Patents by Inventor Jin-Xian Lin

Jin-Xian Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080224199
    Abstract: A non-volatile memory module package capability of replacing, it may connected to a solid memory module, which includes a control unit, a system interface, and a first connector, the control unit may obtains external signals by the system interface, and then transmitted to this non-volatile memory module by the control unit to store or use the memory content. The package includes a substrate; a second connector is arranged on the substrate for inserting the first connector of the solid memory module; at least a non-volatile memory chip located on the substrate, and electrically connected the substrate and the second connector; at least a passive component is arranged on the substrate; and a compound resin is covered on the non-volatile memory chip and passive component.
    Type: Application
    Filed: May 4, 2007
    Publication date: September 18, 2008
    Inventors: Li Hui Lu, Kun Lin Liu, Chih Chieh Ho, Jin Xian Lin
  • Patent number: D532013
    Type: Grant
    Filed: October 28, 2005
    Date of Patent: November 14, 2006
    Assignee: Hon Hai Precision Industry Co. Ltd
    Inventor: Jin-Xian Lin
  • Patent number: D532789
    Type: Grant
    Filed: September 26, 2005
    Date of Patent: November 28, 2006
    Assignee: Hon Hai Precision Industry Co. Ltd.
    Inventors: Jin-Xian Lin, Yun-Dong Xu, Yi Hu