Patents by Inventor Jin Su YEOM

Jin Su YEOM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11309593
    Abstract: Provided is a flexible circuit board installed on a frame to which a bus bar is coupled. The flexible circuit board may include a central portion having a band shape, first connection circuit portions formed at both ends of the central portion and disposed to face each other, second connection circuit portions extending from the first connection circuit portions in parallel with the central portion, and third connection circuit portions extending from the first connection circuit portions and the second connection circuit portions and connected to the bus bar. An overlapped may be formed when each of the second connection circuit portions is folded toward one side of each of the first connection circuit portions.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: April 19, 2022
    Assignee: Yura Corporation Co., Ltd.
    Inventors: Jung Hak Oh, Jin Su Yeom, Jong Won Lee, Tae Hyeon Jeon, Cheon Hyo Lee, Kwang Ouk Sa, Ji Eun Kang, Seung Jun Noh
  • Patent number: 9609737
    Abstract: A heat dissipation printed circuit board includes a metal core, lower and upper insulating layers, first lower and first upper circuit patterns, and second lower and second upper circuit patterns. The lower and upper insulating layers are disposed at a lower side and an upper side of the metal core, respectively. The first lower and first upper circuit patterns are disposed at a lower side of the lower insulating layer and at an upper side of the upper insulating layer, respectively. The second lower and second upper circuit patterns are disposed at a lower side of the first lower circuit pattern and at an upper side of the first upper circuit pattern, respectively. An etching portion in the first lower circuit pattern is filled with the lower insulating layer and an etching portion in the first upper circuit pattern is filled with the upper insulating layer.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: March 28, 2017
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION, YURA CORPORATION CO., LTD.
    Inventors: Mun Jong Kim, Kwan Bum Lee, Jin Su Yeom
  • Patent number: 9338929
    Abstract: A junction box for a vehicle is provided. The junction box includes at least one printed circuit board having a metal core and a heat transfer member formed at an edge of the printed circuit board. In addition, the junction box includes a case in which at least one printed circuit board is disposed. Further, the heat transfer member contacts the inner surface of the case.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: May 10, 2016
    Assignees: Hyundai Motor Company, Kia Motors Corporation, Yura Corporation Co., Ltd.
    Inventors: Mun Jong Kim, Jin Su Yeom
  • Publication number: 20150181690
    Abstract: A heat dissipation printed circuit board includes a metal core, lower and upper insulating layers, first lower and first upper circuit patterns, and second lower and second upper circuit patterns. The lower and upper insulating layers are disposed at a lower side and an upper side of the metal core, respectively. The first lower and first upper circuit patterns are disposed at a lower side of the lower insulating layer and at an upper side of the upper insulating layer, respectively. The second lower and second upper circuit patterns are disposed at a lower side of the first lower circuit pattern and at an upper side of the first upper circuit pattern, respectively. An etching portion in the first lower circuit pattern is filled with the lower insulating layer and an etching portion in the first upper circuit pattern is filled with the upper insulating layer.
    Type: Application
    Filed: October 16, 2014
    Publication date: June 25, 2015
    Inventors: Mun Jong KIM, Kwan Bum LEE, Jin Su YEOM
  • Publication number: 20150181755
    Abstract: A junction box for a vehicle is provided. The junction box includes at least one printed circuit board having a metal core and a heat transfer member formed at an edge of the printed circuit board. In addition, the junction box includes a case in which at least one printed circuit board is disposed. Further, the heat transfer member contacts the inner surface of the case.
    Type: Application
    Filed: November 18, 2014
    Publication date: June 25, 2015
    Inventors: Mun Jong Kim, Jin Su Yeom