Patents by Inventor Jin Wee Lim

Jin Wee Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sliding tray holder for ease in handling IC packages during testing of the IC packages
    Patent number: 6445174
    Abstract: A sliding tray holder is coupled to an IC (integrated circuit) package test system having a plurality of test stations, for holding the trays of IC packages during testing of a high quantity of IC packages through the plurality of test stations. The sliding tray holder includes a platform for holding a first tray of untested IC packages and for holding a second tray of tested IC packages. Each untested IC package from the first tray of untested IC packages is loaded to at least one of the plurality of test stations for testing of the untested IC package such that the untested IC package becomes a tested IC package. The tested IC package is unloaded from one of the plurality of test stations to the second tray of tested IC packages.
    Type: Grant
    Filed: March 20, 2002
    Date of Patent: September 3, 2002
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Hock Chuan Koh, Jin Wee Lim, Yiak Khian Heng
  • Sliding tray holder for ease in handling IC packages during testing of the IC packages
    Patent number: 6396258
    Abstract: A sliding tray holder is coupled to an IC (integrated circuit) package test system having a plurality of test stations, for holding the trays of IC packages during testing of a high quantity of IC packages through the plurality of test stations. The sliding tray holder includes a platform for holding a first tray of untested IC packages and for holding a second tray of tested IC packages. Each untested IC package from the first tray of untested IC packages is loaded to at least one of the plurality of test stations for testing of the untested IC package such that the untested IC package becomes a tested IC package. The tested IC package is unloaded from one of the plurality of test stations to the second tray of tested IC packages.
    Type: Grant
    Filed: June 26, 2000
    Date of Patent: May 28, 2002
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Hock Chuan Koh, Jin Wee Lim, Yiak Khian Heng