Abstract: An electronic device, the electronic device includes: a printed circuit board PCB substrate (201, 31); a magnetometer (202, 32), where the magnetometer (202, 32) is mounted on the PCB substrate (201, 31); and a protection apparatus (203, 33), where the protection apparatus (203, 33) is mounted on the PCB substrate (201, 31) and is disposed at a periphery of the magnetometer (202, 32), and is configured to protect the magnetometer (202, 32). According to the electronic device, sensitivity of the magnetometer (202, 32) can be improved, and the magnetometer (202, 32) can be protected from being damaged.

Abstract: An electronic device, the electronic device includes: a printed circuit board PCB substrate (201, 31); a magnetometer (202, 32), where the magnetometer (202, 32) is mounted on the PCB substrate (201, 31); and a protection apparatus (203, 33), where the protection apparatus (203, 33) is mounted on the PCB substrate (201, 31) and is disposed at a periphery of the magnetometer (202, 32), and is configured to protect the magnetometer (202, 32). According to the electronic device, sensitivity of the magnetometer (202, 32) can be improved, and the magnetometer (202, 32) can be protected from being damaged.

Abstract: A floral lighting system that combines creative floral arrangements with lights is revealed. The floral lighting system includes a carrier, at least one floral unit, at least one light emitting diode (LED) module and a power supply. The floral unit is connected to the carrier to form a creative floral arrangement. The LED module includes at least one wire unit that is wound around or inserted into the floral unit for integrally connected to the floral unit. An external electronic device is used to control functions of the LED module such as light color, power on/off, lighting pattern, etc. wirelessly so that the LED module arranged at the creative floral arrangement on the carrier provides various kinds of dynamic lighting. The floral lighting system overcomes the shortcomings of conventional flower lights such as limited styles, dull lighting, etc.

Abstract: A plug and a printed circuit board (PCB) assembly are provided that relate to the field of vehicle testing and reduce a volume of the PCB assembly. The plug includes a plug body, where a first row of slots and a second row of slots are disposed on the plug body; and the plug further includes first pins in one-to-one correspondence with the first row of slots and second pins in one-to-one correspondence with the second row of slots; the first pin is L-shaped, and the other end is configured to connect to a first PCB; and the second pin is stair-shaped, one end of the second pin is embedded in a slot, in a corresponding position, of the second row of slots, and the other end is configured to connect to the first PCB, is parallel to the end.

Abstract: A plug and a printed circuit board (PCB) assembly are provided that relate to the field of vehicle testing and reduce a volume of the PCB assembly. The plug includes a plug body, where a first row of slots and a second row of slots are disposed on the plug body; and the plug further includes first pins in one-to-one correspondence with the first row of slots and second pins in one-to-one correspondence with the second row of slots; the first pin is L-shaped, and the other end is configured to connect to a first PCB; and the second pin is stair-shaped, one end of the second pin is embedded in a slot, in a corresponding position, of the second row of slots, and the other end is configured to connect to the first PCB, is parallel to the end.

Abstract: A method for packaging a wafer is provided, which includes: providing a bare wafer; forming a plurality of through silicon vias across through the bare wafer, the through silicon vias being filled with a conducting metal; forming a redistribution layer on the bare wafer, the redistribution layer being connected to each of the through silicon vias; performing a chemical mechanical polishing process to planarize a surface of the bare wafer; performing a wafer forming process to treat the planarized bare wafer; forming a metal layer on the wafer after processed; forming a plurality of connection pads on the metal layer, the connection pads being respectively electrically connected to their corresponding through silicon vias; forming a passivation layer on the metal layer; and forming a plurality of solder balls or metal bumps on a backside surface of the wafer through which the processed wafer is electrically connected to a substrate.

Abstract: A method of preventing oxidation of a metal is disclosed. The method includes: placing a metal piece in a vacuum container; injecting hydrogen gas into the vacuum container; heating the metal piece placed in the vacuum container up to 200° C.; cooling the vacuum container and discharging the hydrogen gas; removing the metal piece from the vacuum container; and placing the metal piece in an oxygen-containing environment. An additional inorganic film or organic film is not needed to be used for blocking the oxygen from contacting the metal.

Abstract: A ventilated garment including one or more mesh fabric areas and a plurality of spacers. Each spacer has a generally arch-shaped portion with two ends thereof being fastened on an inner surface of the ventilated garment adjacent to the mesh fabric areas. The mesh fabric areas may be provided at the shoulder portion, the chest portion, and/or the side portion of the ventilated garment. The garment can be lifted up and kept at a distance from the body of a wearer by the spacers to ventilate heat and moisture.

Abstract: A light emitting diode display device includes a circuit board and a plurality of pixel units. Each pixel unit includes a light emitting diode assembly positioned on and electrically connected to the circuit board, and a light-mixed component positioned on a side of the light emitting diode assembly configured for mixing lights emitted from the light emitting diode assembly to generate a mixed light beam.

Abstract: A display apparatus includes a display system and a control system. The display system includes pixel units and a network interface based on a network protocol. The pixel units are arranged in a matrix and each of the pixel units includes solid state light emitting elements. The control system includes a control module, an input module, and an output module. The output module is electronically coupled to the network interface. The control system is configured to receive an input signal through the input module, generate a corresponding control signal by the control module, and output the control signal by the output module to the display system via the network interface according to the network protocol to control the display contents of the display system.

Abstract: An articulated vehicle is made up of two independently moveable vehicle bodies, for instance tracked vehicle bodies. The first vehicle body has an engine and the second one has a motor/generator. An articulation device connects them to allow the first vehicle body to drive the second vehicle body or vice versa or even for them to act together. A drive transmission that can be used in the vehicle allows power to be input from two shafts or for one of the shafts to be an additional power output. An articulation device that can be used in the vehicle allows quick alignment and/or coupling and decoupling of the two bodies.

Abstract: An articulated vehicle is made up of two independently moveable vehicle bodies, for instance tracked vehicle bodies. The first vehicle body has an engine and the second one has a motor/generator. An articulation device connects them to allow the first vehicle body to drive the second vehicle body or vice versa or even for them to act together. A drive transmission that can be used in the vehicle allows power to be input from two shafts or for one of the shafts to be an additional power output. An articulation device that can be used in the vehicle allows quick alignment and/or coupling and decoupling of the two bodies.

Abstract: An improved wafer handler having a wafer chuck that properly picks up wafers from a wafer track of an ion implant machine is provided. The wafer handler comprises: an input arm having a wafer chuck and a wafer pad adjustably mounted to the wafer chuck. The wafer pad preferably has an oval shape. The wafer handler can pick up a horizontal wafer and set the wafer down on an angled surface. The oval shape, dimensions, flexible material and mounting screws of the wafer pad enable the pad to form a vacuum with the wafer and to properly handle the wafer. The wafer handler and wafer pad greatly reduce wafer breakage and damage to the implant machine from the broken wafers.