Abstract: A semiconductor apparatus includes a transmission device and a receiving device. The transmission device generates an output signal from a transmission signal in synchronization with a clock signal. The receiving device generates a reception signal from the output signal in synchronization with the clock signal and a delayed clock signal generated by delaying the clock signal by a preset time, based on an operating speed of the semiconductor apparatus.

Abstract: A system may include a first semiconductor apparatus and a second semiconductor apparatus. Each of the first and second semiconductor apparatuses may receive reference data and a first clock signal. The first semiconductor apparatus may generate a first internal clock signal from the first clock signal, and may output the reference data as transmission data based on the first internal clock signal. The second semiconductor apparatus may generate a second internal clock signal from the first clock signal, and may receive the transmission data based on the second internal clock signal. The second semiconductor apparatus may generate an error detection signal based on the received data and the reference data.

Abstract: A semiconductor apparatus includes a transmission device and a receiving device. The transmission device generates an output signal from a transmission signal in synchronization with a clock signal. The receiving device generates a reception signal from the output signal in synchronization with the clock signal and a delayed clock signal generated by delaying the clock signal by a preset time, based on an operating speed of the semiconductor apparatus.

Abstract: A system may include a first semiconductor apparatus and a second semiconductor apparatus. Each of the first and second semiconductor apparatuses may receive reference data and a first clock signal. The first semiconductor apparatus may generate a first internal clock signal from the first clock signal, and may output the reference data as transmission data based on the first internal clock signal. The second semiconductor apparatus may generate a second internal clock signal from the first clock signal, and may receive the transmission data based on the second internal clock signal. The second semiconductor apparatus may generate an error detection signal based on the received data and the reference data.

Abstract: An error detection circuit may include a selection unit that sequentially selects a primary data group and a secondary data group according to a first control signal and generates an output signal; a first operation unit that performs an error detection operation on the output signal and outputs a preliminary error operation signal; a storage unit that latches the preliminary error operation signal and output a latched signal according to a second control signal; a second operation unit that performs an error detection operation on a previous preliminary error operation signal outputted from the storage unit and a current preliminary error operation signal outputted from the first operation unit and generates an internal error operation signal; and a comparison unit that compares the internal error operation signal with an external error operation signal and outputs a result of the comparison as an error detection signal.

Abstract: A semiconductor system includes a controller operatively coupled to a semiconductor device, the controller being suitable in a training mode for receiving an external signal and a first data signal from an external device and for transmitting the received external signal and the first data signal to the semiconductor device; and the semiconductor device being suitable in the training mode for determining a level of a reference voltage in response to the first data signal, and for transmitting a second data signal to the controller by buffering the external signal based on the reference voltage without performing a termination operation during an output period of the second data signal, wherein the controller controls an enable timing of the external signal by receiving the second data signal.

Abstract: A memory apparatus may include a plurality of ranks commonly coupled to an input/output (I/O) terminal. Non-target ranks other than a target rank among the plurality of ranks may be configured to perform an on die termination operation based on a read operation of the target rank.

Abstract: A semiconductor integrated circuit device may include a target PMOS transistor, a target NMOS transistor, a first stress-applying circuit, a second stress-applying circuit, a third stress-applying circuit and a fourth stress-applying circuit. An inverter may include the target PMOS transistor and the NMOS transistor. The first stress-applying circuit may be configured to apply a first DC level to a gate of the target PMOS transistor. The second stress-applying circuit may be configured to apply a second DC level to a gate of the target NMOS transistor. The third stress-applying circuit may be configured to apply an AC voltage shape to the gate of the target NMOS transistor. The fourth stress-applying circuit may be configured to apply the AC voltage to a drain of the target NMOS transistor.

Abstract: A semiconductor system includes a controller operatively coupled to a semiconductor device, the controller being suitable in a training mode for receiving an external signal and a first data signal from an external device and for transmitting the received external signal and the first data signal to the semiconductor device; and the semiconductor device being suitable in the training mode for determining a level of a reference voltage in response to the first data signal, and for transmitting a second data signal to the controller by buffering the external signal based on the reference voltage without performing a termination operation during an output period of the second data signal, wherein the controller controls an enable timing of the external signal by receiving the second data signal.

Abstract: A memory apparatus may include a plurality of ranks commonly coupled to an input/output (I/O) terminal. Non-target ranks other than a target rank among the plurality of ranks may be configured to perform an on die termination operation based on a read operation of the target rank.

Abstract: A semiconductor system includes a controller operatively coupled to a semiconductor device, the controller being suitable in a training mode for receiving an external signal and a first data signal from an external device and for transmitting the received external signal and the first data signal to the semiconductor device; and the semiconductor device being suitable in the training mode for determining a level of a reference voltage in response to the first data signal, and for transmitting a second data signal to the controller by buffering the external signal based on the reference voltage without performing a termination operation during an output period of the second data signal, wherein the controller controls an enable timing of the external signal by receiving the second data signal.

Abstract: A semiconductor device may include a data output circuit configured to sense and amplify data of an input/output line and a complementary input/output line based on the sense amplification control signal. The semiconductor device may include a data output control circuit configured to delay a point of time that the input/output line and the complementary input/output line are sensed and amplified.

Abstract: An error detection circuit may include a selection unit that sequentially selects a primary data group and a secondary data group according to a first control signal and generates an output signal; a first operation unit that performs an error detection operation on the output signal and outputs a preliminary error operation signal; a storage unit that latches the preliminary error operation signal and output a latched signal according to a second control signal; a second operation unit that performs an error detection operation on a previous preliminary error operation signal outputted from the storage unit and a current preliminary error operation signal outputted from the first operation unit and generates an internal error operation signal; and a comparison unit that compares the internal error operation signal with an external error operation signal and outputs a result of the comparison as an error detection signal.

Abstract: A semiconductor apparatus includes a memory region configured to store data transmitted through a first data line and a second data line; and a precharge block configured to precharge the second data line to a level of a first voltage and precharge the first data line to a level of a second voltage higher than the level of the first voltage, based on a write signal.

Abstract: A semiconductor integrated circuit device may include a target PMOS transistor, a target NMOS transistor, a first stress-applying circuit, a second stress-applying circuit, a third stress-applying circuit and a fourth stress-applying circuit. An inverter may include the target PMOS transistor and the NMOS transistor. The first stress-applying circuit may be configured to apply a first DC level to a gate of the target PMOS transistor. The second stress-applying circuit may be configured to apply a second DC level to a gate of the target NMOS transistor. The third stress-applying circuit may be configured to apply an AC voltage shape to the gate of the target NMOS transistor. The fourth stress-applying circuit may be configured to apply the AC voltage to a drain of the target NMOS transistor.

Abstract: A memory device include a memory array, a transmitter suitable for outputting data to the outside of the memory device, and a data bus suitable for transmitting data of a selected memory cell in the memory array to the transmitter during a read operation. When successive read commands for the same memory cell are applied, data transmission from the memory array to the data bus is blocked, and data previously loaded in the data bus is outputted through the transmitter.

Abstract: A semiconductor apparatus includes a memory region configured to store data transmitted through a first data line and a second data line; and a precharge block configured to precharge the second data line to a level of a first voltage and precharge the first data line to a level of a second voltage higher than the level of the first voltage, based on a write signal.

Abstract: A memory device include a memory array, a transmitter suitable for outputting data to the outside of the memory device, and a data bus suitable for transmitting data of a selected memory cell in the memory array to the transmitter during a read operation. When successive read commands for the same memory cell are applied, data transmission from the memory array to the data bus is blocked, and data previously loaded in the data bus is outputted through the transmitter.

Abstract: A semiconductor integrated circuit includes a fuse circuit comprising a fuse configured to generate a fuse state signal corresponding to a rupture state of the fuse in response to an enable signal, a fuse state decision unit configured to determine whether or not the fuse state signal is normal based on a test signal, and generate an output enable signal according to a determination result, and a driving unit configured to output the fuse state signal in response to the output enable signal.

Abstract: A column select signal generation circuit includes: a first current controller configured to control the level of a pre-column select signal in response to a bank active signal, a driver configured to generate an amplified column select signal in response to the pre-column select signal, and a second current controller configured to generate an output signal of the driver as a column select signal in response to the bank active signal.