Patents by Inventor Jin Sik Kim

Jin Sik Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250115170
    Abstract: A vehicle seat position adjustment device is configured to stably perform a tilting operation of a seat cushion by performing an operation of rotating a first tilting link hinged to a gear box in a standing direction of a first tilting link while the gear box is moved rearwards along a lead screw, an operation of pushing up a second tilting link hinged to the first tilting link while the first tilting link is rotated in a standing direction, and an operation of allowing the second tilting link to push up a front end of a seat cushion frame. The vehicle seat position adjustment device may achieve a relaxation comfort posture by tilting the seat cushion and simultaneously reclining a seatback connected to the seat cushion rearwards.
    Type: Application
    Filed: January 11, 2024
    Publication date: April 10, 2025
    Inventors: Sang Soo Lee, Ho Suk Jung, Deok Soo Lim, Sang Do Park, Chan Ho Jung, Mu Young Kim, Jin Sik Kim, Youn Myung Joo, Dong Gyu Shin, Taek Jun Nam, Gun Chu Park
  • Publication number: 20250115171
    Abstract: A device for adjusting a position of a vehicle seat has a structure in which two or more adjustment devices, such as lead screws for adjusting tilting, are connected to the opposite side portions of a seat cushion frame to allow the lead screws to rotate by two gearboxes connected to one motor, so that a seat cushion is stably tilted by the two or more lead screws and the opposite side portions of the seat cushion frame is stably supported by the two or more lead screws, in order to prevent shaking, vibration, and torsional deformation caused by a gap generated when tilting the seat cushion frame.
    Type: Application
    Filed: January 11, 2024
    Publication date: April 10, 2025
    Inventors: Sang Soo Lee, Ho Suk Jung, Deok Soo Lim, Sang Do Park, Chan Ho Jung, Mu Young Kim, Jin Sik Kim, Youn Myung Joo, Dong Gyu Shin, Taek Jun Nam, Gun Chu Park
  • Publication number: 20250109496
    Abstract: A film depositing composition including a Group 4 metal element-containing precursor compound and a method for forming a Group 4 metal element-containing film using same is described. The use of the film depositing composition including a Group 4 metal element-containing precursor compound achieves self-limiting film growth of ALD over a wide temperature range from low to high temperatures, enabling the formation of a Group 4 metal element-containing film for various purposes at various process temperatures. Particularly, according to the method for forming a Group 4 metal element-containing film of this invention, the growth per cycle (GPC) of ALD is consistent over a broad temperature range, thus making it possible to form a Group 4 metal element-containing film of uniform thickness even on surfaces with large aspect ratio trenches. Thus, the method can be advantageously utilized in manufacturing various semiconductor devices, such as DRAM, 3D NAND flash memory, and the like.
    Type: Application
    Filed: May 11, 2023
    Publication date: April 3, 2025
    Inventors: Byung Kwan KIM, Jin Sik KIM, Myeong Ho PARK, Sung Woo AHN, Da Som YU, Jun Hwan CHOI
  • Publication number: 20250066405
    Abstract: The present invention relates to a molybdenum precursor compound, a composition for forming a molybdenum-containing film comprising same, a molybdenum-containing film formed by using same, and a method for depositing the molybdenum-containing film. The molybdenum precursor compound has a single structure and high purity, and thus can form a high-quality molybdenum-containing film, and has excellent thermal stability and low specific resistance, and thus may have various applications in the semiconductor field. In particular, since the molybdenum precursor compound can form a film having excellent coating properties and uniformity even on a substrate having patterns (grooves) on the surface, a porous substrate, a plastic substrate, or a substrate having a complex shape, a high-quality molybdenum-containing film can be easily realized.
    Type: Application
    Filed: December 23, 2022
    Publication date: February 27, 2025
    Inventors: Myeong Ho KIM, Jin Sik KIM, Jun Hwan CHOI
  • Patent number: 12221022
    Abstract: Provided is a duct docking device for a ventilation seat of a vehicle. The duct docking device enables air to be easily blown to a seatback and a seat cushion with a passenger in a seat using only one blower by enabling a seatback duct mounted at the seatback and a seat cushion duct mounted at the seat cushion to be hermetically docked through a connector duct, etc. at an unfolded position of the seatback in which a passenger can sit, and by enabling the seatback duct mounted at the seatback and the seat cushion duct mounted at the seat cushion to be separated from each other at a folded position of the seatback in consideration of that there is no passenger in the seat.
    Type: Grant
    Filed: December 21, 2022
    Date of Patent: February 11, 2025
    Assignees: Hyundai Motor Company, Kia Corporation, Hyundai Transys Inc.
    Inventors: Deok Soo Lim, Sang Hark Lee, Sang Soo Lee, Jung Sang You, Sang Do Park, Chan Ho Jung, Gun Chu Park, Gi Tae Jo, Jin Sik Kim, Hee Dong Yoon, Ho Sub Lim, Jae Hyun Park
  • Publication number: 20240383927
    Abstract: A silicon precursor compound, a preparation method therefor, a silicon-containing film formation composition containing the silicon precursor compound are disclosed. A method for forming a silicon-containing film by using the silicon-containing film formation composition is also disclosed. The silicon-containing film formation composition contains a silicon precursor compound having a specific structure so that the thickness of a silicon-containing film can be controlled to be very thin through atomic layer deposition (ALD), and, when a silicon-containing composite film is formed by combining an ALD cycle that forms a silicon-containing film and an ALD cycle that forms a film containing another metal, the silicon amount of the silicon-containing composite film can be finely controlled to be in a low range.
    Type: Application
    Filed: July 13, 2022
    Publication date: November 21, 2024
    Applicant: UP CHEMICAL CO., LTD.
    Inventors: Byung Kwan KIM, Jin Sik KIM, Da Som YU
  • Publication number: 20240376599
    Abstract: A silicon precursor compound, a composition for forming a silicon-containing film, wherein the composition contains the compound; and a method for forming a silicon-containing film by using the composition for forming a silicon-containing film are disclosed. The composition for forming a silicon-containing film includes a silicon precursor compound having a specific structure, thus making it possible to achieve the self-limiting film growth of ALD over a wide temperature range of 150° C. to 850° C., control the thickness of the silicon-containing film to be extremely thin and uniform, and form a film having excellent coverage and uniformity even on a substrate having a complex shape, and furthermore, further improve the characteristics of a semiconductor device.
    Type: Application
    Filed: July 13, 2022
    Publication date: November 14, 2024
    Applicant: UP CHEMICAL CO., LTD.
    Inventors: Byung Kwan KIM, Jin SiK KIM, Da Som YU
  • Publication number: 20240318305
    Abstract: A method for forming a silicon-containing film and a silicon-containing film formed by the method are disclosed. The method for forming a silicon-containing film can use a composition for forming a silicon-containing film including a silicon precursor compound having a specific structure to efficiently form a silicon-containing film including a silicon-containing oxide film or a silicon-containing composite metal oxide film at a high temperature of 600° C. or more, control the silicon-containing film to have a thickness and composition of a desired film, and form a silicon-containing film having excellent coverage and uniformity even on a substrate with a complex shape.
    Type: Application
    Filed: July 21, 2022
    Publication date: September 26, 2024
    Applicant: UP CHEMICAL CO., LTD.
    Inventors: Byung Kwan KIM, Jin Sik KIM, Da Som YU
  • Publication number: 20240067065
    Abstract: Provided is a duct docking device for a ventilation seat of a vehicle. The duct docking device enables air to be easily blown to a seatback and a seat cushion with a passenger in a seat using only one blower by enabling a seatback duct mounted at the seatback and a seat cushion duct mounted at the seat cushion to be hermetically docked through a connector duct, etc. at an unfolded position of the seatback in which a passenger can sit, and by enabling the seatback duct mounted at the seatback and the seat cushion duct mounted at the seat cushion to be separated from each other at a folded position of the seatback in consideration of that there is no passenger in the seat.
    Type: Application
    Filed: December 21, 2022
    Publication date: February 29, 2024
    Inventors: Deok Soo Lim, Sang Hark Lee, Sang Soo Lee, Jung Sang You, Sang Do Park, Chan Ho Jung, Gun Chu Park, Gi Tae Jo, Jin Sik Kim, Hee Dong Yoon, Ho Sub Lim, Jae Hyun Park
  • Patent number: 11905305
    Abstract: The present application relates to a silicon precursor compound, a method for preparing the silicon precursor compound, a precursor composition for depositing a silicon-containing oxide thin film or nitride thin film, the precursor composition comprising the silicon precursor compound, and a method for depositing a silicon-containing oxide thin film or nitride thin film using the precursor composition.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: February 20, 2024
    Assignee: UP CHEMICAL CO., LTD.
    Inventors: Jin Sik Kim, Myeong Ho Kim, Mi Hee Lee, Byung Kwan Kim, Jun Hwan Choi, Sungwoo Ahn, Yun Gyeong Yi
  • Publication number: 20230383405
    Abstract: The present disclosure relates to a hafnium precursor compound, a precursor composition for forming hafnium-containing film including the hafnium precursor compound and a method of forming a hafnium-containing film using the precursor composition.
    Type: Application
    Filed: August 4, 2023
    Publication date: November 30, 2023
    Inventors: Wonyong KOH, Jin Sik KIM, Byung Kwan KIM, Da Som YU, Jun Hwan CHOI
  • Publication number: 20230242560
    Abstract: The present application relates to: a ruthenium precursor compound for forming a film having high thermal stability; a precursor composition for forming a film, comprising the ruthenium precursor compound; and a method for forming a ruthenium-containing film using the precursor for forming a film.
    Type: Application
    Filed: April 11, 2023
    Publication date: August 3, 2023
    Inventors: Wonyong KOH, Jin Sik KIM, Dae-Young KIM
  • Patent number: 11592415
    Abstract: The present invention relates to an interdigitated microelectrode biosensor using the reaction between receptors and target biomaterials, the interdigitated microelectrode biosensor comprising: an insulating layer formed so as to cover all of the sensor formation area of a substrate; a first interdigitated microelectrode formed such that a plurality of first protruding electrodes are arranged in a comb shape on the insulating layer of the substrate; a second interdigitated microelectrode, facing the first interdigitated microelectrode and formed such that a plurality of second protruding electrodes are arranged in a comb shape on the insulating layer of the substrate such that the plurality of second protruding electrodes are arranged to respectively interdigitate with the plurality of first protruding electrodes formed at the first interdigitated microelectrode; and a plurality of receptors arranged in the space between the first and second interdigitated microelectrodes, which are arranged to interdigitate
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: February 28, 2023
    Assignee: Korea Institute of Science and Technology
    Inventors: Kyo Seon Hwang, Young Soo Kim, Jin Sik Kim, Yong Kyoung Yoo
  • Publication number: 20230019365
    Abstract: The present disclosure relates to an aluminum compound, an aluminum-containing film-forming precursor composition including the aluminum compound, and a method of preparing an aluminum-containing film using the aluminum-containing film-forming precursor composition.
    Type: Application
    Filed: August 24, 2022
    Publication date: January 19, 2023
    Inventors: Jin Sik KIM, Myeong Ho KIM, Dae-Young KIM, Jun Hwan CHOI, In Jae LEE
  • Publication number: 20220396592
    Abstract: The present disclosure relates to a silicon precursor compound, a method of preparing the silicon precursor compound, a silicon-containing film-forming precursor composition including the silicon precursor compound, and a method of forming a silicon-containing film using the precursor compound.
    Type: Application
    Filed: July 29, 2022
    Publication date: December 15, 2022
    Inventors: Jin Sik KIM, Byung Kwan KIM, Jun Hwan CHOI, Da Som YU
  • Publication number: 20220325411
    Abstract: The present disclosure relates to an yttrium/lanthanide metal precursor compound, a precursor composition for depositing an yttrium/lanthanide metal-containing film including the yttrium/lanthanide metal precursor compound, and a method of depositing the yttrium/lanthanide metal-containing film using the precursor composition.
    Type: Application
    Filed: June 24, 2022
    Publication date: October 13, 2022
    Inventors: Jin Sik KIM, Myeong-Ho PARK, Dong Hwan MA, Yun Gyeong YI, Jun Hwan CHOI
  • Publication number: 20210269463
    Abstract: The present application relates to a silicon precursor compound, a method for preparing the silicon precursor compound, a precursor composition for depositing a silicon-containing oxide thin film or nitride thin film, the precursor composition comprising the silicon precursor compound, and a method for depositing a silicon-containing oxide thin film or nitride thin film using the precursor composition.
    Type: Application
    Filed: May 14, 2021
    Publication date: September 2, 2021
    Inventors: Jin Sik KIM, Myeong Ho KIM, Mi Hee LEE, Byung Kwan KIM, Jun Hwan CHOI, Sungwoo AHN, Yun Gyeong YI
  • Patent number: 10814757
    Abstract: A seatback frame for vehicles is disclosed. The seatback frame for vehicles has a simple structure without bracket structures used to install a conventional seatback frame and thus achieves cost reduction and weight reduction. In particular, the seatback frame is segmented into several parts having different rigidities so that only a part, on which load is concentrated, is set to have high strength and thus avoids overdesign for excessively high strength of an unnecessary part.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: October 27, 2020
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION, HYUNDAI TRANSYS INC., DAYOU HOLDINGS CO., LTD.
    Inventors: Suk Won Hong, Gil Ju Kim, Jong Seok Han, Seon Chae Na, Chan Ho Jung, Jin Sik Kim, Woo Suk Choi
  • Publication number: 20200171990
    Abstract: A seatback frame for vehicles is disclosed. The seatback frame for vehicles has a simple structure without bracket structures used to install a conventional seatback frame and thus achieves cost reduction and weight reduction. In particular, the seatback frame is segmented into several parts having different rigidities so that only a part, on which load is concentrated, is set to have high strength and thus avoids overdesign for excessively high strength of an unnecessary part.
    Type: Application
    Filed: April 24, 2019
    Publication date: June 4, 2020
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION, HYUNDAI TRANSYS INC., DAYOU HOLDINGS CO., LTD.
    Inventors: Suk Won HONG, Gil Ju KIM, Jong Seok HAN, Seon Chae NA, Chan Ho JUNG, Jin Sik KIM, Woo Suk CHOI
  • Publication number: 20190025241
    Abstract: The present invention relates to an interdigitated microelectrode biosensor using the reaction between receptors and target biomaterials, the interdigitated microelectrode biosensor comprising: an insulating layer formed so as to cover all of the sensor formation area of a substrate; a first interdigitated microelectrode formed such that a plurality of first protruding electrodes are arranged in a comb shape on the insulating layer of the substrate; a second interdigitated microelectrode, facing the first interdigitated microelectrode and formed such that a plurality of second protruding electrodes are arranged in a comb shape on the insulating layer of the substrate such that the plurality of second protruding electrodes are arranged to respectively interdigitate with the plurality of first protruding electrodes formed at the first interdigitated microelectrode; and a plurality of receptors arranged in the space between the first and second interdigitated microelectrodes, which are arranged to interdigitate
    Type: Application
    Filed: October 20, 2016
    Publication date: January 24, 2019
    Applicant: Korea Institute of Science and Technology
    Inventors: Kyo Seon HWANG, Young Soo KIM, Jin Sik KIM, Yong Kyoung YOO