Patents by Inventor Jin Woo Hahn
Jin Woo Hahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230021394Abstract: Disclosed is a thin film stress control-based coating method for large-area coating. The method uses a two-step coating process in which a first coating layer that is a relatively low-hardness layer is primarily formed on a base member and a second coating layer that is a relatively high-hardness layer is secondarily formed on the first coating layer. The method can form a high-density coating structure that is hardly peeled off over a relatively large area compared to conventional coating methods by suppressing internal stress of the coating layers of the coating structure. Further disclosed is a coating structure manufactured by the same method.Type: ApplicationFiled: September 15, 2021Publication date: January 26, 2023Inventors: Hong Rae Wang, Yeong Jun Son, Yo Han Ryu, In Haeng Lee, In Seop Byeon, Kyung Seung Koo, Jin Woo Hahn, Yong Soo Lee, Jae Ho Byun
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Patent number: 9767950Abstract: A multilayer electronic component may include: a magnetic body in which a plurality of magnetic layers are stacked; and conductor patterns formed on the magnetic body. The magnetic body may include: metal magnetic particles; an oxide film formed on a surface of the metal magnetic particle as a first oxide obtained by oxidation of at least one component of the metal magnetic particle; and a filling portion formed in a space between the metal magnetic particles as a second oxide obtained by oxidization of at least one component of the metal magnetic particle. At least one of the first oxide and the second oxide is provided between adjacent metal magnetic particles, and an oxide film formed on a surface of a metal magnetic particle forms a neck portion with an oxide film formed on a surface of an adjacent metal magnetic particle.Type: GrantFiled: May 19, 2014Date of Patent: September 19, 2017Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myeong Gi Kim, Il Jin Park, Ho Yoon Kim, Jin Woo Hahn, Min Kyoung Cheon
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Patent number: 9654079Abstract: A composite electronic component may include: a composite body including a capacitor formed of a ceramic body in which a plurality of dielectric layers and first and second internal electrodes are laminated, and an inductor formed of a magnetic body including a coil; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on the second end surface of the composite body; and a ground terminal disposed on one or more of upper and lower surfaces and the first end surface of the capacitor of the composite body. The capacitor is adjacent to the inductor.Type: GrantFiled: June 25, 2014Date of Patent: May 16, 2017Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soo Hwan Son, Jin Woo Hahn, Joon Hwan Kwag, Kyoung No Lee, Myeong Gi Kim, Hwan Soo Lee
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Patent number: 9536647Abstract: There is provided a multi-layered chip electronic component including: a multi-layered body formed by stacking a plurality of magnetic layers; and conductive patterns disposed between the plurality of magnetic layers and electrically connected in a lamination direction to form coil patterns, wherein in a case in which a single coil pattern in the coil pattern is projected in the length and width directions of the multi-layered body, when an area of the magnetic layer inside of the coil pattern is defined as Ai and an area of the magnetic layer outside of the coil pattern is defined as Ao, 0.40?Ai:Ao?1.03 is satisfied.Type: GrantFiled: December 14, 2012Date of Patent: January 3, 2017Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Woo Hahn, So Yeon Song, Sung Yong An, Byeong Cheol Moon, Soo Hwan Son
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Patent number: 9530554Abstract: Disclosed herein is a multilayer coil component including a copper-nickel mixture for an internal electrode, in which a nickel content in the internal electrode is adjusted to thereby optimize the area ratio of nickel to copper while the copper-nickel mixture is used for a material for the internal electrode of the multilayer coil component, thereby preventing deterioration in characteristics of the multilayer coil component, so that ferrite characteristics of the multilayer coil component, such as, impedance (Z), inductance (L), and the like, can be improved.Type: GrantFiled: November 19, 2013Date of Patent: December 27, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soo Hwan Son, Jin Woo Hahn, Byeong Cheol Moon
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Patent number: 9390862Abstract: A composite electronic component may include: a composite body having a capacitor and an inductor coupled to each other therein; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on a lower surface of the capacitor of the composite body; and a ground terminal disposed on the lower surface of the capacitor of the composite body. The capacitor may be coupled to a side surface of the inductor.Type: GrantFiled: May 12, 2014Date of Patent: July 12, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byeong Cheol Moon, Jae Hoon Lee, Myeong Gi Kim, Jin Woo Hahn, Soo Hwan Son
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Patent number: 9349512Abstract: There is provided a multi-layered chip electronic component including: a multi-layered body including a 2016-sized or less and a plurality of magnetic layers; conductive patterns electrically connected in a stacking direction to form coil patterns, within the multi-layered body; and non-magnetic gap layers formed over a laminated surface of the multi-layered body between the multi-layered magnetic layers and having a thickness Tg in a range of 1 ?m?Tg?7 ?m, wherein the number of non-magnetic gap layers may have the number of gap layers in a range between at least four layers among the magnetic layers and a turns amount of the coil pattern.Type: GrantFiled: October 2, 2012Date of Patent: May 24, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jin Woo Hahn, Myeong Gi Kim, Sung Yong An, Ic Seob Kim, Byeong Cheol Moon
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Patent number: 9183979Abstract: The present invention relates to a chip inductor including: a metal-polymer composite in which metal particles and polymer are mixed; a wiring pattern provided inside the metal-polymer composite to form a coil; an external electrode provided in a portion of an outer peripheral surface of the metal-polymer composite; and an insulating portion provided between the metal-polymer composite and the wiring pattern and between the metal-polymer composite and the external electrode, and a method for manufacturing the same.Type: GrantFiled: December 21, 2012Date of Patent: November 10, 2015Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Yeon Cha, Kang Heon Hur, Sung Jin Park, Dong Jin Jeong, Jung Min Park, Hyeog Soo Shin, Sung Yong An, Hwan Soo Lee, Young Do Kweon, Jin Woo Hahn
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Patent number: 9123460Abstract: Disclosed herein are a ferrite composition for a high frequency bead in that a part of Fe in M-type hexagonal ferrite represented by BaFe12O19 is substituted with at least one metal selected from a group consisting of 2-valence, 3-valence and 4-valence metals, as well as a chip bead material using the same. According to embodiments of the present invention, the dielectric composition is characterized in that a part of Fe as a constituent of M-type hexagonal barium ferrite is substituted by other metals, to thus decrease a sintering temperature to 920° C. or less without using any additive for low temperature sintering. Moreover, because of high SRF properties, the inventive composition is applicable to a multilayer type chip bead used at a high frequency of more than several hundreds MHz and a magnetic antenna.Type: GrantFiled: October 3, 2011Date of Patent: September 1, 2015Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Yong An, Jin Woo Hahn, Jeong Wook Kim, Sung Lyoung Kim, So Yeon Song, Soo Hwan Son, Ic Seob Kim
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Publication number: 20150213960Abstract: A composite electronic component may include: a composite body having a capacitor and an inductor coupled to each other therein; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on a lower surface of the capacitor of the composite body; and a ground terminal disposed on the lower surface of the capacitor of the composite body. The capacitor may be coupled to a side surface of the inductor.Type: ApplicationFiled: May 12, 2014Publication date: July 30, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byeong Cheol Moon, Jae Hoon Lee, Myeong Gi Kim, Jin Woo Hahn, Soo Hwan Son
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Publication number: 20150109074Abstract: A composite electronic component may include: a composite body including a capacitor formed of a ceramic body in which a plurality of dielectric layers and first and second internal electrodes are laminated, and an inductor formed of a magnetic body including a coil; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on the second end surface of the composite body; and a ground terminal disposed on one or more of upper and lower surfaces and the first end surface of the capacitor of the composite body. The capacitor is adjacent to the inductor.Type: ApplicationFiled: June 25, 2014Publication date: April 23, 2015Inventors: Soo Hwan SON, Jin Woo HAHN, Joon Hwan KWAG, Kyoung No LEE, Myeong Gi KIM, Hwan Soo LEE
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Publication number: 20150102888Abstract: A multilayer electronic component may include: a magnetic body in which a plurality of magnetic layers are stacked; and conductor patterns formed on the magnetic body. The magnetic body may include: metal magnetic particles; an oxide film formed on a surface of the metal magnetic particle as a first oxide obtained by oxidation of at least one component of the metal magnetic particle; and a filling portion formed in a space between the metal magnetic particles as a second oxide obtained by oxidization of at least one component of the metal magnetic particle. At least one of the first oxide and the second oxide is provided between adjacent metal magnetic particles, and an oxide film formed on a surface of a metal magnetic particle forms a neck portion with an oxide film formed on a surface of an adjacent metal magnetic particle.Type: ApplicationFiled: May 19, 2014Publication date: April 16, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myeong Gi KIM, Il Jin Park, Ho Yoon Kim, Jin Woo Hahn, Min Kyoung Cheon
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Publication number: 20140292460Abstract: The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: a ferrite-organic body; an internal electrode laminated on the ferrite-organic body along a thickness direction of the ferrite-organic body to have a multilayer structure; a metal-organic body constituting a device body with the ferrite-organic body by covering the ferrite-organic body; and an external electrode covering the device body to be electrically connected to the internal electrode.Type: ApplicationFiled: November 15, 2013Publication date: October 2, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ho Yoon KIM, Myeong Gi KIM, Il Jin PARK, Jin Woo HAHN, Min Kyoung CHEON
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Publication number: 20140184377Abstract: Disclosed herein is an inductor including: a substrate; an insulating part provided on the substrate; and a conductive pattern part provided in the insulating part, wherein the insulating part includes first and second insulating parts that are provided at regions physically separated from each other, the first and second insulating parts being made of materials of which at least one of dielectric constant and heat resistance are different. In the inductor according to the present invention, high Q and L values may be implemented, and deformation by heat treatment may also be decreased, thereby making it possible to improve reliability.Type: ApplicationFiled: December 27, 2013Publication date: July 3, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Suk KIM, Sung Kwon WI, Jong Yun LEE, Jin Woo HAHN, Young Seuck YOO
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Publication number: 20140139309Abstract: Disclosed herein is a multilayer coil component including a copper-nickel mixture for an internal electrode, in which a nickel content in the internal electrode is adjusted to thereby optimize the area ratio of nickel to copper while the copper-nickel mixture is used for a material for the internal electrode of the multilayer coil component, thereby preventing deterioration in characteristics of the multilayer coil component, so that ferrite characteristics of the multilayer coil component, such as, impedance (Z), inductance (L), and the like, can be improved.Type: ApplicationFiled: November 19, 2013Publication date: May 22, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soo Hwan SON, Jin Woo HAHN, Byeong Cheol MOON
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Patent number: 8729999Abstract: There is provided a multi-layered chip electronic component, including: a multi-layered body including a plurality of first magnetic layers on which conductive patterns are formed; and second magnetic layers interposed between the first magnetic layers within the multi-layered body, wherein the conductive patterns are electrically connected to form coil patterns in a stacking direction, and when a thickness of the second magnetic layer is defined as Ts and a thickness of the conductive pattern is defined as Te, 0.1?Ts:Te?0.3 is satisfied.Type: GrantFiled: October 25, 2012Date of Patent: May 20, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jin Woo Hahn, Sung Yong An, Soo Hwan Son, Ic Seob Kim, Byeong Cheol Moon
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Publication number: 20140062643Abstract: There is provided a multi-layered chip electronic component including: a multi-layered body formed by stacking a plurality of magnetic layers; and conductive patterns disposed between the plurality of magnetic layers and electrically connected in a lamination direction to form coil patterns, wherein in a case in which a single coil pattern in the coil pattern is projected in the length and width directions of the multi-layered body, when an area of the magnetic layer inside of the coil pattern is defined as Ai and an area of the magnetic layer outside of the coil pattern is defined as Ao, 0.40?Ai:Ao?1.03 is satisfied.Type: ApplicationFiled: December 14, 2012Publication date: March 6, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO" L TO,Inventors: Jin Woo Hahn, So Yeon Song, Sung Yong An, Byeong Moon, Soo Hwan Son
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Publication number: 20130335184Abstract: There is provided a multi-layered chip electronic component including: a multi-layered body including a 2016-sized or less and a plurality of magnetic layers; conductive patterns electrically connected in a stacking direction to form coil patterns, within the multi-layered body; and non-magnetic gap layers formed over a laminated surface of the multi-layered body between the multi-layered magnetic layers and having a thickness Tg in a range of 1 ?m?Tg?7 ?m, wherein the number of non-magnetic gap layers may have the number of gap layers in a range between at least four layers among the magnetic layers and a turns amount of the coil pattern.Type: ApplicationFiled: October 2, 2012Publication date: December 19, 2013Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Woo HAHN, Myeong Gi KIM, Sung Yong AN, Ic Seob KIM, Byeong Cheol MOON
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Publication number: 20130335185Abstract: There is provided a multi-layered chip electronic component, including: a multi-layered body including a plurality of first magnetic layers on which conductive patterns are formed; and second magnetic layers interposed between the first magnetic layers within the multi-layered body, wherein the conductive patterns are electrically connected to form coil patterns in a stacking direction, and when a thickness of the second magnetic layer is defined as Ts and a thickness of the conductive pattern is defined as Te, 0.1?Ts:Te?0.3 is satisfied.Type: ApplicationFiled: October 25, 2012Publication date: December 19, 2013Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jin Woo HAHN, Sung Yong AN, Soo Hwan SON, Ic Seob KIM, Byeong Cheol MOON
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Patent number: 8597534Abstract: There are provided a composition for a ceramic electronic component having excellent sinterability and magnetic characteristics (Q), a manufacturing method thereof, and an electronic component using the same. The magnetic material composition for the ceramic electronic component is composed of ferric oxide (Fe2O3) of 47.0 to 49.0 parts by mole, nickel oxide (NiO) of 16.0 to 24.0 parts by mole, zinc oxide (ZnO) of 18.0 to 25.0 parts by mole, and copper oxide (CuO) of 7.0 to 13.0 parts by mole, wherein a portion of ferric oxide may be substituted with boron oxide (B2O3). The ceramic electronic component manufactured by using the magnetic material composition for the ceramic electronic component has an excellent Q.Type: GrantFiled: February 24, 2011Date of Patent: December 3, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Sung Yong An, Ic Seob Kim, Sung Lyoung Kim, Soo Hwan Son, Jin Woo Hahn