Patents by Inventor Jin Yokogawa

Jin Yokogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for processing semiconductor substrates
    Patent number: 6558505
    Abstract: Apparatus and methods for producing semiconductor devices are disclosed. A processing chamber includes an interior component having a stepped region including a plurality of raised sections and recessed sections divided by steps. With this apparatus, it is possible to prevent a film of deposited material formed on the stepped region from peeling, thereby decreasing the number of particles in the chamber and increasing the operation rate.
    Type: Grant
    Filed: May 13, 2002
    Date of Patent: May 6, 2003
    Assignee: Kawasaki Microelectronics, Inc.
    Inventors: Katsunori Suzuki, Hidetaka Horiuchi, Yasushi Kikuchi, Jin Yokogawa, Ryouichi Kubo, Koji Wakabayashi
  • Method and apparatus for processing semiconductor substrates
    Patent number: 6547921
    Abstract: Apparatus and methods for producing semiconductor devices are disclosed. A processing chamber includes an interior component having a stepped region including a plurality of raised sections and recessed sections divided by steps. With this apparatus, it is possible to prevent a film of deposited material formed on the stepped region from peeling thereby decreasing the number of particles in the chamber and increasing the operation rate.
    Type: Grant
    Filed: May 13, 2002
    Date of Patent: April 15, 2003
    Assignee: Kawasaki Microelectronics, Inc.
    Inventors: Katsunori Suzuki, Hidetaka Horiuchi, Yasushi Kikuchi, Jin Yokogawa, Ryouichi Kubo, Koji Wakabayashi
  • Method and apparatus for processing semiconductor substrates
    Publication number: 20030029565
    Abstract: Apparatus and methods for producing semiconductor devices are disclosed. A processing chamber includes an interior component having a stepped region including a plurality of raised sections and recessed sections divided by steps. With this apparatus, it is possible to prevent a film of deposited material formed on the stepped region from peeling, thereby decreasing the number of particles in the chamber and increasing the operation rate.
    Type: Application
    Filed: May 13, 2002
    Publication date: February 13, 2003
    Applicant: Kawasaki Microelectronics, Inc.
    Inventors: Katsunori Suzuki, Hidetada Horiuchi, Yasushi Kikuchi, Jin Yokogawa, Ryouichi Kubo, Koji Wakabayashi
  • Method and apparatus for processing semiconductor substrates
    Publication number: 20030024642
    Abstract: Apparatus and methods for producing semiconductor devices are disclosed. A processing chamber includes an interior component having a stepped region including a plurality of raised sections and recessed sections divided by steps. With this apparatus, it is possible to prevent a film of deposited material formed on the stepped region from peeling, thereby decreasing the number of particles in the chamber and increasing the operation rate.
    Type: Application
    Filed: May 13, 2002
    Publication date: February 6, 2003
    Applicant: Kawasaki Microelectronics, Inc.
    Inventors: Katsunori Suzuki, Hidetaka Horiuchi, Yasushi Kikuchi, Jin Yokogawa, Ryouichi Kubo, Koji Wakabayashi
  • Method and apparatus for processing semiconductor substrates
    Patent number: 6447853
    Abstract: Apparatus and methods for producing semiconductor devices are disclosed. A processing chamber includes an interior component having a stepped region including a plurality of raised sections and recessed sections divided by steps. With this apparatus, it is possible to prevent a film of deposited material formed on the stepped region from peeling, thereby decreasing the number of particles in the chamber and increasing the operation rate.
    Type: Grant
    Filed: November 24, 1999
    Date of Patent: September 10, 2002
    Assignee: Kawasaki Microelectronics, Inc.
    Inventors: Katsunori Suzuki, Hidetaka Horiuchi, Yasushi Kikuchi, Jin Yokogawa, Ryouichi Kubo, Koji Wakabayashi