Patents by Inventor Jin-You Kim

Jin-You Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250049891
    Abstract: The present disclosure relates to a novel peptide derivative, etc., the peptide derivative being a partially modified adiponectin receptor peptide which, compared to conventional adiponectin receptor peptides, has higher stability, superior p-AMPK activity, and improved physical properties and activity and thus offers advantages when formulated into a drug. Therefore, the peptide derivative of the present invention can be used to prevent or treat inflammatory skin diseases, wounds, hair loss, fibrosis, metabolic diseases, or cancer, to prevent or alleviate aging, sensitive skin, or wrinkles, or to enhance moisturization.
    Type: Application
    Filed: December 9, 2022
    Publication date: February 13, 2025
    Inventors: Jin Ho CHUNG, Eun Ju KIM, Joong Heon SUH, Ji Hoon LEE, Yoon Na KWAK, Go Ni JUNG, Sun You PARK, Myeong A CHOI, Ju Sik MIN, Ha Yeon LEE
  • Publication number: 20250051390
    Abstract: The present invention relates to a novel peptoid derivative and the like. The peptoid derivative is obtained by partially modifying an adiponectin receptor peptide, and has high stability and excellent p-AMPK activity, compared to existing adiponectin receptor peptides and has improved physical properties and activity, thus having the advantage of being suitable for drug formulation. Therefore, the peptoid derivative of the present invention can be used for the prevention or treatment of skin inflammatory diseases, wounds, hair loss, fibrosis, metabolic diseases, or cancer, or the prevention or amelioration of aging, sensitive skin, wrinkles, or moisturization.
    Type: Application
    Filed: December 9, 2022
    Publication date: February 13, 2025
    Inventors: Jin Ho CHUNG, Eun Ju KIM, Joong Heon SUH, Ji Hoon LEE, Yoon Na KWAK, Go Ni JUNG, Sun You PARK, Myeong A CHOI, Ju Sik MIN, Ha Yeon LEE
  • Publication number: 20240035106
    Abstract: An embodiment of the present invention provides a high strength thin steel material for API having excellent resistance to deformation and a method of manufacturing same, the steel material comprising, in weight %, C: 0.05-0.15%, Si: 0.05% or less (0% excluded), Mn: 0.5-2.5%, Nb: 0.05% or less (0% excluded), V: 0.004% or less (0% excluded), Mo: 0.03-0.2%, Cr: 0.1-0.3%, P: 0.03% or less (0% excluded), S: 0.015% (0% excluded), Al: 0.05% or less (0% excluded), N: 0.01% or less (0% excluded), and the balance being Fe and other inevitable impurities, wherein the microstructure of the steel material comprises, in area %, ferrite: 10-30% and the balance being bainite, the ferrite having an average crystal grain size of 15-30 ?m and including at least 3,000/?m2 V-based precipitates.
    Type: Application
    Filed: November 22, 2021
    Publication date: February 1, 2024
    Applicant: POSCO CO., LTD.
    Inventor: Jin-You KIM
  • Patent number: 11059269
    Abstract: Disclosed are a hot dip coated steel and a method for manufacturing the same, the hot dip coated steel comprising a hot rolled steel and a hot dip coated layer formed on the surface of the hot rolled steel, wherein the hot rolled steel comprises: by wt %, 0.05-0.15% of C, 0.5% or less of Si (excluding 0%), 0.5-1.5% of Mn, 0.01-0.05% of Nb, 0.005-0.05% of V, 0.03% or less of P (excluding 0%), 0.015% of S or less (excluding 0%), 0.05% or less of Al (excluding 0%), 0.01% or less of N (excluding 0%), and the balance of Fe and inevitable impurities; 90 area % or more of ferrite as the microstructure thereof; and 5,000-15,000/?m2 of V-based precipitates.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: July 13, 2021
    Assignee: POSCO
    Inventor: Jin-You Kim
  • Publication number: 20200070476
    Abstract: Disclosed are a hot dip coated steel and a method for manufacturing the same, the hot dip coated steel comprising a hot rolled steel and a hot dip coated layer formed on the surface of the hot rolled steel, wherein the hot rolled steel comprises: by wt %, 0.05-0.15% of C, 0.5% or less of Si (excluding 0%), 0.5-1.5% of Mn, 0.01-0.05% of Nb, 0.005-0.05% of V, 0.03% or less of P (excluding 0%), 0.015% of S or less (excluding 0%), 0.05% or less of Al (excluding 0%), 0.01% or less of N (excluding 0%), and the balance of Fe and inevitable impurities; 90 area % or more of ferrite as the microstructure thereof; and 5,000-15,000/?m2 of V-based precipitates.
    Type: Application
    Filed: December 19, 2017
    Publication date: March 5, 2020
    Inventor: Jin-You Kim
  • Patent number: 10458031
    Abstract: An aspect of the present invention provides an Fe—Ni alloy metal foil having excellent heat resilience, where the Fe—Ni alloy metal foil is prepared by an electroforming (EF) method and has a thickness of 100 ?m or less (except O ?m), wherein the Fe—Ni alloy metal foil comprises, by wt %, Ni: 34-46 %, a remainder of Fe and inevitable impurities, and wherein the Fe—Ni metal foil has a degree of heat resilience in an amount of 30 ppm or less.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: October 29, 2019
    Assignee: POSCO
    Inventors: Gwan-Ho Jung, Jin-You Kim, Moo-Jin Kim, Jae-Kon Lee, Jun-Hak Park, Jae-Hwa Hong
  • Publication number: 20170342581
    Abstract: An aspect of the present invention provides an Fe—Ni alloy metal foil having excellent heat resilience, where the Fe—Ni alloy metal foil is prepared by an electroforming (EF) method and has a thickness of 100 ?m or less (except O ?m), wherein the Fe—Ni alloy metal foil comprises, by wt %, Ni: 34-46 %, a remainder of Fe and inevitable impurities, and wherein the Fe—Ni metal foil has a degree of heat resilience in an amount of 30 ppm or less.
    Type: Application
    Filed: March 25, 2015
    Publication date: November 30, 2017
    Inventors: Gwan-Ho JUNG, Jin-You KIM, Moo-Jin KIM, Jae-Kon LEE, Jun-Hak PARK, Jae-Hwa HONG
  • Publication number: 20140360882
    Abstract: The present invention relates to an apparatus and a method for manufacturing metal foil by electroforming.
    Type: Application
    Filed: November 15, 2012
    Publication date: December 11, 2014
    Inventors: Hong-Joon Kim, Jin-You Kim, Jae-Kon Lee, Jae-Hun Choi, Sung-Jool Kim, Seok-Hwan Choi, Un-Kwan Cho