Abstract: A microelectronic system may include a substrate having a first surface, one or more interposers mounted to and electrically connected to the first surface, first and second application specific integrated circuits (ASICs) each at least partially overlying and electrically connected to one of the interposers, a plurality of high-bandwidth memory elements (HBMs) each at least partially overlying and electrically connected to one of the interposers, and an active silicon bridge mounted to and electrically connected to the first surface and providing an electrical connection between the first and second ASICs, the active silicon bridge having active microelectronic devices therein. The microelectronic system may be configured such that the first and second ASICs and the active silicon bridge each have a purely digital CMOS interface therein. A plurality of bumps providing the electrical connection between the ASICs and the active silicon bridge may be configured to receive serial data therethrough.

Abstract: A guitar comprising a neck truss rod supporting construction capable of firmly coupling its elements, such as a fret board, a neck, a guitar body and a front board of the guitar body, with one another. The neck truss rod supporting construction includes a truss rod supporting member, an extension member providing a wide bonding area and a coupling member having a cross-sectional shape of a trapezoid rotated 90.degree. and engaged in a block of the guitar body in a dovetail manner. The extension member has upper walls extending transversely and defining recesses among them. The front board of guitar body also has an opening engaged with the upper walls of extension member in a fit manner. At upper surfaces of the truss rod supporting member and the extension member, a plurality of longitudinal shallow slots are formed to provide positive bonding surfaces.