Abstract: The semiconductor device of the present invention comprises a substrate; at least one through hole formed through the substrate between front and back surfaces of the substrate; an electrical connection portion formed by a semiconductor process on at least one surface of the front and back surfaces of the substrate in a vicinity of an end opening of the through hole; an insulating layer formed of an organic material on an inside surface of the through hole; and an electroconductive layer formed on an inside surface of the insulating layer, wherein the electrical connection portion is electrically connected to the electroconductive layer to be electrically connected to a side of the other surface of the substrate.

Abstract: The semiconductor device of the present invention comprises a substrate; at least one through hole formed through the substrate between front and back surfaces of the substrate; an electrical connection portion formed by a semiconductor process on at least one surface of the front and back surfaces of the substrate in a vicinity of an end opening of the through hole; an insulating layer formed of an organic material on an inside surface of the through hole; and an electroconductive layer formed on an inside surface of the insulating layer, wherein the electrical connection portion is electrically connected to the electroconductive layer to be electrically connected to a side of the other surface of the substrate.

Abstract: The semiconductor device of the present invention comprises a substrate; at least one through hole formed through the substrate between front and back surfaces of the substrate; an electrical connection portion formed by a semiconductor process on at least one surface of the front and back surfaces of the substrate in a vicinity of an end opening of the through hole; an insulating layer formed of an organic material on an inside surface of the through hole; and an electroconductive layer formed on an inside surface of the insulating layer, wherein the electrical connection portion is electrically connected to the electroconductive layer to be electrically connected to a side of the other surface of the substrate.

Abstract: The semiconductor device of the present invention comprises a substrate; at least one through hole formed through the substrate between front and back surfaces of the substrate; an electrical connection portion formed by a semiconductor process on at least one surface of the front and back surfaces of the substrate in a vicinity of an end opening of the through hole; an insulating layer formed of an organic material on an inside surface of the through hole; and an electroconductive layer formed on an inside surface of the insulating layer, wherein the electrical connection portion is electrically connected to the electroconductive layer to be electrically connected to a side of the other surface of the substrate.

Abstract: A machining device for illuminating a periodic pattern of a mask with coherent light emitted from a light source and projecting the image of the pattern onto a workpiece through an optical system. The optical system includes first and second optical members. The second optical member, which is positioned at an area where diffracted light rays of different orders out of the diffracted light rays generated by the mask are superimposed, employs an optical material having a smaller variation in an optical path length arising from light absorption than an optical material of the first optical member, which is positioned at an area where diffracted light rays of different orders are not superimposed.

Abstract: When the operator inputs a macro control command, each microrobot takes an actual action on the basis of the command. That action is autonomously controlled to successfully execute the macro command. The autonomous control is to feed back and control the deviation between sensor information (position, speed, and acceleration) of the microrobot and the control command. When a plurality of microrobots are used and must take distributed, cooperative actions, conditions required for task completion such as environmental conditions (temperature, humidity, and the like) are obtained via communications with the base controller and are used for control information compensation. Such control allows each microrobot to cope with complicated tasks independently of the number of sensors, communication performance, and computer processing performance.

Abstract: According to the present invention, there is provided an optical radar in which a beam intensity-changed with a preset waveform and having a two-dimensional spread is irradiated on a target measurement object, an optical image of light reflected by the target measurement object is formed on the light-receiving surface of an image pickup element having a sensitivity modulation function and is photoelectrically converted, the sensitivity of the image pickup element is modulated with the preset waveform using the sensitivity modulation function of the image pickup element, distances to respective points of the target measurement object are obtained from light amount signals from the respective points of the target measurement object, which signals are output from the image pickup element, thereby measuring the shape of the target measurement object, wherein distances to the respective points of the target measurement object are obtained from the plurality of light amount values of the respective points of the ta

Abstract: An inspection method for inspecting the posture of parts mounted on a circuit board. This method consists of providing a moving unit for moving a stage holding the circuit board, a light source for irradiating the parts with a laser beam, an optical system path for irradiating the parts with the laser beam, a signal output path for outputting a reference signal by the laser beam, and a processing unit to process a signal from the optical system and signal output paths. In this method, reference signals A and B are obtained at first and second positions of the parts. This method further involves holding the parts at a first position, irradiating the optical system and signal output paths with the laser beam to detect a signal from each path, and outputting from the processing unit a first phase difference signal, corresponding to the first position, of output from each path.