Patents by Inventor Jin Uk CHA
Jin Uk CHA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145171Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.Type: ApplicationFiled: January 4, 2024Publication date: May 2, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Uk Cha, Chang Min Lee, Hye Sung Yoon, Seon A Jang, Ji Hyuk Lim, Ki Yong Lee
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Patent number: 11901128Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.Type: GrantFiled: March 25, 2022Date of Patent: February 13, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Uk Cha, Chang Min Lee, Hye Sung Yoon, Seon A Jang, Ji Hyuk Lim, Ki Yong Lee
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Publication number: 20230141461Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.Type: ApplicationFiled: March 25, 2022Publication date: May 11, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Uk Cha, Chang Min Lee, Hye Sung Yoon, Seon A Jang, Ji Hyuk Lim, Ki Yong Lee
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Patent number: 9095063Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board.Type: GrantFiled: February 17, 2014Date of Patent: July 28, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Eun Ju Yang, Gyu Seok Kim, Suk Jin Ham, Se Yoon Park, Jin Uk Cha, Hee Suk Chung, Mi Yang Kim
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Publication number: 20150136458Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board.Type: ApplicationFiled: February 17, 2014Publication date: May 21, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Eun Ju Yang, Gyu Seok Kim, Suk Jin Ham, Se Yoon Park, Jin Uk Cha, Hee Suk Chung, Mi Yang Kim
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Publication number: 20150114131Abstract: Disclosed herein is a bonding force test device, including: a holder mounted with a sample to which a plurality of subjects to be tested are bonded; a rotating part rotating the holder; and a fixing tip disposed in a direction in which the fixing tip faces the holder, wherein at the time of rotating the holder, the fixing tip contacts any one of the subjects to be tested in the sample and a shearing stress is applied to a bonded portion between the fixing tip and any one subject to be tested.Type: ApplicationFiled: February 24, 2014Publication date: April 30, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Uk Cha, Gyu Seok Kim, Eun Ju Yang, Mi Yang Kim, Suk Jin Ham
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Publication number: 20140174193Abstract: There are provided a method, an apparatus and a sample for evaluating bonding strength, the method including setting a micro-region including a bonded interface in an evaculated sample, forming a first groove in a circumferential portion of the micro-region to have a predetermined depth, processing a side of the micro-region to form a second groove connected to the bonded interface, and applying pressure on the micro-region to measure a critical point at which a delamination of the micro-region is generated.Type: ApplicationFiled: February 21, 2013Publication date: June 26, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Gyu Seok KIM, Hee Suk CHUNG, Hyun Jung LEE, Suk-Jin HAM, Ju Wan NAM, Jin Uk CHA, Mi Yang KIM