Abstract: In a method of forming a metal gate in a semiconductor device, a gate insulation pattern and a dummy gate pattern are formed on a substrate. An insulation interlayer is formed on the dummy gate pattern to cover the dummy gate pattern. The insulation interlayer is polished such that a top surface of the dummy gate pattern is exposed, and the dummy gate pattern is selectively removed to form a trench on the substrate. A gate spacer is formed on an inner sidewall of the trench for determining a gate length of the metal gate. A metal is deposited to a sufficient thickness to fill the trench to form a metal layer. The metal layer is polished to remain in the trench. Accordingly, the gate length of the metal gate may be reduced no more than the resolution limit of the photolithography exposing system.

Abstract: In a method of forming a metal gate in a semiconductor device, a gate insulation pattern and a dummy gate pattern are formed on a substrate. An insulation interlayer is formed on the dummy gate pattern to cover the dummy gate pattern. The insulation interlayer is polished such that a top surface of the dummy gate pattern is exposed, and the dummy gate pattern is selectively removed to form a trench on the substrate. A gate spacer is formed on an inner sidewall of the trench for determining a gate length of the metal gate. A metal is deposited to a sufficient thickness to fill the trench to form a metal layer. The metal layer is polished to remain in the trench. Accordingly, the gate length of the metal gate may be reduced no more than the resolution limit of the photolithography exposing system.

Abstract: A method of forming a dual damascene interconnection employs a low-k dielectric organic polymer as an insulating layer. With only one hard mask layer, ashing damage to the insulating layer is prevented using a hard mask layer and an etch-stop layer that are different in etch rate from that of a self-aligned spacer. Further, it is possible to form a via hole that is smaller than the resolution limit of the photolithographic process. As a result, the process is simplified and a photoresist tail phenomenon does not occur.

Abstract: Provided is a method of forming a thick metal silicide layer on a gate electrode. The method includes forming a gate electrode of a transistor on a semiconductor substrate, wherein a hard mask is formed on the gate electrode, forming a spacer on a sidewall of the gate electrode, forming a first silicide layer on a portion of the semiconductor substrate, adjacent to the spacer, forming an insulating layer on the first suicide layer to expose upper portions of the hard mask and the spacer, selectively etching the exposed upper portions of the hard mask and the spacer using the insulating layer as an etch mask until the top surface and the sidewall of the gate electrode are exposed, forming a metal layer on the exposed top surface and sidewall of the gate electrode, and forming a second silicide layer on the gate electrode by siliciding the metal layer.

Abstract: Provided is a method of forming a thick metal silicide layer on a gate electrode. The method includes forming a gate electrode of a transistor on a semiconductor substrate, wherein a hard mask is formed on the gate electrode, forming a spacer on a sidewall of the gate electrode, forming a first silicide layer on a portion of the semiconductor substrate, adjacent to the spacer, forming an insulating layer on the first suicide layer to expose upper portions of the hard mask and the spacer, selectively etching the exposed upper portions of the hard mask and the spacer using the insulating layer as an etch mask until the top surface and the sidewall of the gate electrode are exposed, forming a metal layer on the exposed top surface and sidewall of the gate electrode, and forming a second silicide layer on the gate electrode by siliciding the metal layer.

Abstract: A method of forming a dual damascene interconnection employs a low-k dielectric organic polymer as an insulating layer. With only one hard mask layer, ashing damage to the insulating layer is prevented using a hard mask layer and an etch-stop layer that are different in etch rate from that of a self-aligned spacer. Further, it is possible to form a via hole that is smaller than the resolution limit of the photolithographic process. As a result, the process is simplified and a photoresist tail phenomenon does not occur.