Abstract: The present disclosure in at least one embodiment provides a wireless communication device, comprising a radome comprising a first locking unit and a sealing protrusion formed along at least one side end, a lower case formed along at least one side end and including a sealing protrusion groove which is configured to receive at least part of the sealing protrusion and a second locking unit, and a fastener which is fastened to the first locking unit and the second locking unit to fix the lower case and the radome.

Abstract: The present invention relates to a clamping apparatus for an antenna. Particularly, the clamping apparatus comprises: an arm unit which is coupled to a support pole and has a mounting space formed in a tip portion thereof and open in a longitudinal direction; a rotation unit which is detachably mounted in the mounting space of the arm unit and has a tip portion coupled to be rotatable predetermined angle in the left and right directions with respect to a hinge point in the mounting space; a tilting unit which is coupled to the tip portion of the rotation unit so as to be tiltable in the up and down directions and mediates the coupling of an antenna device; and a mounting guide unit which is provided in the rotation unit, and is elastically pressed and then temporarily fixed to the hinge point of the mounting space when the rotation unit is mounted in the mounting space of the arm unit.

Abstract: An antenna apparatus is disclosed, including a lower housing, a middle housing disposed on the lower housing and having one surface formed with one or more first heat dissipation fins, a first accommodation space formed by the lower housing and the middle housing, at least one first heat-generating element disposed in the first accommodation space, one or more heat dissipation supports each disposed on the middle housing and having at least one surface formed with one or more second heat dissipation fins, and an antenna module supported on the one or more heat dissipation supports.

Abstract: Provided are a power amplification device and a manufacturing method thereof, wherein the power amplification device provides compact substrates by laminating a plurality of substrates, and has improved heat dissipating performance since a heat dissipating plate is installed to be in surface-contact with one of the plurality of substrates, and a heating element mounted on the substrate is in contact with the heat dissipating plate.

Abstract: The present invention relates to a heat dissipation device for an electronic element, the heat dissipation device including a first chamber in which a printed circuit board having heating elements mounted thereon is disposed, a second chamber configured to exchange heat with heat transferred from the first chamber and configured such that an injection part configured to inject a refrigerant and a refrigerant supply part configured to supply the refrigerant to the injection part are disposed in the second chamber, a heat transfer part disposed between the first chamber and the second chamber and configured to receive heat from the heating elements of the first chamber and supply the heat to the second chamber, and a condensing part configured to condense the refrigerant injected into the second chamber, in which a plurality of evaporation-inducing ribs is provided on a surface of the heat transfer part exposed to the second chamber and allows the liquid refrigerant injected by the injection part to be adsorbed

Abstract: Provided is a cooling apparatus for an electronic element having improved heat dissipation performance while minimizing the size.

Abstract: The present invention relates to a cooling device for an antenna apparatus. Particularly, the cooling device comprises a heat-dissipating cover which has an inner surface exposed to a thermal space and an outer surface exposed to the outside where outside air flows, and multiple wave heat-dissipating fins which are disposed in multiple rows on the outer surface of the heat-dissipating cover so as to be thermally conductive, and form curved surfaces that are continuous from the outer surface of the heat-dissipating cover to a discretionary height, in which the horizontal cross-sections at the discretionary height have straight-line shapes in which same are rotated by a predetermined angle in any one direction from the horizontal cross-sections on the outer surface of the heat-dissipating cover. Therefore, the present invention provides the advantage of enhancing heat-dissipating performance.

Abstract: A cooling apparatus for an electronic element is provided. The cooling apparatus includes a printed circuit board, a housing main body, an additional cooling part, and a heat transfer part. The printed circuit board includes one surface and another surface. A plurality of electronic elements are provided on the one surface of the printed circuit board. The housing main body includes an inner surface and an outer surface. The another surface of the printed circuit board is attached to the inner surface of the housing main body, and the outer surface of the housing main body has a plurality of first cooling ribs provided to protrude therefrom. The additional cooling part is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body.

Abstract: An antenna apparatus is disclosed, including a lower housing, a middle housing disposed on the lower housing and having one surface formed with one or more first heat dissipation fins, a first accommodation space formed by the lower housing and the middle housing, at least one first heat-generating element disposed in the first accommodation space, one or more heat dissipation supports each disposed on the middle housing and having at least one surface formed with one or more second heat dissipation fins, and an antenna module supported on the one or more heat dissipation supports.

Abstract: A printed circuit board includes one surface on which a plurality of electronic elements are mounted, at least one of the plurality of electronic elements generating heat during its operation, a board case which accommodates the printed circuit board, a cooling cover which has an inner surface and an outer surface, and a plurality of radial cooling bodies each formed to extend from the outer surface of the cooling cover so as to be inclined upward and configured to receive the heat generated from the printed circuit board to dissipate the heat externally. The inner surface of the cooling cover is in close contact with another surface of the printed circuit board while covering the board case. Each of the plurality of radial cooling bodies includes a unit heat pipe.

Abstract: Disclosed is an antenna clamping device, which includes: an arm unit which is coupled to a support pole and is partly provided to be movable in a horizontal direction; a coupling unit that is detachably mounted on a part of a tip of the arm unit; a rotation unit whose tip portion is coupled to the coupling unit so as to be ratable at a predetermined angle in a left-right direction; and a tilting unit that is coupled. to a tip portion of the rotation unit so as to be tiltable in a top-down direction and mediates coupling of an antenna device, wherein an angular motion adjuster is provided on at least any one of the rotation unit and the tilting unit so as to adjust a rotating angle, thereby removing spatial limitations on a plurality of antenna devices with respect to the support pole and improving workability.

Abstract: The present disclosure relates to a multiple-input and multiple-output antenna apparatus, and particularly, includes a housing, a ray dome which is coupled to the top of one side of the housing in a longitudinal direction, and has an antenna assembly disposed between the ray dome and the housing, a PCB assembly which is disposed at the bottom of the antenna assembly, a top cooling part which is coupled to the top of the other side of the housing in the longitudinal direction, has a battery and an FPGA assembly disposed between the top cooling part and the housing, and dissipates upward the heat discharged from the FPGA assembly, and a side cooling part which is coupled to protrude to one side in a width direction between the housing and the top cooling part and the other side in the width direction therebetween, and moves and dissipates the heat generated from the FPGA assembly to one side and the other side of the housing in the width direction, thereby improving cooling performance.

Abstract: The present invention relates to a clamping apparatus for an antenna. Particularly, the clamping apparatus comprises: an arm unit which is coupled to a support pole and has a mounting space formed in a tip portion thereof and open in a longitudinal direction; a rotation unit which is detachably mounted in the mounting space of the arm unit and has a tip portion coupled to be rotatable predetermined angle in the left and right directions with respect to a hinge point in the mounting space; a tilting unit which is coupled to the tip portion of the rotation unit so as to be tiltable in the up and down directions and mediates the coupling of an antenna device; and a mounting guide unit which is provided in the rotation unit, and is elastically pressed and then temporarily fixed to the hinge point of the mounting space when the rotation unit is mounted in the mounting space of the arm unit.

Abstract: The present invention relates to a clamping device for an antenna and, in particular, to a clamping device for an antenna which include: an arm unit coupled to a support pole and having a rotating shaft groove opening upward in a front end portion; a rotation unit detachably mounted in the rotating shaft hole of the arm unit and coupled to be rotatable at a predetermined angle in the left and right direction around the rotating shaft hole; and a tilting unit coupled to the front end portion of the rotation unit so as to be tiltable in the vertical direction while mediating coupling of an antenna device. Due to this feature, the clamping device for an antenna provides the advantages of eliminating spatial limitations on a plurality of antenna devices for the support pole and improving workability.

Abstract: The present disclosure in at least one embodiment provides a wireless communication device, comprising a radome comprising a first locking unit and a sealing protrusion formed along at least one side end, a lower case formed along at least one side end and including a sealing protrusion groove which is configured to receive at least part of the sealing protrusion and a second locking unit, and a fastener which is fastened to the first locking unit and the second locking unit to fix the lower case and the radome.

Abstract: The present disclosure in at least one embodiment provides a wireless communication device support bracket, comprising a fixing unit configured to be fixed to the support pole, a main support unit extending from the fixing unit in a first direction, a sub-support unit extending from one end of the main support unit, and a connection unit rotatably connected to the sub-support unit about at least one rotation axis, the connection unit being configured to be connected with the wireless communication device.

Abstract: The present disclosure relates to a multi input and multi output antenna apparatus. The multi input and multi output antenna apparatus may include: an antenna board having a plurality of antenna elements arranged on a front surface thereof; and a transmitting/receiving module board having a plurality of first heat generation elements provided on a front surface thereof and a plurality of second heat generation elements provided on a rear surface thereof, and disposed to have a separation space from the antenna board. The heat generated from the plurality of first heat generation elements may be radiated to the front of the transmitting/receiving module board, and the heat generated from the plurality of second heat generation elements may be radiated to the rear of the transmitting/receiving module board.

Abstract: The present disclosure relates to a multi input and multi output antenna apparatus. The multi input and multi output antenna apparatus may include: an antenna board having a plurality of antenna elements arranged on a front surface thereof; and a transmitting/receiving module board having a plurality of first heat generation elements provided on a front surface thereof and a plurality of second heat generation elements provided on a rear surface thereof, and disposed to have a separation space from the antenna board. The heat generated from the plurality of first heat generation elements may be radiated to the front of the transmitting/receiving module board, and the heat generated from the plurality of second heat generation elements may be radiated to the rear of the transmitting/receiving module board.

Abstract: The present disclosure relates to a cooling apparatus for an electronic element, and includes a printed circuit board which has a plurality of electronic elements mounted on one surface, at least one of the plurality of electronic elements generating heat at operation, a board case which accommodates the printed circuit board, a cooling cover which has the inner surface in close contact with the other surface of the printed circuit board while covering the board case, and a plurality of radial cooling bodies which have at least one provided to protrude from the outer surface of the cooling cover, are each formed to extend to be inclined upward, and receive heat generated from the printed circuit board to dissipate the heat outward, thereby increasing an effective cooling area on a limited cooling portion to largely improve cooling performance.