Patents by Inventor Jin Wu

Jin Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11709009
    Abstract: An ice bucket for a refrigerator appliance, includes a bucket body; an auger provided inside the bucket and including an auger shaft rotatable about a first shaft axis and a collet at a first end of the auger shaft and including an axially beveled surface formed circumferentially around the auger shaft; and an agitator provided in the bucket in mechanical communication with the auger, the agitator including an agitator shaft rotatable about a second shaft axis non-parallel to the first shaft axis, a plurality of first tines extending radially from the agitator shaft within the bucket body to engage ice therein, and a projection that extends perpendicularly from the agitator shaft opposite the plurality of tines. The projection engages with the axially beveled surface to oscillate the agitator.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: July 25, 2023
    Assignee: Haier US Appliance Solutions, Inc.
    Inventors: Yayu Song, Qianmao Zhou, Bo Yan, Lixin Zhou, Jun Teng, Xiaoyang Jiang, Jin Wu, Robert Charles Pfaffinger, Jr.
  • Publication number: 20230180713
    Abstract: An unloading mechanism and an unloading device with double food stirring trays, the unloading mechanism with double food stirring trays comprises a food stirring device and a driving device, and the food stirring device comprises a rotating shaft, an upper food stirring tray and a lower food stirring tray; the upper food stirring tray comprises upper food stirring plates, the lower food stirring tray comprises lower food stirring plates, the number of the lower food stirring plates is larger than that of the upper food stirring plates; the outer wall of the rotating shaft is provided with an installation groove, and the lower food stirring plates are provided with installation strips matched with the installation groove; and the unloading device comprises a food storage bin, a transition bin and the unloading mechanism with double food stirring trays.
    Type: Application
    Filed: February 13, 2023
    Publication date: June 15, 2023
    Inventors: Jin Wu, Wenfeng Hu, Xin Hu
  • Publication number: 20230147119
    Abstract: The present application relates to the technical field of wastewater treatment and rapid pollutant detection, in particular to a chitosan-polyacrylamide composite porous hydrogel, preparation and use thereof, and a metal ion-adsorbing and detecting reagent and method. The chitosan-polyacrylamide composite porous hydrogel of the present application is prepared by in situ polymerization of a chitosan sol, an acrylamide, a crosslinking agent and a surfactant into a mixed solution comprising liquid droplets, followed by steps of curing, washing, and freeze-drying. The present application further provides a metal ion-detecting reagent, which is obtained by adsorbing a color developing agent into the chitosan-polyacrylamide composite porous hydrogel as described above, wherein the color developing agent is a dye that changes color when encountering metal ions. The chitosan-polyacrylamide composite porous hydrogel of the present application has balanced mechanical properties and porosity.
    Type: Application
    Filed: February 4, 2022
    Publication date: May 11, 2023
    Inventors: Shuang Li, Zhixian Gao, Dianpeng Han, Jialei Bai, Yuan Peng, Jin Wu, Kang Qin, Shuyue Ren, Yu Wang, Huanying Zhou, Tie Han, Xiaoxiao Lin
  • Publication number: 20230129406
    Abstract: An ice bucket for a refrigerator appliance, includes a bucket body; an auger provided inside the bucket and including an auger shaft rotatable about a first shaft axis and a collet at a first end of the auger shaft and including an axially beveled surface formed circumferentially around the auger shaft; and an agitator provided in the bucket in mechanical communication with the auger, the agitator including an agitator shaft rotatable about a second shaft axis non-parallel to the first shaft axis, a plurality of first tines extending radially from the agitator shaft within the bucket body to engage ice therein, and a projection that extends perpendicularly from the agitator shaft opposite the plurality of tines. The projection engages with the axially beveled surface to oscillate the agitator.
    Type: Application
    Filed: May 7, 2020
    Publication date: April 27, 2023
    Inventors: Yayu Song, Qianmao Zhou, Bo Yan, Lixin Zhou, Jun Teng, Xiaoyang Jiang, Jin Wu, Robert Charles Pfaffinger, JR.
  • Patent number: 11631240
    Abstract: The present disclosure provides a method, apparatus and system for identifying target objects. The method includes: clipping out a target image from an acquired image, wherein the target image involves a plurality of target objects to be identified that are stacked; adjusting a height of the target image to a preset height, wherein a height direction of the target image corresponds to a direction in which the plurality of target objects are stacked; extracting a feature map of the adjusted target image; segmenting the feature map in a dimension corresponding to the height direction of the target image to obtain a preset number of segment features; and identifying the target objects based on each of the preset number of segment features.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: April 18, 2023
    Assignee: SENSETIME INTERNATIONAL PTE. LTD.
    Inventors: Jin Wu, Kaige Chen, Shuai Yi
  • Patent number: 11618753
    Abstract: The disclosure relates to compounds of formula I which are useful as kinase modulators including RIPK 1 modulation. The disclosure also provides methods of making and using the compounds for example in treatments related to necrosis or inflammation as well as other indications.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: April 4, 2023
    Assignee: Bristol-Myers Squibb Company
    Inventors: Scott Hunter Watterson, Murugaiah Andappan Murugaiah Subbaiah, Carolyn Diane Dzierba, Hua Gong, Jason M. Guernon, Junqing Guo, Amy C. Hart, Guanglin Luo, John E. Macor, William J. Pitts, Jianliang Shi, Brian Lee Venables, Carolyn A. Weigelt, Yong-Jin Wu, Zhizhen Barbara Zheng, Sing-Yuen Sit, Jie Chen
  • Patent number: 11605659
    Abstract: According to an aspect, a sensor packaging structure includes a sensor die having a first surface and a second surface opposite the first surface, where the sensor die defines a sensor edge disposed between the first surface and the second surface. The sensor packaging structure includes a bonding material having a first surface and a second surface opposite the second surface, where the bonding material defines a bonding material edge disposed between the first surface of the bonding material and the second surface of the bonding material. The sensor packaging structure includes a transparent material, where the bonding material couples the sensor die to the transparent material. The sealing material is disposed on an interface between the sensor die and the bonding material, and at least one of a portion of the sensor edge or a portion of the bonding material edge.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: March 14, 2023
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Weng-Jin Wu
  • Publication number: 20230063200
    Abstract: A method includes disposing a sheet of glass on a front side of a semiconductor substrate that includes at least one image sensor die, attaching the sheet of glass to the at least one image sensor die by a bead of adhesive material disposed on an edge of the at least one image sensor die, and sawing the semiconductor substrate from a back side to form a trench along a side of the at least one image sensor die. The trench extends through a thickness of the semiconductor substrate and through a part of a thickness of the sheet of glass. The method further includes filling the trench with a molding material to form a layer of molding material on a sidewall of the at least one image sensor die, and singulating the semiconductor substrate to isolate an individual image sensor package enclosing the at least one image sensor die.
    Type: Application
    Filed: August 25, 2022
    Publication date: March 2, 2023
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Weng-Jin WU, Yusheng LIN
  • Patent number: 11591975
    Abstract: A throttle valve includes a housing, an electric motor and an insert. The electric motor is accommodated in the housing and drives opening and closing of an air flow passage of the throttle valve. The insert is partially enclosed in the housing and includes an electrically conductive insert body at least partially accessibly exposed from the housing, and an electrically conductive electric motor connector. One end of the motor connector is electrically connected to the insert body, and the other end thereof is electrically connected to the electrically conductive housing of the electric motor.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: February 28, 2023
    Assignee: VITESCO TECHNOLOGIES GMBH
    Inventors: Jin Wu, Zhengmao Wei
  • Publication number: 20230042674
    Abstract: An impact-resistant polystyrene resin includes a continuous phase and a plurality of particles dispersed in the continuous phase. The average particle size of the particles is about 0.1 to 4.0 µm, and the average distance between the particles is about 0.3 to 5.0 µm. The impact-resistant polystyrene resin is made from a polystyrene composition including a polystyrene plastic, a styrene block copolymer, a processing aid, and an antioxidant.
    Type: Application
    Filed: December 22, 2021
    Publication date: February 9, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kuan-Yeh HUANG, Jin-An WU, Fu-Ming CHIEN, Yun-Chen CHANG, Fan-Jie LIN
  • Patent number: 11567057
    Abstract: The present invention discloses a landslide experimental device for remotely controlling and simulating a constant seepage flow and weight load and an experimental method thereof in centrifuge test. The landslide experimental device includes a model box, a landslide device, a near-constant water flow control box, remote control devices and a water outlet pipe. The landslide device comprises a landslide model, a load balancing device, a weight storage device, an angle control panel and a tension bar. The remote control devices are arranged at the control box water outlet, at the control box water inlet, on the tension bar, on telescoping control sensors and on the weight storage device, respectively. With the present invention, the influences on the stability of landslide model with different landslide angles under the condition of the seepage flow and weight load can be simulated.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: January 31, 2023
    Inventors: Huiming Tang, Kun Fang, Yaofei Jiang, Yi Zhang, Jin Wu, Qiangqiang Jiang, Qinwen Tan
  • Patent number: 11508766
    Abstract: Implementations of a molded image sensor chip scale package may include an image sensor having a first side and a second side. A first cavity wall and a second cavity wall may be coupled to the first side of the image sensor and extend therefrom. The first cavity wall and the second cavity wall may form a cavity over the image sensor. A transparent layer may be coupled to the first cavity wall and the second cavity wall. A redistribution layer (RDL) may be coupled to the second side of the image sensor. At least one interconnect may be directly coupled to the RDL. A mold material may encapsulate a portion of the RDL, a portion of the image sensor, and a side of each cavity wall, and a portion of the transparent layer.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: November 22, 2022
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Weng-Jin Wu
  • Patent number: 11508776
    Abstract: An image sensor semiconductor package (package) includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface. A complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die has a first surface with a photosensitive region and a second surface opposite the first surface of the CIS die. The second surface of the CIS die is coupled with the first surface of the PCB. A transparent cover is coupled over the photosensitive region of the CIS die. An image signal processor (ISP) is embedded within the PCB. One or more electrical couplers electrically couple the CIS die with the PCB. A plurality of electrical contacts on the second surface of the PCB are electrically coupled with the CIS die and with the ISP. The ISP is located between the plurality of electrical contacts of the second surface of the PCB and the CIS die.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: November 22, 2022
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Larry Kinsman, Yusheng Lin, Yu-Te Hsieh, Oswald Skeete, Weng-Jin Wu, Chi-Yao Kuo
  • Publication number: 20220348927
    Abstract: The present invention pertains to a pharmaceutical composition for preventing or treating squamous cell carcinoma, the pharmaceutical composition containing a highly expressed lncRNAs in esophageal squamous cell carcinoma (HERES) expression inhibitor. More specifically, the present invention pertains to a pharmaceutical composition which uses a HERES expression inhibitor to reduce the expression of HERES and affect Wnt signaling pathways, and thereby prevent or treat squamous cell carcinoma. The present inventors discovered that the expression pattern of HERES is related to the onset of squamous cell carcinoma, and found that HERES can be a target for treating squamous cell carcinoma.
    Type: Application
    Filed: May 8, 2020
    Publication date: November 3, 2022
    Applicants: IUCF-HYU(INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY), INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Jin-Wu NAM, Bo-Hyun YOU, Sang Kil LEE, Jung Ho YOON
  • Publication number: 20220349637
    Abstract: An ice making assembly includes an ice mold including two or more separable portions that collectively define one or more mold cavities. Each of the mold portions define a plurality of recessed passages that at least partially surround the mold cavity and are configured to receive evaporator conduit of a sealed refrigeration to cool the ice mold and facilitate formation of an ice billet.
    Type: Application
    Filed: November 13, 2020
    Publication date: November 3, 2022
    Inventors: Roy Teng, Jin Wu, Yayu Song, Bo Yan, Michael Zhou, Jason Jiang, Eddy Zhou
  • Publication number: 20220349642
    Abstract: An electric ice press is provided herein and may be utilized to reshape an initial ice billet into a sculpted ice nugget. The electric ice press may include a mold body having a first mold segment and a second mold segment movable relative to each other. Each mold segment may define a heater cavity that is configured for receiving a ceramic annular heater for heating the mold body to form the sculpted ice nugget.
    Type: Application
    Filed: November 13, 2020
    Publication date: November 3, 2022
    Inventors: Bo Yan, Yayu Song, Jin Wu, Roy Teng, Michael Zhou, Jason Jiang, Eddy Zhou
  • Patent number: 11482452
    Abstract: In a method of forming a contact plug in a semiconductor integrated circuit device, the contact plug may be formed in a process chamber of a substrate-processing apparatus. The process chamber may have a process space. The process chamber may include a substrate supporter placed in a lower region of the process space to support a semiconductor substrate, and a gas injector placed in an upper region of the process space to inject a gas to the semiconductor substrate. An insulating interlayer having a contact hole may be formed on the semiconductor substrate loaded into the process space. A nucleation layer may be formed on an inner surface of the contact hole and an upper surface of the insulating interlayer. A semi-bulk layer may be formed on the nucleation layer in a lower region of the contact hole. An inhibiting layer may be formed on the semi-bulk layer and the exposed nucleation layer. A main-bulk layer may be formed on the semi-bulk layer to fill the contact hole with the main-bulk layer.
    Type: Grant
    Filed: December 24, 2020
    Date of Patent: October 25, 2022
    Assignee: WONIK IPS CO., LTD
    Inventors: Won Jun Yoon, Woo Hoon Sun, Seok Kyu Choi, Tae Sung Han, Dong Woo Kim, Jin Wu Park
  • Patent number: 11458677
    Abstract: A selective laser sintering composition and a selective laser sintering 3D printing method employing the same are provided. The selective laser sintering composition includes a nanoscale inorganic powder and a thermoplastic vulcanizate powder. The temperature difference (?T) between the onset temperature for melting the thermoplastic vulcanizate powder and the onset temperature at which the thermoplastic crystallizes vulcanizate powder is greater than or equal to 10° C. The thermoplastic vulcanizate powder includes a thermoplastic and a crosslinked polymer. The temperature difference (?T) between the onset temperature for melting the thermoplastic and the onset temperature at which the thermoplastic crystallizes is greater than or equal to 10° C. , and the weight ratio of the thermoplastic to the crosslinked polymer is from 1:1 to 1:4.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: October 4, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jin-An Wu, Chih-Hung Lee, Fan-Jie Lin, Fu-Ming Chien, Chien-Ming Chen
  • Patent number: D987207
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: May 23, 2023
    Assignee: Beijing Kitten & Puppy Technology Co., Ltd.
    Inventors: Jin Wu, Jiefeng Liu, Lianhong Niu
  • Patent number: D987210
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: May 23, 2023
    Assignee: Beijing Kitten & Puppy Technology Co., Ltd.
    Inventors: Jin Wu, Dan Luo, Lianhong Niu