Patents by Inventor Jin-Wen OU

Jin-Wen OU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE WITH CIRCUIT BOARD
    Publication number: 20130063906
    Abstract: An electronic device includes a chassis, a circuit board and the resilient piece. The chassis includes a bottom panel. The circuit board has a ground plane. The resilient piece includes a soldering portion and a resisting portion. The soldering portion is in electrical connection with the ground plane, and the resisting piece abuts the bottom panel to prevent the electromagnetic interference (EMI) from the circuit board.
    Type: Application
    Filed: May 18, 2012
    Publication date: March 14, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD.
    Inventors: Yong-Nian CHEN, Li-Fu XU, Yue-Yong LI, Jin-Wen OU