Abstract: A capacitance gauge tracking apparatus used for an exposure system for manufacturing a semiconductor device, a method for tracking a surface of the semiconductor device, a leveling apparatus and a leveling method are provided. The capacitance gauge tracking apparatus includes a ground unit, a probe unit and a gauge unit. The ground unit is connected to a semiconductor substrate. The probe unit is spaced apart from the surface of the semiconductor substrate to be tracked and a constant current of at least two frequency bands is applied to the probe unit. A constant current of a low frequency is applied to the probe unit to thereby perform global leveling by global tracking of the entire surface of the semiconductor substrate and a constant current of a high frequency is applied to the probe unit to thereby perform local leveling by local tracking on the semiconductor substrate.

Abstract: Reduction in focusing error of an exposure process includes forming a conductive layer over a wafer whose topology is to be measured by a capacitance gauge. The conductive layer is thick enough such that differences in capacitance measured by the capacitance gauge tracking apparatus are not due to differences in underlying material and structure on the wafer. Thus, accurate measurement of the real topology of wafer by capacitance gauge tracking apparatus may be realized. As a result, the subsequent exposure processing is reliable.