Abstract: A method of manufacturing a printed circuit board, including: applying a dry film on a carrier and then patterning the dry film to form holes for forming metal bumps; forming an upper circuit layer including metal bumps charged in the holes and connection pads on the dry film; forming an insulation layer on the dry film; forming a build-up layer including a lower circuit layer on the insulation layer; removing the carrier; and removing the dry film.

Abstract: A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.

Abstract: A package substrate includes a solder resist layer having a level surface, a circuit pattern buried in the solder resist layer, and a bump protruding from the solder resist layer.

Abstract: A package substrate and a method of manufacturing the package substrate are disclosed. The method of manufacturing the package substrate may include stacking a second metal layer in which at least one hole is formed over a first metal layer, stacking a barrier layer over the first metal layer exposed in the hole and over the second metal layer, forming at least one bump by filling the hole with a conductive metal, stacking an insulation layer over the bump and forming a circuit pattern over the insulation layer, and removing the first metal layer, the second metal layer, and the barrier layer.

Abstract: A method of manufacturing a printed circuit board, including: applying a dry film on a carrier and then patterning the dry film to form holes for forming metal bumps; forming an upper circuit layer including metal bumps charged in the holes and connection pads on the dry film; forming an insulation layer on the dry film; forming a build-up layer including a lower circuit layer on the insulation layer; removing the carrier; and removing the dry film.

Abstract: This invention relates to a printed circuit board and a method of manufacturing the same, in which an outermost layer of the printed circuit board includes a fine circuit and the manufacturing cost of the printed circuit board is reduced.

Abstract: A method of manufacturing a printed circuit board, including: providing a metal layer; forming an insulation layer on the metal layer and then forming via holes for exposing the metal layer in the insulation layer; forming vias charged in the via holes and a circuit layer on the insulation layer; and forming metal bumps at ends of the vias.

Abstract: Disclosed herein are a printed circuit board having metal bumps which have uniform diameter and are formed at fine pitch, and a method of manufacturing the printed circuit board.

Abstract: Disclosed herein is a printed circuit board, including: an upper circuit layer including connection pads made of a conductive metal and buried in an insulation layer; and metal bumps, each having a constant diameter, which are integrated with the connection pads and protrude over the insulation layer.

Abstract: A method of manufacturing a substrate using a carrier, that includes preparing a carrier having a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; patterning the metal layers to form base circuit layers; forming buildup layers on the base circuit layers; executing a routing process to separate the insulating layers from the releasing layer; and forming solder resist layers on the buildup layers and forming openings in the solder resist layers and the insulating layers to expose pads.

Abstract: A method of manufacturing a multi-layer board is disclosed. The method may include forming a detachable separation layer over a support; forming a first solder resist layer over the separation layer; stacking a metal foil over the first solder resist layer; forming a circuit pattern over the metal foil; forming an insulation part over the first solder resist layer such that the circuit pattern is covered; forming a second solder resist layer over the insulation part; and separating a circuit stack unit, which includes the first solder resist layer, the metal foil, the circuit pattern, the insulation part, and the second solder resist layer, from the support by disconnecting the separation layer and the support. This method uses a simple process to reduce manufacture costs and shorten manufacture times.

Abstract: A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.

Abstract: The present invention provides a method of manufacturing a printed circuit board including the steps of: preparing a pair of raw materials, each formed by sequentially stacking a release film and a first insulating layer, and an adhesive layer, respectively; embedding the pair of raw materials, which are opposed to each other, in the adhesive layer while disposing the release films toward an inner layer; forming a second insulating layer, which has a via formed therethrough and a circuit pattern formed on an upper surface to be connected to the via, on the first insulating layer; cutting edge portions of the second and first insulating layers, the release film, and the adhesive layer; and removing the release film from the first insulating layer.

Abstract: A manufacturing method of a circuit board is disclosed. The manufacturing method of a circuit board in accordance with the present invention includes forming a separation layer on a carrier, stacking an adhesion layer which is coupled to the carrier and covers the separation layer, forming a circuit layer on the adhesion layer, forming a circuit board unit by cutting the separation layer, the adhesion layer and the circuit layer such that the separation layer is separated from the carrier, and forming a stiffener by processing the separation layer of the circuit board unit. The manufacturing method of a circuit board in accordance with the present invention can reduce the cost and time for forming the stiffener by forming the stiffener together in the manufacturing process of the circuit board.

Abstract: The present invention relates to a semiconductor package and a method of manufacturing the same. The semiconductor package may include: an insulator that has first and second opening parts; an active element that is disposed inside the first opening part; a passive element that is disposed inside the second opening part; a protective member that is disposed at a lower part of the insulator and covers a lower part of the passive element; a build-up layer that is disposed on the insulator and electrically connected to the active element; and an external connection unit that is electrically connected to the build-up layer.

Abstract: This invention relates to a printed circuit board and a method of manufacturing the same, in which an outermost layer of the printed circuit board includes a fine circuit and the manufacturing cost of the printed circuit board is reduced.

Abstract: Disclosed herein are a printed circuit board having metal bumps which have uniform diameter and are formed at fine pitch, and a method of manufacturing the printed circuit board.

Abstract: A package substrate is disclosed. The package substrate as a printed circuit board, in which a semiconductor chip is mounted on one side thereof and the other side thereof is mounted on a main board, can include a substrate part, a first pad, which is formed on one side of the substrate part such that the first pad is electrically connected to the semiconductor chip, and a first solder resist layer, which is formed on one surface of the substrate part such that the first pad is exposed. Here, the first solder resist layer is divided into a pad portion and a dummy portion, the first pad is exposed in the pad portion, and the dummy portion is thinner than the pad portion. The package substrate can contribute to the formation of a structure in which thermal expansion coefficients are symmetrical between the top and bottom, thus preventing the warpage.

Abstract: The invention relates to a carrier used in the manufacture of a substrate and a method of manufacturing a substrate using the carrier, the method including (A) preparing a carrier comprising a releasing layer, and insulating layers and metal layers sequentially disposed on both sides of the releasing layer; (B) patterning the metal layers to form base circuit layers; (C) forming buildup layers on the base circuit layers; (D) executing a routing process to separate the insulating layers from the releasing layer; and (E) forming solder-resist layers on the buildup layers and forming openings in-the solder-resist layers and the insulating layers to expose pads.

Abstract: Disclosed herein is a printed circuit board, including: metal bumps having constant diameters and protruding over an insulation layer; a circuit layer formed beneath the insulation layer; and vias passing through the insulation layer to connect the metal bumps with the circuit layer.