Patents by Inventor Jin Song Feng

Jin Song Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7430121
    Abstract: A heat sink fastener includes a main body, a piercing body and an operating member. The main body has a pressing part for pressing a heat sink toward a heat-generating component. An engaging part and a latching leg are disposed at opposite ends of the main body. The piercing body includes a piercing part piercing through the engaging part, and a latching part below the piercing part. The operating member includes a cam pivotally connected to the piercing part and rotatable between locked and unlocked positions. At the locked position, a protrusion formed on the cam abuts a lateral edge of the piercing part to prevent the operating member from spontaneously rotating back to the unlocked position. A bent flange is formed at a periphery of the cam and engages with the engaging part.
    Type: Grant
    Filed: September 7, 2006
    Date of Patent: September 30, 2008
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cui-Jun Lu, Jin-Song Feng
  • Publication number: 20080232068
    Abstract: A heat dissipation device includes a heat sink and a fixing base for securing the heat sink to a heat-generating device. The heat sink includes a base and a pair of flanges formed on two opposite sides of the base. The fixing base includes a pair of side plates formed on a first set of two opposite sides thereof. A pair of resilient barbs extends inwards from an end portion of each side plate. The fixing base is placed on the heat sink and the resilient barbs tightly clasp first two opposite sides of the heat-generating device to press the base of the heat sink towards the heat-generating device. The flanges of the base of the heat sink abut second two opposite sides of the heat-generating device to avoid movement of the heat sink along a direction perpendicular to the flanges.
    Type: Application
    Filed: March 22, 2007
    Publication date: September 25, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: JIE LIU, CHUN-JIANG SHUAI, JIN-SONG FENG
  • Publication number: 20080174968
    Abstract: A heat dissipation device includes a heat sink, a retention module and a locking device for securing the heat sink to the retention module. The heat sink includes a base for contacting with a heat-generating component. The retention module includes a bottom wall and a first spring clip secured at one side thereof. The locking device is pivotably connected to the retention module and includes a second spring clip attached thereon. The heat sink rests on the bottom wall of the retention module with an end thereof being pressed by the first spring clip, and an opposite end thereof being pressed by the second spring clip. The locking device can be at a released position where the locking device is pivotable, so that the heat sink is removable from the retention module, and a locked position where the locking device presses the base of the heat sink.
    Type: Application
    Filed: January 24, 2007
    Publication date: July 24, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: JIN-SONG FENG, SONG-SHUI LIU
  • Patent number: 7277281
    Abstract: A heat dissipation device is for use in a computer enclosure, the computer enclosure having a group of wires (20) therein. The heat dissipation device includes a heat sink assembly. A wire fixture (60) is mounted on the heat sink assembly and configured for fixing the wires thereto. The wire fixture includes a mounting plate (62) positioned on the heat sink assembly. A bridge (624) projects from the mounting plate to form a receiving room (625) below the bridge. The wires are securely bound together via the wire fixture so as not to be loosened by vibration.
    Type: Grant
    Filed: May 12, 2006
    Date of Patent: October 2, 2007
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cui-Jun Lu, Jin-Song Feng, Qiao Chen
  • Publication number: 20070195507
    Abstract: A heat sink fastener includes a main body, a piercing body and an operating member. The main body has a pressing part for pressing a heat sink toward a heat-generating component. An engaging part and a latching leg are disposed at opposite ends of the main body. The piercing body includes a piercing part piercing through the engaging part, and a latching part below the piercing part. The operating member includes a cam pivotally connected to the piercing part and rotatable between locked and unlocked positions. At the locked position, a protrusion formed on the cam abuts a lateral edge of the piercing part to prevent the operating member from spontaneously rotating back to the unlocked position. A bent flange is formed at a periphery of the cam and engages with the engaging part.
    Type: Application
    Filed: September 7, 2006
    Publication date: August 23, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Cui-Jun Lu, Jin-Song Feng
  • Publication number: 20070089862
    Abstract: A heat dissipation device includes a computer enclosure having a panel, a heat sink installed in the computer enclosure, a fan mounted on the heat sink, a duct and a dust mask. The panel defines an air intake therein. The duct includes a first end portion mounted onto the fan and a second end portion connected to the air intake of the panel so that a sealed access is provided for air straightly flowing from the air intake to the heat sink. The dust mask is removably mounted on the panel and covers the air intake for hindering dust particles from entering the computer enclosure.
    Type: Application
    Filed: October 20, 2005
    Publication date: April 26, 2007
    Inventors: Cui-Jun Lu, Jin-Song Feng
  • Patent number: 7167370
    Abstract: A fastener (10) for mounting a heat-radiator (20) to an electronic device (30) on a circuit board (40) is disclosed. The heat-radiator and the circuit board have aligned holes (22, 44). The fastener includes a head (11) having an upper portion (112) with a large diameter and a lower portion (113) with a smaller diameter, a cylindrical spring (14) captured around the lower portion of the head for exerting a spring force against the heat-radiator, and a metallic wire (15) having a first end portion fixed on said head and a second end portion bent to form an engaging portion (152). The engaging portion of the metallic wire compressively passes through the aligned holes of the heat-radiator and the circuit board and is engaged with an underside of the circuit board.
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: January 23, 2007
    Assignees: Fu Zhun Precision Ind (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh Kun Lee, Wan-Lin Xia, Xue-Wen Peng, Jin-Song Feng
  • Patent number: 7142430
    Abstract: A heat dissipating device assembly for an electronic components (70), includes a heat sink (10) for contacting the electronic component, and a locking device (20) and a back plate unit (40) for cooperatively mounting the heat sink to the electronic component. The locking device includes a retention module (28) located around the electronic component for supporting the heat sink thereon, and a clip (30) pivotably attached to the retention module. The clip includes a pressing portion and a pushing portion. The clip is pivotable between a first position in which the clip presses the heat sink toward the electronic component and a second position in which the clip pushes the heat sink in a direction away from the electronic component.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: November 28, 2006
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh-Kun Lee, Wan-Lin Xia, Bao-Chun Chen, Bo-Yong Yang, Jin-Song Feng, Tao Li
  • Patent number: 7126824
    Abstract: A heat dissipation device assembly includes a heat sink (20) placed on an electronic component (52) which is mounted on a printed circuit board (PCB) (50) and including a pair of shoulders (23) on opposite sides thereof, a pressing part (30) including a pair of pressing portions (36) supported on the shoulders and a pair of locking portions (34) spaced from the shoulders, a sliding part (40) slidably attached to the pressing part and including a pair of locking portions (41) spaced from the shoulder, and a back plate (60) mounted below the PCB and including four posts (61) extending through the PCB and the heat sink to resilently engage with the locking portions. Each locking portion defines a locking opening (33, 43) including an entrance (33a, 43a) and a locking slot (33b, 43b), the post being capable of extending through the entrance to engage in the locking slot.
    Type: Grant
    Filed: July 27, 2004
    Date of Patent: October 24, 2006
    Assignees: Fu Zhun Precision Industrial (Shenzhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hsieh Kun Lee, Wanlin Xia, Jin Song Feng
  • Patent number: 6977816
    Abstract: A heat sink mounting assembly includes a socket (90) having first and second side, a retaining clip (10) cooperating with the socket to sandwich a heat sink (70) therebetween. A pair of ears (92) is formed at the first and second sides of the socket. The retaining clip includes a pressing body (11) having first and second ends, a first leg (14) extending from the first end thereof and engaging with one ear, a spring (50) attached to the pressing body, and a second leg (30) attached to the second end thereof and biased by the spring. When the second leg is pressed down toward the socket, the spring biases the second leg upwardly, so that the second leg is resiliently engaged with the other ear. Thus, the heat sink is secured between the socket and the retaining clip.
    Type: Grant
    Filed: May 17, 2004
    Date of Patent: December 20, 2005
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsieh Kun Lee, WanLin Xia, Tao Li, Jin Song Feng
  • Patent number: 6962192
    Abstract: A heat dissipation assembly includes a printed circuit board (70) with a heat-generating device (74) mounted thereon, a heat sink (60) mounted on the heat-generating device for dissipating heat therefrom, a retaining device (1) and a locating member (50). The retaining device includes a pair of spaced pressing portions (14) pressing on the heat sink, and a pair of pivot portions (34) pivotally engaged with the pressing portions respectively. The locating member includes a baseplate (52) located at an underside of the printed circuit board, and four pins (54) extending from the baseplate. The pins pass through the printed circuit board and the heat sink. Two of the pins are engaged by the pressing portions, and the other two pins are engaged by the pivot portions when the pivot portions are pivotally moved toward the printed circuit board.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: November 8, 2005
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsieh Kun Lee, Tao Li, Jin Song Feng
  • Publication number: 20050128714
    Abstract: A fastener (10) for mounting a heat-radiator (20) to an electronic device (30) on a circuit board (40) is disclosed. The heat-radiator and the circuit board have aligned holes (22, 44). The fastener includes a head (11) having an upper portion (112) with a large diameter and a lower portion (113) with a smaller diameter, a cylindrical spring (14) captured around the lower portion of the head for exerting a spring force against the heat-radiator, and a metallic wire (15) having a first end portion fixed on said head and a second end portion bent to form an engaging portion (152). The engaging portion of the metallic wire compressively passes through the aligned holes of the heat-radiator and the circuit board and is engaged with an underside of the circuit board.
    Type: Application
    Filed: September 23, 2004
    Publication date: June 16, 2005
    Inventors: Hsieh Lee, Wan-Lin Xia, Xue-Wen Peng, Jin-Song Feng
  • Publication number: 20050117306
    Abstract: A heat dissipating device assembly for an electronic components (70), includes a heat sink (10) for contacting the electronic component, and a locking device (20) and a back plate unit (40) for cooperatively mounting the heat sink to the electronic component. The locking device includes a retention module (28) located around the electronic component for supporting the heat sink thereon, and a clip (30) pivotably attached to the retention module. The clip includes a pressing portion and a pushing portion. The clip is pivotable between a first position in which the clip presses the heat sink toward the electronic component and a second position in which the clip pushes the heat sink in a direction away from the electronic component.
    Type: Application
    Filed: September 29, 2004
    Publication date: June 2, 2005
    Applicant: HON HAI Precision Industry CO., LTD.
    Inventors: Hsieh-Kun Lee, Wan-Lin Xia, Bao-Chun Chen, Bo-Yong Yang, Jin-Song Feng, Tao Li
  • Patent number: 6871698
    Abstract: A heat dissipation device (30) includes a base (50) and a plurality of individual fin plates (40) standing side by side on the base. Each fin plate includes a main body (41), a flange (43) and a pair of tabs (45) distal from the flange. Each tab defines a split (46) in a middle thereof where it adjoins the corresponding main body and thereby forms a tongue (47) surrounded on three sides by the split. The tongue is coplanar with the main body while the flange and the tabs are perpendicular to the main body. A slot (49) is defined in a distal end of each tab. The flanges of the fin plates are in alignment with each other and attached on the base. The slots of each fin plate receive the tongues of an adjoining preceding fin plate.
    Type: Grant
    Filed: December 29, 2003
    Date of Patent: March 29, 2005
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Hsieh Kun Lee, WanLin Xia, Jin Song Feng
  • Publication number: 20040228095
    Abstract: A heat sink mounting assembly includes a socket (90) having first and second side, a retaining clip (10) cooperating with the socket to sandwich a heat sink (70) therebetween. A pair of ears (92) is formed at the first and second sides of the socket. The retaining clip includes a pressing body (11) having first and second ends, a first leg (14) extending from the first end thereof and engaging with one ear, a spring (50) attached to the pressing body, and a second leg (30) attached to the second end thereof and biased by the spring. When the second leg is pressed down toward the socket, the spring biases the second leg upwardly, so that the second leg is resiliently engaged with the other ear. Thus, the heat sink is secured between the socket and the retaining clip.
    Type: Application
    Filed: May 17, 2004
    Publication date: November 18, 2004
    Inventors: Hsieh Kun Lee, WanLin Xia, Tao Li, Jin Song Feng
  • Publication number: 20040194922
    Abstract: A heat dissipation device (30) includes a base (50) and a plurality of individual fin plates (40) standing side by side on the base. Each fin plate includes a main body (41), a flange (43) and a pair of tabs (45) distal from the flange. Each tab defines a split (46) in a middle thereof where it adjoins the corresponding main body and thereby forms a tongue (47) surrounded on three sides by the split. The tongue is coplanar with the main body while the flange and the tabs are perpendicular to the main body. A slot (49) is defined in a distal end of each tab. The flanges of the fin plates are in alignment with each other and attached on the base. The slots of each fin plate receive the tongues of an adjoining preceding fin plate.
    Type: Application
    Filed: December 29, 2003
    Publication date: October 7, 2004
    Inventors: Hsieh Kun Lee, WanLin Xia, Jin Song Feng