Abstract: A semiconductor memory device includes a substrate including an element separation film and an active region defined by the element separation film, a bit line structure on the substrate, a trench in the element separation film and the active region, the trench on at least one side of the bit line structure and including a first portion in the element separation film and a second portion in the active region, a bottom face of the first portion placed above a bottom face of the second portion, a single crystal storage contact filling the trench, and an information storage element electrically connected to the single crystal storage contact.

Abstract: An apparatus for estimating bio-information includes: a sensor including one or more light sources configured to emit light to an object and a plurality of detectors configured to detect light reflected from the object; and a processor configured to transform a plurality of light quantities obtained from respective detectors of the plurality of detectors to a distance domain, to combine the plurality of transformed light quantities in the distance domain, to correct the combined light quantity based on a reference light quantity for correcting a deviation of a distance between the one or more light sources and the plurality of detectors, and to estimate bio-information based on a light quantity resulting from the correction.

Abstract: The present invention relates to a novel probiotic composition for regulation of intestinal immunity and, more specifically, to a composition including Lactobacillus johnsonii, Lactobacillus plantarum, and Bifidobacterium animalis subspecies lactis as active ingredients for suppressing inflammation and/or preventing, ameliorating, or treating inflammatory bowel diseases.

Abstract: Disclosed herein are a resin composition of a printed circuit board including a liquid crystal oligomer, an epoxy resin, and a phenolic curing agent having five or more functional groups, an insulating film and a prepreg manufactured using the resin composition, and a printed circuit board including the insulating film or the prepreg. The resin composition for a printed circuit board according to the present invention, and the insulating film and the prepreg manufactured using the same, may have low coefficient of thermal expansion, excellent heat resistance property, and a high glass transition temperature.

Abstract: A resin composition for a printed circuit board and a printed circuit board formed of the same. The resin composition for a printed circuit board may have: a liquid crystal oligomer including a structural unit of the Chemical Formula 1 and a structural unit of the Chemical Formula 2 and including a functional group of the Chemical Formula E on at least one end; and an ether-type naphthalene-based epoxy resin of Chemical Formula N. According to an exemplary embodiment, even though a printed circuit board becomes light, thin, and miniaturized, electric, thermal, and mechanical stability of the printed circuit board may be secured.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the same. More specifically, the insulating resin composition contains an eucryptite inorganic filler having a negative coefficient of thermal expansion, such that a glass transition temperature and a coefficient of thermal expansion may be improved, and warpage of the insulating film, the prepreg, the copper clad laminate, or the printed circuit board manufactured by using the insulating resin composition for a printed circuit board may be minimized.

Abstract: Disclosed herein are a carrier and a method of manufacturing a printed circuit board using the same. More specifically, in the carrier according to the present invention, the carrier has characteristics of a coefficient of thermal expansion (CTE), a glass transition temperature (Tg), and a storage modulus which are improved by an insulating layer including an epoxy resin and a liquid crystal oligomer. In addition, a first metal layer is formed on the insulating layer, such that the printed circuit board stacked on one surface or both surfaces of the carrier may be protected from deformation by physical impact and the warpage phenomenon may be minimized.

Abstract: Disclosed herein are a prepreg for a printed circuit board, a manufacturing method thereof, and a printed circuit board including the same. More particularly, the manufacturing method of a prepreg for a printed circuit board includes: coating an insulating composition on each of the two carrier films to form an insulating layer and drying the coated insulating composition to form first and second carrier substrates; disposing glass fiber between the insulating layers of the first and second carrier substrates and bonding the first and second carrier substrates to each other to form a laminated substrate; pressing the laminated substrate; and removing the carrier film from the laminated substrate subjected to the pressing. The prepreg may be manufactured so as to have the desired thickness or maintain a uniform thickness, such that thickness quality may be stabilized, and a coefficient of thermal expansion property may be improved.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including an amino triazine novolac curing agent having an amino group and a hydroxyl group to have improved coefficient of thermal expansion and glass transition temperature properties, and improved acid resistant property that discoloration of the product is not generated, and an insulating film and a prepreg as products manufactured by using the same.

Abstract: Disclosed herein are a copper clad laminate for a printed circuit board, in which a composite having a glass fibers formed on both sides of a prepreg is disposed between a resin layer of a first resin-coated copper foil (RCC) and a resin layer of a second resin-coated copper foil and having a structure in which the resin layers are symmetric or asymmetric based on the composite, and a manufacturing method thereof. A thickness of the copper clad laminate may be manufactured at the desired thickness or the thickness may be uniformly maintained, such that stabilization of thickness quality may be implemented, the adhesion between the copper foil and the resin may be improved, and warpage may be adjusted when laminating substrates having different upper and lower thermal expansion coefficients.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including a 4-functional naphthalene-based epoxy resin and having improved coefficient of thermal expansion and glass transition temperature properties, and a prepreg and a printed circuit board as products manufactured by using the same.

Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board. More specifically, disclosed herein are an insulating resin composition for a printed circuit board including a maleimide resin having three or more maleimide groups, and the like so that a glass transition temperature and a mechanical strength are improved, an insulating film and a prepreg prepared using the insulating resin composition, and a printed circuit board including the insulating film or the prepreg.

Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.

Abstract: Disclosed herein are a resin composition of a printed circuit board including a liquid crystal oligomer, an epoxy resin, and a phenolic curing agent having five or more functional groups, an insulating film and a prepreg manufactured using the resin composition, and a printed circuit board including the insulating film or the prepreg. The resin composition for a printed circuit board according to the present invention, and the insulating film and the prepreg manufactured using the same, may have low coefficient of thermal expansion, excellent heat resistance property, and a high glass transition temperature.

Abstract: Disclosed herein are a method for manufacturing a copper-clad laminate (CCL) for a printed circuit board, a CCL manufactured by the method, and a printed circuit board having the CCL applied thereto, the method including: forming a first resin coated copper foil (first RCC foil) and a second resin coated copper foil (second RCC foil) by coating an insulating composition on one surface of each of two copper foils to form insulating layers, respectively, followed by drying of the first and second RCC foils; forming a copper-clad laminate (CCL) by laminating and pressing the first RCC foil and the second RCC foil while the insulating layers of the first and second RCC foils face each other and a glass fiber is placed therebetween; and hardening the copper-clad laminate.

Abstract: Disclosed herein is a prepreg including: a reinforcement substrate; and a polymer resin layer formed by impregnating a polymer resin containing a liquid crystal oligomer and an inorganic filler on the reinforcement substrate, wherein an impregnation ratio of the polymer resin is 60 to 85 wt., whereby a product manufactured by using the prepreg may have excellent coefficient of thermal expansion and thermal properties.

Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.

Abstract: The present invention relates to a resin composition for a package substrate and a package substrate comprising a core layer and a prepreg using the same, which include a polyester amide liquid crystal oligomer, a bisphenol tetrafunctional epoxy resin, a curing agent, and an inorganic filler, wherein the bisphenol tetrafunctional epoxy resin has a viscosity of greater than 20,000 cps. According to the resin composition for a package substrate in accordance with the present invention can provide a package substrate with reduced substrate warpage by improving heat radiation characteristics of a substrate material. Further, it is possible to improve defects by reducing delamination between a chip and the substrate or occurrence of cracks of solder balls through the reduced substrate warpage characteristics.

Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition including a liquid crystal oligomer having a low coefficient of thermal expansion and an improved glass transition temperature, and the like.

Abstract: There is provided a resin composition for a thermal radiation board including: 20 wt % to 50 wt % of a liquid crystal oligomer represented by particular Chemical Formulas; 10 wt % to 40 wt % of an epoxy resin; and 10 wt % to 40 wt % of an inorganic filter.