Patents by Inventor Jin Wu

Jin Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230063200
    Abstract: A method includes disposing a sheet of glass on a front side of a semiconductor substrate that includes at least one image sensor die, attaching the sheet of glass to the at least one image sensor die by a bead of adhesive material disposed on an edge of the at least one image sensor die, and sawing the semiconductor substrate from a back side to form a trench along a side of the at least one image sensor die. The trench extends through a thickness of the semiconductor substrate and through a part of a thickness of the sheet of glass. The method further includes filling the trench with a molding material to form a layer of molding material on a sidewall of the at least one image sensor die, and singulating the semiconductor substrate to isolate an individual image sensor package enclosing the at least one image sensor die.
    Type: Application
    Filed: August 25, 2022
    Publication date: March 2, 2023
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Weng-Jin WU, Yusheng LIN
  • Patent number: 11591975
    Abstract: A throttle valve includes a housing, an electric motor and an insert. The electric motor is accommodated in the housing and drives opening and closing of an air flow passage of the throttle valve. The insert is partially enclosed in the housing and includes an electrically conductive insert body at least partially accessibly exposed from the housing, and an electrically conductive electric motor connector. One end of the motor connector is electrically connected to the insert body, and the other end thereof is electrically connected to the electrically conductive housing of the electric motor.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: February 28, 2023
    Assignee: VITESCO TECHNOLOGIES GMBH
    Inventors: Jin Wu, Zhengmao Wei
  • Patent number: 11567057
    Abstract: The present invention discloses a landslide experimental device for remotely controlling and simulating a constant seepage flow and weight load and an experimental method thereof in centrifuge test. The landslide experimental device includes a model box, a landslide device, a near-constant water flow control box, remote control devices and a water outlet pipe. The landslide device comprises a landslide model, a load balancing device, a weight storage device, an angle control panel and a tension bar. The remote control devices are arranged at the control box water outlet, at the control box water inlet, on the tension bar, on telescoping control sensors and on the weight storage device, respectively. With the present invention, the influences on the stability of landslide model with different landslide angles under the condition of the seepage flow and weight load can be simulated.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: January 31, 2023
    Inventors: Huiming Tang, Kun Fang, Yaofei Jiang, Yi Zhang, Jin Wu, Qiangqiang Jiang, Qinwen Tan
  • Publication number: 20220415309
    Abstract: A speech processing system uses contextual data to determine the specific domains, subdomains, and applications appropriate for taking action in response to spoken commands and other utterances. Some applications may be given priority over others such that some applications are general request applications to which responsibility for processing an intent is to be assigned as long as contextual criteria are satisfied, while other applications are specific request applications to which responsibility for processing an intent is to be assigned only if the applications are specifically requested, if the contextual criteria of priority applications are not satisfied, and/or if certain contextual criteria associated with the specific request applications are satisfied.
    Type: Application
    Filed: June 24, 2021
    Publication date: December 29, 2022
    Inventors: Ponnu Jacob, Jingqian Zhao, Prathap Ramachandra, Jinning Wu, Uday Kumar Kollu, Xi Chen, Wenbo Yan, Charlotte Alizerine Dzialo, Liu Yang
  • Publication number: 20220415326
    Abstract: A multi-tier domain is provided for processing user voice queries and making routing decisions for generating responses, including for user voice queries that include multi-domain trigger words or phrases. When an utterance is recognized as different intents in different domains, a routing system for a domain may consider contextual signals, including those associated with other domains, to determine whether the domain is the proper one to handle the request. This determination can be performed with a statistical model specifically trained to make such determinations using the available contextual data.
    Type: Application
    Filed: June 24, 2021
    Publication date: December 29, 2022
    Inventors: Ponnu Jacob, Jingqian Zhao, Prathap Ramachandra, Krupal Maddipati, Jinning Wu, Charlotte Alizerine Dzialo, Daksh Gautam, Wenbo Yan, Liu Yang, Uday Kumar Kollu
  • Patent number: 11508766
    Abstract: Implementations of a molded image sensor chip scale package may include an image sensor having a first side and a second side. A first cavity wall and a second cavity wall may be coupled to the first side of the image sensor and extend therefrom. The first cavity wall and the second cavity wall may form a cavity over the image sensor. A transparent layer may be coupled to the first cavity wall and the second cavity wall. A redistribution layer (RDL) may be coupled to the second side of the image sensor. At least one interconnect may be directly coupled to the RDL. A mold material may encapsulate a portion of the RDL, a portion of the image sensor, and a side of each cavity wall, and a portion of the transparent layer.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: November 22, 2022
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Weng-Jin Wu
  • Patent number: 11508776
    Abstract: An image sensor semiconductor package (package) includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface. A complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die has a first surface with a photosensitive region and a second surface opposite the first surface of the CIS die. The second surface of the CIS die is coupled with the first surface of the PCB. A transparent cover is coupled over the photosensitive region of the CIS die. An image signal processor (ISP) is embedded within the PCB. One or more electrical couplers electrically couple the CIS die with the PCB. A plurality of electrical contacts on the second surface of the PCB are electrically coupled with the CIS die and with the ISP. The ISP is located between the plurality of electrical contacts of the second surface of the PCB and the CIS die.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: November 22, 2022
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Larry Kinsman, Yusheng Lin, Yu-Te Hsieh, Oswald Skeete, Weng-Jin Wu, Chi-Yao Kuo
  • Publication number: 20220348927
    Abstract: The present invention pertains to a pharmaceutical composition for preventing or treating squamous cell carcinoma, the pharmaceutical composition containing a highly expressed lncRNAs in esophageal squamous cell carcinoma (HERES) expression inhibitor. More specifically, the present invention pertains to a pharmaceutical composition which uses a HERES expression inhibitor to reduce the expression of HERES and affect Wnt signaling pathways, and thereby prevent or treat squamous cell carcinoma. The present inventors discovered that the expression pattern of HERES is related to the onset of squamous cell carcinoma, and found that HERES can be a target for treating squamous cell carcinoma.
    Type: Application
    Filed: May 8, 2020
    Publication date: November 3, 2022
    Applicants: IUCF-HYU(INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY), INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Jin-Wu NAM, Bo-Hyun YOU, Sang Kil LEE, Jung Ho YOON
  • Publication number: 20220349642
    Abstract: An electric ice press is provided herein and may be utilized to reshape an initial ice billet into a sculpted ice nugget. The electric ice press may include a mold body having a first mold segment and a second mold segment movable relative to each other. Each mold segment may define a heater cavity that is configured for receiving a ceramic annular heater for heating the mold body to form the sculpted ice nugget.
    Type: Application
    Filed: November 13, 2020
    Publication date: November 3, 2022
    Inventors: Bo Yan, Yayu Song, Jin Wu, Roy Teng, Michael Zhou, Jason Jiang, Eddy Zhou
  • Publication number: 20220349637
    Abstract: An ice making assembly includes an ice mold including two or more separable portions that collectively define one or more mold cavities. Each of the mold portions define a plurality of recessed passages that at least partially surround the mold cavity and are configured to receive evaporator conduit of a sealed refrigeration to cool the ice mold and facilitate formation of an ice billet.
    Type: Application
    Filed: November 13, 2020
    Publication date: November 3, 2022
    Inventors: Roy Teng, Jin Wu, Yayu Song, Bo Yan, Michael Zhou, Jason Jiang, Eddy Zhou
  • Patent number: 11482452
    Abstract: In a method of forming a contact plug in a semiconductor integrated circuit device, the contact plug may be formed in a process chamber of a substrate-processing apparatus. The process chamber may have a process space. The process chamber may include a substrate supporter placed in a lower region of the process space to support a semiconductor substrate, and a gas injector placed in an upper region of the process space to inject a gas to the semiconductor substrate. An insulating interlayer having a contact hole may be formed on the semiconductor substrate loaded into the process space. A nucleation layer may be formed on an inner surface of the contact hole and an upper surface of the insulating interlayer. A semi-bulk layer may be formed on the nucleation layer in a lower region of the contact hole. An inhibiting layer may be formed on the semi-bulk layer and the exposed nucleation layer. A main-bulk layer may be formed on the semi-bulk layer to fill the contact hole with the main-bulk layer.
    Type: Grant
    Filed: December 24, 2020
    Date of Patent: October 25, 2022
    Assignee: WONIK IPS CO., LTD
    Inventors: Won Jun Yoon, Woo Hoon Sun, Seok Kyu Choi, Tae Sung Han, Dong Woo Kim, Jin Wu Park
  • Publication number: 20220299248
    Abstract: An ice making assembly includes an ice mold and a pump assembly for urging an ice-building spray into the ice mold to form an ice billet. A controller operates the pump assembly to provide the ice-building spray at a first flow rate until the ice billet reaches a predetermined thickness and then operates the pump assembly to provide the ice-building spray at a second flow rate that is less than the first flow rate.
    Type: Application
    Filed: October 15, 2020
    Publication date: September 22, 2022
    Inventors: Andrew Schiller, Adam Pusateri, Justin Tyler Brown, Brent Alden Junge, Jin Wu, Bo Yan, Yayu Song, Michael Zhou, Roy Teng, Eddy Zhou, Jason Jiang
  • Patent number: 11449660
    Abstract: A system to generate a design of an integrated circuit, the system comprising a memory and a processor, the processor to define a plurality of voltage area regions (VARs), based on an availability of one or more of a primary power source and one or more secondary power sources. The processor further to constrain placement and/or routing of an element in the design of the integrated circuit within a voltage area region of the plurality of voltage area regions defined by secondary power/ground (PG) constraints based on power requirements of the element.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: September 20, 2022
    Assignee: Synopsys, Inc.
    Inventors: Jin Wu, Renu Mehra, Sabyasachi Das, Ben Mathew, Kunming Ho
  • Publication number: 20220228223
    Abstract: The present invention relates to a squamous cell carcinoma diagnostic or prognosis prediction marker and the use thereof and, more particularly, to the use of a long non-coding RNA as a marker composition for diagnosing or predicting the prognosis of squamous cell carcinoma, a diagnostic composition, diagnostic information-providing method and the like, by means of the correlation between an expression of the long non-coding RNA and squamous cell carcinoma pathogenesis. The inventors discovered that the expression pattern of a long non-coding RNA is related to cancer pathogenesis, investigated the correlation between the expression of a specific long non-coding RNA and squamous cell carcinoma pathogenesis and thus confirmed that the long non-coding RNA can be a squamous cell carcinoma diagnostic or prognosis prediction marker.
    Type: Application
    Filed: May 8, 2020
    Publication date: July 21, 2022
    Applicant: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Jin-Wu NAM, Bo-Hyun YOU
  • Publication number: 20220216256
    Abstract: According to an aspect, an image sensor package includes a transparent member, a substrate, and an interposer disposed between and coupled to the transparent member and the substrate, where the interposer defines a first cavity area and a second cavity area. The image sensor package includes an image sensor die disposed within the first cavity area of the interposer, where the image sensor die has a sensor array configured to receive light through the transparent member and the second cavity area. The image sensor package includes a bonding material that couples the image sensor die to the interposer within the first cavity area.
    Type: Application
    Filed: March 25, 2022
    Publication date: July 7, 2022
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Weng-Jin WU
  • Patent number: 11375689
    Abstract: A double-shockproof spring mechanism, a cam ejection mechanism and a single-side guide rail ejection bin, which relates to the technical field of pet snack device components. The double-shockproof spring comprises a guide rod and a first elastic element, a slider and a second elastic element which are sleeved on the guide rod in sequence, wherein the slider is slidable along the guide rod under the action of the first elastic element and the second elastic element; the cam ejection mechanism comprises a power device, an ejection cam, a pushing plate and a double-shockproof spring mechanism; and the single-side guide rail ejection bin comprises an ejection bin body and a cam ejection mechanism mounted on the ejection bin body; the single-side guide rail ejection bin of the present invention not only can project pet snacks, but also project periodically and continuously.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: July 5, 2022
    Assignee: BEIJING KITTEN&PUPPY TECHNOLOGY CO., LTD.
    Inventors: Jin Wu, Wenfeng Hu, Xin Hu
  • Publication number: 20220208605
    Abstract: In a method of forming a contact plug in a semiconductor integrated circuit device, the contact plug may be formed in a process chamber of a substrate-processing apparatus. The process chamber may have a process space. The process chamber may include a substrate supporter placed in a lower region of the process space to support a semiconductor substrate, and a gas injector placed in an upper region of the process space to inject a gas to the semiconductor substrate. An insulating interlayer having a contact hole may be formed on the semiconductor substrate loaded into the process space. A nucleation layer may be formed on an inner surface of the contact hole and an upper surface of the insulating interlayer. A semi-bulk layer may be formed on the nucleation layer in a lower region of the contact hole. An inhibiting layer may be formed on the semi-bulk layer and the exposed nucleation layer. A main-bulk layer may be formed on the semi-bulk layer to fill the contact hole with the main-bulk layer.
    Type: Application
    Filed: December 24, 2020
    Publication date: June 30, 2022
    Inventors: Won Jun YOON, Woo Hoon SUN, Seok Kyu CHOI, Tae Sung HAN, Dong Woo KIM, Jin Wu PARK
  • Publication number: 20220192148
    Abstract: A pet snack machine, including an outer shell and a sealing cover, wherein the sealing cover comprises a cover, a knob, a connector and an elastic element, one end of the connector is abutted against the knob, and the other end thereof passes through the cover and is provided with an abutting part, the inner side of the outer shell is provided with a grid blocking part, the abutting part is capable of being abutted against the lower side of the grid blocking part, the elastic element is provided in the cover, and both ends of the elastic element are abutted against the cover and the connector respectively, so that the knob is rotated, and the connector is movable in the direction close to the knob under the action of the elastic element to separate the abutting part from the grid blocking part.
    Type: Application
    Filed: July 8, 2020
    Publication date: June 23, 2022
    Inventors: Jin Wu, Wenfeng Hu, Xin Hu
  • Publication number: 20220132798
    Abstract: A double-shockproof spring mechanism, a cam ejection mechanism and a single-side guide rail ejection bin, which relates to the technical field of pet snack device components. The double-shockproof spring comprises a guide rod and a first elastic element, a slider and a second elastic element which are sleeved on the guide rod in sequence, wherein the slider is slidable along the guide rod under the action of the first elastic element and the second elastic element; the cam ejection mechanism comprises a power device, an ejection cam, a pushing plate and a double-shockproof spring mechanism; and the single-side guide rail ejection bin comprises an ejection bin body and a cam ejection mechanism mounted on the ejection bin body; the single-side guide rail ejection bin of the present invention not only can project pet snacks, but also project periodically and continuously.
    Type: Application
    Filed: July 8, 2020
    Publication date: May 5, 2022
    Inventors: Jin Wu, Wenfeng Hu, Xin Hu
  • Publication number: 20220119388
    Abstract: Compounds having formula (I), and enantiomers, and diastereomers, stereoisomers, pharmaceutically-acceptable salts thereof, are useful as kinase modulators, including RIPK1 modulation. All the variables are as defined herein.
    Type: Application
    Filed: October 18, 2021
    Publication date: April 21, 2022
    Inventors: Guanglin Luo, Jie Chen, Carolyn Diane Dzierba, David B. Frennesson, Junqing Guo, Amy C. Hart, Xirui Hu, Michael C. Mertzman, Matthew Reiser Patton, Jianliang Shi, Steven H. Spergel, Brian Lee Venables, Yong-Jin Wu, Zili Xiao, Michael G. Yang