Patents by Inventor Jin-Woo Choi

Jin-Woo Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210011869
    Abstract: Provided is a semiconductor device and a semiconductor system. A semiconductor device can include a command priority policy manager circuit which generates command priority policy information including a command priority compliance policy for a command directed to a device. A host interface circuit can be coupled to the command priority policy manager circuit to receive the command priority policy information from the command priority policy manager circuit, where the host interface circuit operable to transmit the command priority policy information via an electrical interface to the device.
    Type: Application
    Filed: September 28, 2020
    Publication date: January 14, 2021
    Inventors: DONG-MIN KIM, JEONG-WOO PARK, WOOK HAN JEONG, JIN HWAN CHOI
  • Patent number: 10892142
    Abstract: A system for fabricating a semiconductor device may include a chamber, an electrostatic chuck used to load a substrate, a power source supplying an RF power to the electrostatic chuck, an impedance matcher between the power source and the electrostatic chuck, and a power transmission unit connecting the electrostatic chuck to the impedance matcher. The power transmission unit may include a power rod, which is connected to the electrostatic chuck and has a first outer diameter, and a coaxial cable. The coaxial cable may include an inner wire, an outer wire, and a dielectric material between the outer and inner wires. The inner wire connects the power rod to the impedance matcher and has a second outer diameter less than the first outer diameter. The outer wire is connected to the chamber and is provided to enclose the inner wire and has a first inner diameter less than the first outer diameter and greater than the second outer diameter.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: January 12, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sangjean Jeon, Jinyoung Park, Chanhoon Park, Hoyong Park, Jin Young Bang, JungHwan Um, Il Sup Choi, Je-Woo Han
  • Patent number: 10892101
    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, a first plating portion disposed on the electrode layer and having a thickness ranging from 0.3 ?m to 1 ?m, and a second plating portion disposed on the first plating portion.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: January 12, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Lee, Hyun Hee Gu, Eui Hyun Jo, Jong Ho Lee, Eun Jin Kim, Hye Young Choi
  • Publication number: 20210003632
    Abstract: A test system for a memory device includes: a chamber including at least one test socket column having a plurality of test sockets arranged in a first direction, wherein memory devices to be tested are in respective ones of the plurality of test sockets, a temperature adjusting apparatus configured to supply air into the chamber according to a temperature control signal to control a temperature of the chamber, a test device electrically connected to the test sockets and configured to test the memory devices, and a temperature controller configured to receive temperature information of the memory devices from temperature sensors of the memory devices and to output to the temperature adjusting apparatus the temperature control signal to compensate for a temperature difference between a detected temperature of the memory devices and a target temperature.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 7, 2021
    Inventors: Min-Woo Kim, Chang-Ho Lee, Jin-Ho Choi
  • Publication number: 20210000429
    Abstract: An apparatus for calibrating a bio-information estimation model is provided. The apparatus for calibrating a bio-information estimation model includes: a data obtainer configured to obtain at least one pulse wave signal; and a processor configured to extract a plurality of feature sets, each feature set including one or more features, from each of the at least one pulse wave signal, and configured to calibrate a bio-information estimation model based on a correlation distribution of the extracted plurality of feature sets.
    Type: Application
    Filed: March 6, 2020
    Publication date: January 7, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung Keun YOON, Seung Woo Noh, Chang Soon Park, Jin Woo Choi
  • Publication number: 20200407556
    Abstract: Embodiments relate to a polymer film that is excellent in folding characteristics and transparency and maintains excellent mechanical properties even after repeated elongation and shrinkage in the elastic region, a process for preparing the same, and a front panel and a display device comprising the same. The polymer film comprises a polymer resin selected from the group consisting of a polyamide-based resin and a polyimide-based resin and has an MOR0/9 of Equation A of 2% or less.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 31, 2020
    Inventors: Jung Hee KI, Sunhwan KIM, Han Jun KIM, Dae Seong OH, Jin Woo LEE, Sang Hun CHOI, Gun Uk KIM
  • Publication number: 20200411397
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Application
    Filed: September 11, 2020
    Publication date: December 31, 2020
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Publication number: 20200407557
    Abstract: Embodiments relate to a polymer film. The polymer film comprises a polymer resin selected from the group consisting of a polyamide-based resin and a polyimide-based resin and has a haze (HZ0) before autoclave treatment of 3% or less and a ?HZ24 represented by Equation 1a of 500% or less.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 31, 2020
    Inventors: Jung Hee KI, Sunhwan KIM, Sang Hun CHOI, Dae Seong OH, Han Jun KIM, Jin Woo LEE, Dong Jin LIM
  • Publication number: 20200407506
    Abstract: Embodiments relate to a polyamide-imide film that maintains its mechanical properties at least at a certain level under the conditions of high temperatures and low temperatures and is excellent in transparency and folding characteristics, a process for preparing the same, and a cover window comprising the same. The polyamide-imide film comprises a polyamide-imide polymer and has an MOR value defined in Equation 1a of 75% or more.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 31, 2020
    Inventors: Han Jun KIM, Sunhwan KIM, Dae Seong OH, Jin Woo LEE, Sang Hun CHOI, Jung Hee KI, Dong Jin LIM
  • Publication number: 20200407507
    Abstract: Embodiments relate to a polymer film for a display that maintains a clean appearance and transparency and is excellent in antiblocking properties by securing a certain range of optical slip index (OS), a process for preparing the same, and a front panel and a display device comprising the same. The polymer film comprises a polymer resin selected from the group consisting of a polyamide-based resin and a polyimide-based resin and a filler and has an optical slip index (0.5) of less than 0.5.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 31, 2020
    Inventors: Dae Seong OH, Sunhwan KIM, Han Jun KIM, Jin Woo LEE, Sang Hun CHOI, Jung Hee KI
  • Publication number: 20200409413
    Abstract: Embodiments relate to a base film that is colorless, transparent, and excellent in mechanical properties and optical properties, particularly with low moisture permeability, a process for preparing the same, and a cover window and a display device comprising the same. The cover window comprises a base film comprising a polyamide-based polymer and having a moisture permeability of 300 g/m2┬Ěday or less; and a functional layer.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 31, 2020
    Inventors: Sunhwan KIM, Jung Hee KI, Han Jun KIM, Dae Seong OH, Jin Woo LEE, Sang Hun CHOI
  • Publication number: 20200407519
    Abstract: The polymer film according to an embodiment comprises at least one polymer resin selected from the group consisting of a polyamide-based resin, a polyimide-based resin, and a polyamide-imide-based resin, and has a haze of 0.6% or less and an in-plane retardation within a specific range for each wavelength band in the visible light region. The polymer film, which has an in-plane retardation within a specific range for each wavelength band in the visible light region, is excellent in transparency and optical properties, and it can remarkably reduce the rainbow phenomenon and improve the reflection appearance.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 31, 2020
    Inventors: Jung Hee KI, Sunhwan KIM, Dae Seong OH, Jin Woo LEE, Sang Hun CHOI, Han Jun KIM, Heung Sik KIM
  • Publication number: 20200407521
    Abstract: Embodiments relate to a polyamide-imide film that has a clean appearance and transparency and is excellent in antiblocking properties, a process for preparing the same, and a display front panel and a display device comprising the same. The polyamide-imide film comprises a polyamide-imide polymer formed by polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound; and a filler, wherein the dicarbonyl compound comprises a first dicarbonyl compound and a second dicarbonyl compound, the first dicarbonyl compound and the second dicarbonyl compound are structural isomers to each other, and the FH value of Equation 1 is 0.5 or less.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 31, 2020
    Inventors: Dae Seong OH, Jung Hee KI, Sunhwan KIM, Han Jun KIM, Jin Woo LEE, Sang Hun CHOI
  • Publication number: 20200407522
    Abstract: Embodiments relate to a polyamide-based film that is colorless and transparent, is excellent in mechanical properties and optical properties, has a wide angle of view by securing at least a certain level of luminance at various angles, and, in particular, has gloss characteristics similar to those of glass, a process for preparing the same, and a cover window comprising the same. The polyamide-based film comprises a polyamide-based polymer, wherein when the polyamide-based film is placed on a surface light source, light is irradiated from the surface light source, and the luminance value (L0) measured in the normal direction of the surface light source is 100%, the luminance value (L50) measured in the direction of 50┬░ from the normal direction of the surface light source is 25% or more.
    Type: Application
    Filed: June 26, 2020
    Publication date: December 31, 2020
    Inventors: Sang Hun Choi, Jin Woo Lee, Dae Seong Oh, Jung Hee Ki, Sunhwan Kim, Han Jun Kim, Heung Sik Kim
  • Patent number: 10872879
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: December 22, 2020
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi
  • Publication number: 20200391761
    Abstract: A system and method are disclosed for overheight vehicle impact avoidance and incident detection. A detection subsystem of the system determines whether an incoming vehicle is clear to pass, depending at least on its height. The detection subsystem relies on distance sensors located along the freeway to detect the highest point of the vehicle and outputs an indication of whether the vehicle can pass. A warning subsystem receives the indication that a vehicle is overheight and provides a warning indication to the driver about the vehicle's inability to pass an upcoming structure. The warning subsystem may also perform a variety of other tasks, such as, for example, logging a variety of information about the vehicle and the incident, sending data about the incident locally to a central command, and generating reports.
    Type: Application
    Filed: June 15, 2020
    Publication date: December 17, 2020
    Inventors: George Z. Voyiadjis, Aly Mousaad Aly, Jin-Woo Choi
  • Patent number: 10869049
    Abstract: The present invention relates to an image encoding/decoding method and device. The image decoding method according to the present invention comprises the steps of: decoding a prediction mode index; determining whether the prediction mode index indicates function-based intra prediction; inducing a parameter (s) for generating a function, when the prediction mode index indicates the function-based intra prediction; generating the function on the basis of the induced parameter (s); and performing intra prediction by using the generated function.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: December 15, 2020
    Assignee: RESEARCH & BUSINESS FOUNDATION SUNGYUNWAN UNIVERSITY
    Inventors: Seung Hyun Cho, Jung Won Kang, Hyun Suk Ko, Sung Chang Lim, Jin Ho mes Lee, Ha Hyun Lee, Dong San Jun, Hui Yong Kim, Byeung Woo Jeon, Nam Uk Kim, Seung Su Jeon, Jin Soo Choi
  • Patent number: 10864549
    Abstract: The present invention provides a method and a kit for half coating nanoparticles. According to the present invention, nanoparticles can be half coated in a relatively simple and economical process that can replace complicated processes, such as chemical synthesis, of a conventional Janus nanoparticle-preparing method.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: December 15, 2020
    Assignee: Sogang University Research Foundation
    Inventors: Jeong Woo Choi, Jin Ho Yoon, Sang Uk Kim
  • Patent number: 10866000
    Abstract: Disclosed herein is an air conditioner. The air conditioner includes a housing having an inlet port, a heat exchanger configured to exchange heat with air flowing in through the inlet port, a blowing unit configured to circulate air into or out of the housing, and a discharge unit rotatably provided relative to the housing, the discharge unit having a first outlet port formed in a portion of the outer circumferential surface to discharge the heat-exchanged air and a second outlet port formed in another portion of the outer circumferential surface to discharge the heat-exchanged air at different speed from the air discharged from the first outlet port.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: December 15, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang-woo Jung, Jin-Gyun Kim, Yeon-seob Yun, Weon Seok Choi
  • Publication number: 20200386140
    Abstract: A thermoelectric generator for a vehicle utilizing heat of exhaust gas discharged from an engine of the vehicle includes a heat exchange unit, through which a coolant circulates, a thermoelectric generation unit for converting thermal energy of exhaust gas into electrical energy, a first flow passage for guiding the exhaust gas to pass through the heat exchange unit, a second flow passage for guiding the exhaust gas to pass through the thermoelectric generation unit, a third flow passage for guiding the exhaust gas to bypass the heat exchange unit and the thermoelectric generation unit without passing therethrough, a first valve for opening or closing the first flow passage, a second valve for selectively opening or closing the second flow passage and the third flow passage, and a driving unit for operating the first valve and the second valve by a single power source.
    Type: Application
    Filed: October 2, 2019
    Publication date: December 10, 2020
    Inventors: Ho Chan An, Byung Wook Kim, Hoo Dam Lee, Jin Woo Kwak, Kwang Min Choi, Jong Ho Seon