Patents by Inventor Jin-young Rew

Jin-young Rew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silicone-acrylic impact modifier having improved colorability and thermoplastic resin composition comprising the same
    Patent number: 7803461
    Abstract: The present invention relates to a silicone-acrylic impact modifier having multi-layer structure and a thermoplastic resin composition containing the same, more precisely a silicone-acrylic impact modifier which is composed of i) silicone rubber seed containing one or more vinyl copolymers; ii) acrylic rubber core covering the seed; and iii) a shell containing one or more vinyl copolymers covering the acrylic rubber core, and a thermoplastic resin composition containing the same. The thermoplastic resin having the silicone-acrylic impact modifier of the present invention has improved impact resistance and colorability.
    Type: Grant
    Filed: October 25, 2005
    Date of Patent: September 28, 2010
    Assignee: LG Chem, Ltd.
    Inventors: Keon-suk Lee, Jeong-heon Ahn, Jin-young Rew, Jae-woung Ha
  • Silicone-acrylic impact modifier having improved colorability and thermoplastic resin composition comprising the same
    Publication number: 20060089456
    Abstract: The present invention relates to a silicone-acrylic impact modifier having multi-layer structure and a thermoplastic resin composition containing the same, more precisely a silicone-acrylic impact modifier which is composed of i) silicone rubber seed containing one or more vinyl copolymers; ii) acrylic rubber core covering the seed; and iii) a shell containing one or more vinyl copolymers covering the acrylic rubber core, and a thermoplastic resin composition containing the same. The thermoplastic resin having the silicone-acrylic impact modifier of the present invention has improved impact resistance and colorability.
    Type: Application
    Filed: October 25, 2005
    Publication date: April 27, 2006
    Inventors: Keon-suk Lee, Jeong-heon Ahn, Jin-young Rew, Jae-woung Ha