Abstract: Microlithography reticles are disclosed that include a high-contrast reticle-identification code (bar code). The bar code is configured as a pattern (usually linearly arrayed) of high-scattering regions (bar-code elements) each exhibiting a relatively high degree of reflection-scattering of irradiated probe light. The high-scattering regions are separated from one another by respective low-scattering regions each exhibiting a relatively low degree of reflection-scattering of incident probe light. For example, the low-scattering regions have smooth surfaces from which very little probe light is reflection-scattered, wherein each high-scattering region includes multiple scattering features such as line, channels, projections, or the like that provide multiple edges and/or points that reflection-scatter probe light.

Abstract: Alignment-mark patterns are disclosed that are defined on stencil reticles and that can be transferred lithographically from the reticle to a sensitized substrate using charged-particle-beam microlithography. The corresponding alignment marks as transferred to the substrate are detectable at high accuracy using an optical-based alignment-detection device (e.g., an FIA-based device). The transferred alignment marks can be used in place of alignment marks used in optical microlithography systems. An alignment-mark pattern as defined on a stencil reticle includes pattern elements that are split in any of various ways into respective pattern-element portions separated from each other on the membrane of the stencil reticle by “girders” (band-like membrane portions) that prevent the formation of islands in the stencil reticle and that prevent deformation of the pattern elements on the stencil reticle.

Abstract: Devices and methods are disclosed for monitoring temperature of certain components (e.g., lenses, deflectors, and stages) in real time during operation of a microlithography apparatus, especially a charged-particle-beam microlithography apparatus. The components have associated therewith respective temperature sensors that provide temperature data to a temperature-monitoring device. The temperature-monitoring device interprets the data and routes corresponding signals to a controller that commands certain responsive action by any of various components of the apparatus serving to control the temperatures within respective specified tolerances. If a sudden temperature change occurs in a monitored component of the apparatus, then a warning device activates an alarm, and the controller commands corrective actions to return the culprit temperature to within the specified gradient.

Abstract: Charged-particle-beam (CPB) microlithography systems are disclosed that include a device for measuring the distribution of charged-particle density in a patterned beam. By providing feedback to the CPB microlithography apparatus, the distribution of charged-particle density can be optimized for high-quality exposures. An embodiment of the device includes a pinhole diaphragm defining an aperture having a small cross-dimension compared to the transverse width of the patterned beam produced by the system. The device also desirably includes a downstream scattering-contrast diaphragm defining an aperture having a larger cross dimension than that of the pinhole aperture. A photodiode or the like is downstream of the pinhole aperture and is used for detecting charged particles transmitted by the pinhole diaphragm. A patterned beam is scanned across the pinhole aperture, and charged particles not scattered during passage through the pinhole aperture propagate to the photodiode.

Abstract: Alignment marks are disclosed that provide, when scanned by a detection-light beam, an enhanced signal-amplitude change. Such an alignment mark is formed on a mark substrate and is used for performing an alignment in a charged-particle-beam (CPB) microlithography system. The alignment mark includes at least one mark element defined as a corresponding height-difference characteristic in the mark substrate. The mark element includes more than two height-difference edges that would be encountered by a detection-light beam being scanned across the element. The height-difference edges of the element can be defined by multiple individual mark-element components that collectively provide the more than two height-difference edges of the mark element. Alternatively, for example, the element can include two height-difference edges at respective edges of the mark element and at least one height-difference edge situated between the two height-difference edges at respective edges of the mark element.

Abstract: Devices and methods are disclosed for monitoring temperature of certain components (e.g., lenses, deflectors, and stages) in real time during operation of a microlithography apparatus, especially a charged-particle-beam microlithography apparatus. The components have associated therewith respective temperature sensors that provide temperature data to a temperature-monitoring device. The temperature-monitoring device interprets the data and routes corresponding signals to a controller that commands certain responsive action by any of various components of the apparatus serving to control the temperatures within respective specified tolerances. If a sudden temperature change occurs in a monitored component of the apparatus, then a warning device activates an alarm, and the controller commands corrective actions to return the culprit temperature to within the specified gradient.

Abstract: Alignment-mark patterns are disclosed that are defined on stencil reticles and that can be transferred lithographically from the reticle to a sensitized substrate using charged-particle-beam microlithography. The corresponding alignment marks as transferred to the substrate are detectable at high accuracy using an optical-based alignment-detection device (e.g., an FIA-based device). The transferred alignment marks can be used in place of alignment marks used in optical microlithography systems. An alignment-mark pattern as defined on a stencil reticle includes pattern elements that are split in any of various ways into respective pattern-element portions separated from each other on the membrane of the stencil reticle by “girders” (band-like membrane portions) that prevent the formation of islands in the stencil reticle and that prevent deformation of the pattern elements on the stencil reticle.