Patents by Inventor Jin Seok Lee

Jin Seok Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240119978
    Abstract: Provided a semiconductor memory device. The semiconductor memory device includes a substrate, a gate electrode on the substrate, a bit line on the substrate, a cell semiconductor pattern on a side of the gate electrode and electrically connected to the bit line, a capacitor structure including a first electrode electrically connected to the cell semiconductor pattern, a second electrode on the first electrode, and a capacitor dielectric film between the first electrode and the second electrode, a bit line strapping line spaced apart from the bit line in the second direction, and electrically connected to the bit line, a bit line selection line between the bit line and the bit line strapping line, and a selection semiconductor pattern between the bit line and the bit line strapping line and electrically connected to all of the bit line, the bit line strapping line, and the bit line selection line.
    Type: Application
    Filed: June 5, 2023
    Publication date: April 11, 2024
    Inventors: Jin Woo Han, Hyun Geun Choi, Ki Seok Lee, Seok Han Park
  • Publication number: 20240110010
    Abstract: The present invention relates to a method for producing a polyimide powder, particularly to a method for producing a polyimide powder, which includes a) preparing a dispersion by dispersing a dianhydride and a diamine in distilled water; and b) introducing the dispersion of step a) into a reactor and conducting the reaction at a stirring speed of 300 rpm or more under temperature and pressure conditions. In the present invention, it is possible to improve physical properties and control the particle size and dispersibility without additional processes by using water-based polymerization and controlling the stirring speed in the production process.
    Type: Application
    Filed: December 28, 2020
    Publication date: April 4, 2024
    Inventors: Ho Sung LEE, Ik Sang LEE, Jin Seok JEON
  • Patent number: 11945421
    Abstract: Disclosed is an electronic brake system that includes a master cylinder unit including a master cylinder to which a master cylinder reservoir coupled to generate a hydraulic pressure, a hydraulic block provided with a hydraulic pressure supply device to generate the hydraulic pressure by an electrical signal outputted in response to a displacement of a brake pedal and a hydraulic control unit to transmit the hydraulic pressure discharged from the hydraulic pressure supply device to wheel cylinders provided in each wheel, and disposed to be separated from the master cylinder unit, a hydraulic block reservoir coupled to the hydraulic block, and a connection hose to connect the master cylinder reservoir and the hydraulic block reservoir.
    Type: Grant
    Filed: January 30, 2023
    Date of Patent: April 2, 2024
    Assignee: HL MANDO CORPORATION
    Inventor: Jin Seok Lee
  • Patent number: 11947289
    Abstract: An example image forming apparatus includes a main body, a printing engine to be disposed in the main body to form an image on a printing medium, a fixing apparatus including a fixing roller and a fixing belt disposed to face the fixing roller, and a jam prevention apparatus including a fixed frame disposed adjacent to the fixing apparatus, and a movable apparatus to be detachably fastened to the fixed frame through a plurality of adjusting screws, to adjust a gap with the fixing belt according to a fastening direction of the plurality of adjusting screws.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: April 2, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jin Seok Lee, Bong Hee Lee, Jin Yoon Kim
  • Patent number: 11942635
    Abstract: The present invention relates to a positive electrode active material and a lithium secondary battery using a positive electrode containing the positive electrode active material. More particularly, the present invention relates to a positive electrode active material that is able to solve a problem of increased resistance according to an increase in Ni content by forming a charge transport channel in a lithium composite oxide and a lithium secondary battery using a positive electrode containing the positive electrode active material.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: March 26, 2024
    Assignee: ECOPRO BM CO., LTD.
    Inventors: Moon Ho Choi, Jun Won Suh, Jin Kyeong Yun, Jung Han Lee, Mi Hye Yun, Seung Woo Choi, Gwang Seok Choe, Ye Ri Jang, Joong Ho Bae
  • Publication number: 20240091767
    Abstract: A gene amplification chip includes a chamber layer, a cover layer, a bottom layer, an inlet, and an outlet. The chamber layer has a first passage and through holes which are formed on one side of the first passage. The cover layer is disposed on one side of the chamber layer and has a cover channel formed to communicate with the first passage and the through holes, wherein the cover channel, the first passage and the through holes allow passage of liquids in a divided manner. The bottom layer is disposed on another side of the chamber layer and has a bottom channel formed to communicate with the first passage and the through holes. The inlet is formed in the cover layer and communicates with the cover channel. The outlet communicates with any one of the cover channel and the bottom channel.
    Type: Application
    Filed: December 15, 2022
    Publication date: March 21, 2024
    Applicant: SAMSUNG ELECTRONICS CO, LTD.
    Inventors: Jae Hong LEE, Won Jong JUNG, Kak NAMKOONG, Hyeong Seok JANG, Jin Ha KIM, Hyung Jun YOUN
  • Patent number: 11935984
    Abstract: A quantum dot including a core that includes a first semiconductor nanocrystal including zinc and selenium, and optionally sulfur and/or tellurium, and a shell that includes a second semiconductor nanocrystal including zinc, and at least one of sulfur or selenium is disclosed. The quantum dot has an average particle diameter of greater than or equal to about 13 nm, an emission peak wavelength in a range of about 440 nm to about 470 nm, and a full width at half maximum (FWHM) of an emission wavelength of less than about 25 nm. A method for preparing the quantum dot, a quantum dot-polymer composite including the quantum dot, and an electronic device including the quantum dot is also disclosed.
    Type: Grant
    Filed: December 14, 2022
    Date of Patent: March 19, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Seok Han, Sung Woo Kim, Jin A Kim, Tae Hyung Kim, Kun Su Park, Yuho Won, Jeong Hee Lee, Eun Joo Jang, Hyo Sook Jang
  • Publication number: 20240076798
    Abstract: An ingot growth apparatus is disclosed. The ingot growth apparatus according to an embodiment of the present invention may comprise: a growth furnace having a main crucible which is disposed inside the growth furnace and in which molten silicon is held in order to grow an ingot; a susceptor formed to surround the outer surface of the main crucible and heating the main crucible; a heater formed to surround the outer surface of the susceptor and including a coil which is supplied with power to generate a magnetic field and heats the susceptor by electromagnetic induction from the magnetic field; and a heat insulation member disposed between the coil and the susceptor.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 7, 2024
    Applicants: HANWHA SOLUTIONS CORPORATION, HANWHA CORPORATION
    Inventors: Young Min LEE, Kyung Seok LEE, Jin Sung PARK, Dong Woo BAE
  • Publication number: 20240079529
    Abstract: A light-emitting element includes a first semiconductor layer, a light-emitting layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the light-emitting layer, a device electrode layer disposed on the second semiconductor layer, a reflective electrode layer disposed on the device electrode layer, an insulating film surrounding a side surface of the light-emitting layer, a side surface of the second semiconductor layer, and a side surface of the device electrode layer, and a reflective layer surrounding a side surface of the insulating film, wherein the side surface of the device electrode layer is aligned with a side surface of the reflective electrode layer.
    Type: Application
    Filed: April 10, 2023
    Publication date: March 7, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Ji Hyun HAM, Moon Jung AN, Jin Seok PARK, Hee Keun LEE, Sung Chan JO, Sang Wook HAN
  • Patent number: 11923562
    Abstract: A battery module includes: a battery cell assembly having a plurality of battery cells; a top plate configured to cover an upper side of the battery cell assembly; a bottom plate configured to cover a lower side of the battery cell assembly; a sensing assembly disposed to cover a front side and a rear side of the battery cell assembly; a pair of side plates disposed at side surfaces, respectively, of the battery cell assembly; and a pair of compression pads disposed between the pair of side plates and the battery cell assembly, respectively.
    Type: Grant
    Filed: November 1, 2022
    Date of Patent: March 5, 2024
    Assignee: LG Energy Solution, Ltd.
    Inventors: Sung-Won Seo, Dong Yeon Kim, Ho-June Chi, Dal-Mo Kang, Jin-Hak Kong, Jeong-O Mun, Yoon-Koo Lee, Yong-Seok Choi, Alexander Eichhorn, Andreas Track
  • Publication number: 20240043654
    Abstract: A resin composition for a semiconductor package according to an embodiment includes a resin composition that is a composite of a resin and a filler disposed in the resin, wherein the filler includes at least one concave portion provided on a surface, wherein a content of the filler has a range of 10 vol. % to 40 vol % of a total volume of the resin composition, and wherein a porosity corresponds to a volume occupied by the concave portion in a total volume of the filler and has a range of 20% to 35%.
    Type: Application
    Filed: August 17, 2021
    Publication date: February 8, 2024
    Inventors: Byeong Kyun CHOI, Min Young HWANG, Moo Seong KIM, Jin Seok LEE
  • Patent number: 11778741
    Abstract: A circuit board according to an embodiment includes an insulating layer; a circuit pattern disposed on an upper surface of the insulating layer; a first solder resist disposed on an upper surface of the insulating layer and having a height smaller than a height of the circuit pattern; and a second solder resist disposed on an upper surface of the first solder resist and including a first portion having an upper surface lower than an upper surface of the circuit pattern and a second portion having an upper surface higher than the upper surface of the circuit pattern, wherein the circuit pattern includes: a plurality of first circuit patterns disposed on an upper surface of a first region of the insulating layer, and a plurality of second circuit patterns disposed on an upper surface of a second region of the insulating layer; wherein the first portion of the second solder resist is disposed between the plurality of first circuit patterns to have an upper surface lower than an upper surface of the first circuit
    Type: Grant
    Filed: March 12, 2021
    Date of Patent: October 3, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yong Han Jeon, Jin Seok Lee, Tae Ki Kim
  • Publication number: 20230174038
    Abstract: Disclosed is an electronic brake system that includes a master cylinder unit including a master cylinder to which a master cylinder reservoir coupled to generate a hydraulic pressure, a hydraulic block provided with a hydraulic pressure supply device to generate the hydraulic pressure by an electrical signal outputted in response to a displacement of a brake pedal and a hydraulic control unit to transmit the hydraulic pressure discharged from the hydraulic pressure supply device to wheel cylinders provided in each wheel, and disposed to be separated from the master cylinder unit, a hydraulic block reservoir coupled to the hydraulic block, and a connection hose to connect the master cylinder reservoir and the hydraulic block reservoir.
    Type: Application
    Filed: January 30, 2023
    Publication date: June 8, 2023
    Inventor: Jin Seok LEE
  • Publication number: 20230113302
    Abstract: A circuit board according to an embodiment includes an insulating layer; a circuit pattern disposed on an upper surface of the insulating layer; a first solder resist disposed on an upper surface of the insulating layer and having a height smaller than a height of the circuit pattern; and a second solder resist disposed on an upper surface of the first solder resist and including a first portion having an upper surface lower than an upper surface of the circuit pattern and a second.
    Type: Application
    Filed: March 12, 2021
    Publication date: April 13, 2023
    Inventors: Yong Han JEON, Jin Seok LEE, Tae Ki KIM
  • Publication number: 20230086174
    Abstract: A semiconductor device includes first and second sheet patterns spaced apart from each other on a first region of the substrate, a first gate electrode extending between the first and second sheet patterns, third and fourth sheet patterns spaced apart from each other on a second region of the substrate, and a second gate electrode extending between the third and fourth sheet patterns. The first gate electrode includes a first work function controlling film, which is between the first and second sheet patterns, and a first filling conductive film on the first work function controlling film. The second gate electrode includes a second work function controlling film, which is between the third and fourth sheet patterns, and a second filling conductive film on the second work function controlling film. A distance between the third and fourth sheet patterns is greater than a distance between the first and second sheet patterns.
    Type: Application
    Filed: June 29, 2022
    Publication date: March 23, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jun Mo PARK, Yeon Ho PARK, Eun Sil PARK, Jin Seok LEE, Wang Seop LIM, Kyu Bong CHOI
  • Publication number: 20230040132
    Abstract: A method of manufacturing a semiconductor device includes: forming first to third preliminary active patterns on a substrate to have different intervals therebetween, forming first and second field insulating layers between the first and second preliminary active patterns and between the second and third preliminary active patterns, respectively, and forming first to third gate electrodes respectively on first to third active patterns formed based on the first to third preliminary active patterns, separated by first and second gate isolation structures.
    Type: Application
    Filed: May 11, 2022
    Publication date: February 9, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun Mo PARK, Kyu Bong CHOI, Yeon Ho PARK, Eun Sil PARK, Jin Seok LEE, Wang Seop LIM, Kyung In CHOI
  • Publication number: 20230044328
    Abstract: An example image forming apparatus includes a main body, a printing engine to be disposed in the main body to form an image on a printing medium, a fixing apparatus including a fixing roller and a fixing belt disposed to face the fixing roller, and a jam prevention apparatus including a fixed frame disposed adjacent to the fixing apparatus, and a movable apparatus to be detachably fastened to the fixed frame through a plurality of adjusting screws, to adjust a gap with the fixing belt according to a fastening direction of the plurality of adjusting screws.
    Type: Application
    Filed: December 30, 2020
    Publication date: February 9, 2023
    Inventors: Jin Seok LEE, Bong Hee LEE, Jin Yoon KIM
  • Patent number: 11565676
    Abstract: Disclosed is an electronic brake system that includes a master cylinder unit including a master cylinder to which a master cylinder reservoir coupled to generate a hydraulic pressure, a hydraulic block provided with a hydraulic pressure supply device to generate the hydraulic pressure by an electrical signal outputted in response to a displacement of a brake pedal and a hydraulic control unit to transmit the hydraulic pressure discharged from the hydraulic pressure supply device to wheel cylinders provided in each wheel, and disposed to be separated from the master cylinder unit, a hydraulic block reservoir coupled to the hydraulic block, and a connection hose to connect the master cylinder reservoir and the hydraulic block reservoir.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: January 31, 2023
    Assignee: HL MANDO CORPORATION
    Inventor: Jin Seok Lee
  • Patent number: 11557938
    Abstract: A motor unit for a sunroof is proposed. The motor unit may include a lower housing, an upper housing, a bush, a worm wheel, a drive shaft, a pinion gear, the washer, and a bottom cover. Particularly, contact between the drive shaft and the bottom cover may be prevented, and the worm wheel may be configured to be in contact with the washer and he bush. Accordingly, different kinds of noise may be prevented from being generated according to opening and closing directions of the sunroof.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: January 17, 2023
    Assignee: KEYANG ELECTRIC MACHINERY CO., LTD.
    Inventors: Seong Soo Kim, Seung Tae Yun, Jin Seok Lee
  • Patent number: RE49923
    Abstract: A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on an external surface of the ceramic body, wherein the dielectric layer contains a barium titanate-based powder particle having a core-shell structure including a core and a shell around the core, the shell having a structure in which titanium is partially substituted with an element having the same oxidation number as that of the titanium in the barium titanate-based powder particle and having an ionic radius different from that of the titanium in the barium titanate-based powder particle, and the shell covers at least 30% of a surface of the core.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Jong Ho Lee, Min Gi Sin, Hak Kwan Kim, Chin Mo Kim, Chi Hwa Lee, Hong Seok Kim, Woo Sup Kim, Chang Hwa Park