Abstract: A package for a semiconductor device having a fan-out structure in which input/output terminals are disposed adjacent to at least one first semiconductor chip and electrically connected to the at least one first semiconductor chip may include a second semiconductor chip spaced apart from the input/output terminals and be opposed to the at least one first semiconductor chip. The semiconductor device package may ensure an improved degree of integration and may improve connection stability between the input/output terminals and wirings. Accordingly, a reliability of the semiconductor device package may be enhanced.

Abstract: An organic light emitting display apparatus includes pixel electrodes formed on a substrate for respective pixels. Auxiliary electrodes are formed on at least parts of the periphery of the pixel electrodes. A first organic function layer is formed on the substrate and covers the pixel electrodes and the auxiliary electrodes. An emissive layer is formed on the first organic function layer for the respective pixels. A second organic function layer is formed on the substrate and covers the emissive layer. A cathode electrode is formed on the entire substrate and faces the pixel electrodes and covers the second organic function layer. Secondary cathode electrodes are formed, on at least parts of the auxiliary electrodes, in contact with the cathode electrode through a contact hole.

Abstract: An integrated circuit device package may include a flexible substrate having a first wiring, an integrated circuit device having a second wiring, a flexible insulation structure having a first opening and a second opening exposing the first wiring and the second wiring, respectively, a third wiring electrically connecting the first wiring to the second wiring, and a flexible protection member covering the third wiring. A stacked flexible integrated circuit device package may include a flexible substrate, a first flexible integrated circuit device including a first connection pad, a second flexible integrated circuit device including a second connection pad, a connection wiring electrically connecting the first and the second connection pads to an external device, and a flexible protection member disposed on the second flexible integrated circuit device.

Abstract: An organic light emitting display apparatus includes a plurality of first electrodes disposed in each of a plurality of pixels on a substrate, a plurality of lower auxiliary electrodes insulated from the first electrodes and in which the lower auxiliary electrodes are disposed in a first direction, an organic layer disposed on the first electrodes, and a second electrode facing the first electrodes and covering the organic layer. The second electrode is disposed on substantially an entire surface of the substrate. The organic light emitting display apparatus further includes a plurality of upper auxiliary electrodes disposed on the second electrode in a second direction.

Abstract: An organic light emitting display apparatus includes pixel electrodes formed on a substrate for respective pixels. Auxiliary electrodes are formed on at least parts of the periphery of the pixel electrodes. A first organic function layer is formed on the substrate and covers the pixel electrodes and the auxiliary electrodes. An emissive layer is formed on the first organic function layer for the respective pixels. A second organic function layer is formed on the substrate and covers the emissive layer. A cathode electrode is formed on the entire substrate and faces the pixel electrodes and covers the second organic function layer. Secondary cathode electrodes are formed, on at least parts of the auxiliary electrodes, in contact with the cathode electrode through a contact hole.

Abstract: An image forming apparatus includes a plurality of head chips which comprise a plurality of nozzles to jet ink to a print medium according to print data, and a controller which compares jetting gaps of the head chips to the print medium with a reference jetting gap and determines jetting times of the head chips.

Abstract: Provided is a stacked semiconductor package. The present invention includes: a substrate having first and second connective pads provided on an upper surface thereof; a first cascade chip laminate which is loaded on the substrate and in which a plurality of first semiconductor chips are stacked in multiple stages to externally expose a first bonding pad wire-bonded through the first connective pad and a first conductive wire; a second cascade chip laminate in which a plurality of second semiconductor chips are stacked in the multiple stages to externally expose a second bonding pad wire-bonded through the second connective pad and a second conductive wire to an area corresponding to the first bonding pad; and a joint part for joining the first cascade chip laminate and the second cascade chip laminate.

Abstract: A 3D semiconductor device includes a conductive plate defining four sides and four recesses formed in the four sides, respectively. The conductive plate has first and second surfaces opposite to each other. A plurality of conductive leads are located in the recesses, respectively, and the conductive leads have first and second surfaces opposite to each other. A semiconductor die is attached onto the central area of the conductive plate. A plurality of conductive wires electrically connects the semiconductor die to the conductive leads. An encapsulant encloses, as in a capsule, the conductive plate, the conductive leads, the semiconductor die, and the conductive wires in such a manner that the first and second surfaces of the conductive plate and the first and second surfaces of the conductive leads are exposed to the outside.

Abstract: The present invention relates to a turbo blower and a high speed rotation body used in the turbo blower. The turbo blower includes: i) a motor having a motor shaft; ii) a gear housing accommodating a bull gear fitted on the motor shaft and a pinion gear engaged with the bull gear; iii) a high speed rotation body that includes a rotary shaft having the pinion gear on the external circumferential surface, an impeller fitted on one end of the rotary shaft, and a rotation body housing accommodating the rotary shaft, the pinion gear, and at least one first composite bearing and partially cut off to expose the pinion gear, and is partially accommodated in the gear housing; and iv) a scroll portion covering the impeller and discharging compressed air.

Abstract: Provided is a gas compressor with a variable diffuser system capable of suppressing stall and surge. The gas compressor includes i) an impeller fixed to a rotation shaft and having a plurality of blades each including a wing surface and an edge surface on an outer circumferential surface thereof; ii) a shroud surrounding the wing surface; iii) a ring valve installed on a diffuser passage connected with an outlet of the impeller and moving in a direction parallel to the rotation shaft to open and close the diffuser passage; iv) a plurality of veins installed in a circumferential direction of the diffuser passage outside the ring valve in the diffuser passage; and v) an actuator coupled with the ring valve and the plurality of veins to sequentially control movement of the ring valve and rotational angles of the veins.

Abstract: A printing method and apparatus using a shuttle thermal print head (TPH), which can print by moving the TPH in a transverse direction. The apparatus and printing method include (a) printing an image on a medium using the TPH while feeding the medium in a positive longitudinal direction; (b) moving the TPH in the transverse direction by a predetermined value; and (c) printing an image on the medium using the TPH while feeding the medium in a negative longitudinal direction.

Abstract: A 3D semiconductor device includes a conductive plate defining four sides and four recesses formed in the four sides, respectively. The conductive plate has first and second surfaces opposite to each other. A plurality of conductive leads are located in the recesses, respectively, and the conductive leads have first and second surfaces opposite to each other. A semiconductor die is attached onto the central area of the conductive plate. A plurality of conductive wires electrically connects the semiconductor die to the conductive leads. An encapsulant encloses, as in a capsule, the conductive plate, the conductive leads, the semiconductor die, and the conductive wires in such a manner that the first and second surfaces of the conductive plate and the first and second surfaces of the conductive leads are exposed to the outside.

Abstract: Provided are a method and apparatus for driving printing elements of a printer head in an image forming apparatus. The method includes calculating a number of driving groups among multiple driving groups in which at least a first predetermined number of printing elements are driven for each print line. The method calculates a number of print lines wherein the calculated number of driving groups are not less than a second predetermined number. The number of driving groups are increased if the calculated print lines is not less than a third predetermined number. Thus, it is possible to print with less power without a reduction in print quality or speed by controlling the driving of the printer head. In addition, the overall size of the image forming apparatus can be reduced by using low-power power supply.

Abstract: An array type inkjet printer with a multi pass structure and a method of compensating an irregular nozzle defect thereof. The array type inkjet printer includes a scattering portion that is configured to provide a nozzle selection pattern in which a plurality of ink dots per color is arranged in a zigzag shape over a predetermined ink scattering area. The scattering portion is also configured to select a dimension of the ink scattering area along which the dots are arranged in the zigzag shape on the basis of resolution selected for printing of printing data. The inkjet printer further includes a head controller that is configured to control discharge of ink from a nozzle according to the zigzag arrangement of the dots in the nozzle selection pattern.

Abstract: An image forming apparatus includes a plurality of head chips which comprise a plurality of nozzles to jet ink to a print medium according to print data, and a controller which compares jetting gaps of the head chips to the print medium with a reference jetting gap and determines jetting times of the head chips.

Abstract: A method of driving recording elements of a print head in an image forming apparatus for printing an image on media, for example, nozzles ejecting ink on the media in an inkjet printer, and an image forming apparatus employing the method are provided. The method includes: obtaining, for each of a plurality of drive tables, a maximum number of recording elements to be simultaneously driven when printing the image, according to a drive order in each of the plurality of drive tables, each drive table comprising drive order information about the order of driving the recording elements; selecting the drive table of the plurality of tables in which the obtained maximum number of the recording elements to be simultaneously driven is smallest; and driving the recording elements using the selected drive table.

Abstract: An array type inkjet printer with a multi pass structure and a method of compensating an irregular nozzle defect thereof. The array type inkjet printer includes a scattering portion that is configured to provide a nozzle selection pattern in which a plurality of ink dots per color is arranged in a zigzag shape over a predetermined ink scattering area. The scattering portion is also configured to select a dimension of the ink scattering area along which the dots are arranged in the zigzag shape on the basis of resolution selected for printing of printing data. The inkjet printer further includes a head controller that is configured to control discharge of ink from a nozzle according to the zigzag arrangement of the dots in the nozzle selection pattern.

Abstract: Individual pieces of film adhesive (42) are placed on a support surface (46). Diced semiconductor chips (24) are individually placed on the individual pieces of the film adhesive thereby securing the diced semiconductor chips to the support surface to create first chip subassemblies (52). The diced semiconductor chip and support surface of each of a plurality of the first chip subassemblies are electrically connected, such as by wires (54), to create second chip subassemblies ((56). At least a portion of at least some of the second chip subassemblies are encapsulated, such as with molding compound (58), to create semiconductor chip packages (60).

Abstract: A system for peeling semiconductor chips from tape is provided with a nose on a housing. The nose has transverse dimensions smaller than the transverse dimensions of a target chip. Apertures are provided through the nose from the housing. Vacuum ports are provided in the housing adjacent the nose. A vacuum source controllably connects to the apertures and the vacuum ports. The nose is positioned adjacent a tape attached on the opposite side thereof to the target chip. Vacuum is applied to attract the tape against the nose and the adjacent portions of the housing to peel the tape from the peripheral edges of the target chip while supporting the tape in the center of the target chip.

Abstract: A method and device to detect defective nozzles of a wide array head, the method including printing a predetermined test pattern, detecting reflectances of lights of three light sources by scanning the printed predetermined test pattern with the lights of the three light sources, and detecting a defective nozzle using each detected reflectance.