images displayed on the display panel, wherein a line width of the first region is adjustable. And, a method for driving a dual-view display device includes dividing the images displayed on the display panel in different directions by controlling a switching panel that includes first and second regions; and adjusting a line width of the first region in accordance with a viewing angle of a user.

Abstract: Disclosed is a parallel processing method in a data processing system that temporarily loads data stored in a memory in word registers and parallel-processes subwords constituting the loaded word using Arithmetic Logic Units (ALUs) which are equal in size to the subwords. The method includes generating a shortened subword by removing at least one bit among the bits constituting each subword; and performing parallel computation on the shortened subwords.

Abstract: Disclosed herein are a semiconductor package used in digital optical instruments and a method of manufacturing the same. The semiconductor package comprises a wafer made of a silicon material and having pad electrodes formed at one side surface thereof, an IR filter attached on the pad electrodes of the wafer by means of a bonding agent, terminals electrically connected to the pad electrodes, respectively, in via holes formed at the other side surface of the wafer, which is opposite to the pad electrodes, and bump electrodes, each of which is connected to one side of each of the terminals. The present invention is capable of minimizing the size of a semiconductor package having an image sensor, which is referred to as a complementary metal oxide semiconductor (CMOS) or a charge coupled device (CCD), through the application of a wafer level package technology, thereby reducing the manufacturing costs of the semiconductor package and accomplishing production on a large scale.

Abstract: Disclosed are a driving apparatus of a PDP to decrease the size of the PDP as well as to enhance electrical characteristics by mounting a plurality of control chips and memories on a single package, and a fabrication method thereof. The driving apparatus includes a multi-chip module in which at least one control chip having a control circuit for controlling the PDP, and at least one memory are mounted on a single package, wherein the multi-chip module is mounted on a printed circuit board (PCB) of a control board.

Abstract: Provided is a method for converting a first image signal expressed in a first color space into a second image signal expressed in a second color space on a subword parallelism basis.

Abstract: An optical disc reproducing apparatus includes an analog-to-digital (A/D) converter which converts an analog signal obtained from an optical disc to a digital signal; an asymmetry compensator which detects and corrects an offset of the digital signal; a phase locked loop (PLL) which estimates a clock of the digital signal and compensates for a frequency error; a binary module which converts the digital signal to binary data; an equalizer which equalizes a particular frequency of the digital signal; and a channel identifier which detects a reference level of the binary module, based on an input signal of the equalizer.

Abstract: An optical disc reproducing apparatus includes an A/D converter; an asymmetry compensator for detecting 4T sampling signals; a phase locked loop including a frequency detector that counts and detects run-length signals from the digital signals and compensates frequency errors of the digital signals; a binary module including a Viterbi decoder, a slicer, and a minimum T compensator that compensates the digital signal with a minimum signal having a unit cycle; an equalizer; an adaptive level error detector detecting a base level of the Viterbi decoder from both an input signal into the equalizer and an output signal from the Viterbi decoder, and computing a filtering coefficient of the equalizer from the base level; and a signal quality measurer measuring a jitter or an SbER of the digital signal.

Abstract: A defect signal detecting apparatus for an optical recording/reproducing apparatus that includes a maximum value detecting unit for detecting a highest amplitude among signals input during a maximum value detection period as a maximum value, a minimum value detecting unit for detecting a lowest amplitude among signals input during a minimum value detection period as a minimum value, an asymmetry detecting unit for calculating an amount ? of asymmetry by detecting a maximum value ILmax and a minimum value ILmin of a signal IL having a maximum periodicity among the signal input, and a maximum value ISmax and a minimum value ISmin of a signal IS having a minimum periodicity among the signal input, and a defect determining unit for determining whether there is a defect in the signal input, using the maximum value, the minimum value and the amount ? of asymmetry.

Abstract: A camera module package using a flip-chip type image sensor module is provided. The camera module package includes: a lens barrel in which a plurality of lenses are stacked and mounted; a housing having an upper opening into which the lens barrel is inserted and mounted; and an image sensor module. The image sensor module includes an image sensor to which bumps are bonded on electrode pads formed on one side; a flexible printed circuit board (FPCB) having via holes formed at positions corresponding to the pads of the image sensor, and conductive patterns formed between layers in which the via holes are formed; and a conductive adhesive filled in the via holes. Accordingly, in manufacturing the COF type image sensor image module, the flip-chip bonding can be achieved only using the conductive adhesive inside the via hole without ACF or NCP, attributing to the microstructure of the camera module.

Abstract: Provided are a WLCSP of an image sensor and a method of manufacturing the same. The WLCSP includes a wafer, support members, glass, and metal bumps. The wafer has an image sensor and a pair of pads disposed thereon, a portion of the bottom surface of the image sensor being exposed outward from the both ends of the wafer. The support members are disposed on the pads to support the both bottom sides of the glass, the support members being formed to a predetermined thickness to provide a space for forming an air cavity. The glass is safely seated on the support members such that the air cavity is formed on the wafer. The metal bumps are disposed on the both sides of the wafer corresponding to the pads such that the bottom surfaces of the metal bumps protrude beyond the bottom surface of the wafer and form conductive lines electrically connected to the pads. Therefore, the package can be directly attached to a camera module even without using a separate PCB or ceramic substrate.

Abstract: A liquid crystal display includes a first insulating substrate with a top surface and a bottom surface. A pixel electrode is formed on the top surface of the first insulating substrate. The pixel electrode has a first opening pattern at each pixel area. The pixel electrode with the first opening pattern is substantially rectangular in shape with a first long side and a second long side, and first short side and a second short side. The pixel electrode is divided into an upper region defined by the first long side and the second long side and the first short side, and a lower region defined by the first long side and the second long side and the second short side. A second insulating substrate with a top surface and a bottom surface is arranged parallel to the first insulating substrate at a predetermined distance from the same such that the bottom surface of the second insulating substrate faces the top surface of the first insulating substrate.

Abstract: A method of fabricating a liquid crystal display device is disclosed in the present invention. The method includes forming a thin film transistor in a pixel region and a pad on an edge region of a first substrate, depositing an organic passivation layer over the first substrate, and removing the organic passivation layer in the edge region using a diffraction mask to expose a portion of the pad, wherein the diffraction mask has a slit portion including a plurality of slits having different widths.

Abstract: A printed circuit board (PCB) and a liquid crystal display (LCD) including the same are provided. The PCB includes a metal pattern formed on an insulating substrate, an insulating layer covering the metal pattern, and at least one insulating layer protecting pattern formed on the insulating layer. The LCD includes a liquid crystal panel, a backlight assembly providing light to the liquid crystal panel, a bottom chassis having at least one support protruding from a surface thereof and receiving the liquid crystal panel and the backlight assembly, and a printed circuit board (PCB) including a metal pattern formed on an insulating substrate, an insulating layer covering the metal pattern, and at least one insulating layer protecting pattern formed on the insulating layer, wherein the printed circuit board is connected to the surface of the bottom chassis.

Abstract: An electrical connector that prevents generation of static electricity is presented. The connector includes a body portion having a receiving space and a bottom surface that forms an inner wall of the receiving space. A terminal portion is disposed on the body portion, and a cover portion is positioned to enclose the receiving space when closed. A protecting member is disposed on the cover portion and protrudes beyond the outer surface of the terminal portion. By using this connector, damage to circuit parts or circuit elements caused by static electricity may be prevented.

Abstract: A liquid crystal display includes a first insulating substrate with a top surface and a bottom surface. A pixel electrode is formed on the top surface of the first insulating substrate. The pixel electrode has a first opening pattern at each pixel area. The pixel electrode with the first opening pattern is substantially rectangular in shape with a first long side and a second long side, and a first short side and a second short side. The pixel electrode is divided into an upper region defined by the first long side and the second long side and the first short side, and a lower region defined by the first long side and the second long side and the second short side. A second insulating substrate with a top surface and a bottom surface is arranged parallel to the first insulating substrate at a predetermined distance from the same such that the bottom surface of the second insulating substrate faces the top surface of the first insulating substrate.

Abstract: A liquid crystal display device is disclosed in the present invention. The liquid crystal display device includes a color filter substrate having a black matrix, and color filter layers at a designated region determined by the black matrix, an array substrate having a gate bus line and a data bus line crossing perpendicularly and defining a unit pixel region, a thin film transistor arranged at an intersection of the gate bus line and the data bus line, a pixel electrode contacting a drain electrode of the thin film transistor and vertically overlapping portions of the gate bus line, the data bus line, an adjacent gate bus line, and an adjacent data bus line, and an organic insulating layer on the pixel electrode and the thin film transistor, wherein a surface of the array substrate is rubbed in a 315 degree direction, and a liquid crystal layer between the array substrate and the color filter substrate.

Abstract: An asymmetric error correction device includes an analog-to-digital (A/D) converter sampling analog radio frequency (RF) signals reproduced from an optical disc with a sampling period, converting the same into the digital sampling signals, and outputting the same; a signal detector for detecting 4T sampling signals varying in polarity thereof every four times the sampling period among the digital sampling signals; an operator selecting and adding a signal among the 4T sampling signals to operate an asymmetric error value; a counter cumulatively counting the asymmetric error value operated in the operator; and a corrector correcting a signal level of the digital sampling signal outputted from the A/D converter if the counted value counted by the counter is out of a predetermined critical range. The asymmetric error is precisely corrected even in a signal part in which the asymmetric error is minutely generated.

Abstract: The present invention provides a chip scale image sensor module and the fabrication method of the same which includes an optical filter removing specific wavelength from the light into the image sensor and a glass layer attached to the optical filter to protect a coating layer, forming pad electrodes on the backside thereof. The invention also includes an image sensor attached to the pad electrodes with redistribution pads formed from the pad electrodes in the backside, and solder balls provided on the backside of the image sensor. The invention reduces the size of the module, screens and uses good quality image sensor modules, saving the manufacturing costs, and having advantage in mass production.