Patents by Inventor Jin Young Klm

Jin Young Klm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD
    Publication number: 20140367147
    Abstract: Disclosed herein are an insulating resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board. More specifically, disclosed herein are an insulating resin composition for a printed circuit board including a maleimide resin having three or more maleimide groups, and the like so that a glass transition temperature and a mechanical strength are improved, an insulating film and a prepreg prepared using the insulating resin composition, and a printed circuit board including the insulating film or the prepreg.
    Type: Application
    Filed: February 4, 2014
    Publication date: December 18, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Seok Moon, Hyun Jun Lee, Seong Hyun Yoo, Jin Young Klm, Geum Hee Yun