Patents by Inventor Jin Yul KIM
Jin Yul KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240120224Abstract: A semiconductor manufacturing equipment may include a process chamber for treating a substrate; a front-end module including a first transfer robot, wherein the first transfer robot may be configured to transport the substrate received in a container; a transfer chamber between the front-end module and the process chamber, wherein the transfer chamber may be configured to load or unload the substrate into or out of the process chamber; and a cassette capable of receiving a replaceable component capable of being used in the process chamber. The front-end module may include a seat plate configured to move in a sliding manner so as to retract or extend into or from the front-end module. The cassette may be configured to be loaded into the front-end module while the cassette is seated on the seat plate.Type: ApplicationFiled: September 12, 2023Publication date: April 11, 2024Applicant: Samsung Electronics Co., Ltd.Inventors: Jin Hyuk CHOI, Beom Soo HWANG, Kong Woo LEE, Myung Ki SONG, Ja-Yul KIM, Kyu Sang LEE, Hyun Joo JEON, Nam Young CHO
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Patent number: 11011482Abstract: A semiconductor package includes a semiconductor chip, an encapsulant, and an interconnection member. The semiconductor chip has connection pads. The encapsulant encapsulates a portion of the semiconductor chip. The interconnection member includes a first insulating layer disposed on the encapsulant and a portion of the semiconductor chip, a redistribution layer disposed on the first insulating layer, and a second insulating layer disposed on the first insulating layer and the redistribution layer. The redistribution layer is electrically connected to the connection pads of the semiconductor chip, and a thickness of the second insulating layer is greater than a thickness of the first insulating layer.Type: GrantFiled: June 30, 2020Date of Patent: May 18, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Doo Hwan Lee, Jong Rip Kim, Hyoung Joon Kim, Jin Yul Kim, Kyung Seob Oh
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Publication number: 20200335460Abstract: A semiconductor package includes a semiconductor chip, an encapsulant, and an interconnection member. The semiconductor chip has connection pads. The encapsulant encapsulates a portion of the semiconductor chip. The interconnection member includes a first insulating layer disposed on the encapsulant and a portion of the semiconductor chip, a redistribution layer disposed on the first insulating layer, and a second insulating layer disposed on the first insulating layer and the redistribution layer. The redistribution layer is electrically connected to the connection pads of the semiconductor chip, and a thickness of the second insulating layer is greater than a thickness of the first insulating layer.Type: ApplicationFiled: June 30, 2020Publication date: October 22, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Doo Hwan LEE, Jong Rip Kim, Hyoung Joon Kim, Jin Yul Kim, Kyung Seob OH
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Patent number: 10714437Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip; and a passivation layer disposed on the second interconnection member.Type: GrantFiled: February 26, 2018Date of Patent: July 14, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Doo Hwan Lee, Jong Rip Kim, Hyoung Joon Kim, Jin Yul Kim, Kyung Seob Oh
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Patent number: 10600748Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip; and a passivation layer disposed on the second interconnection member.Type: GrantFiled: December 13, 2016Date of Patent: March 24, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Doo Hwan Lee, Jong Rip Kim, Hyoung Joon Kim, Jin Yul Kim, Kyung Seob Oh
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Patent number: 10026702Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip; and a passivation layer disposed on the second interconnection member.Type: GrantFiled: December 13, 2016Date of Patent: July 17, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Doo Hwan Lee, Jong Rip Kim, Hyoung Joon Kim, Jin Yul Kim, Kyung Seob Oh
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Publication number: 20180190602Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip; and a passivation layer disposed on the second interconnection member.Type: ApplicationFiled: February 26, 2018Publication date: July 5, 2018Inventors: Doo Hwan LEE, Jong Rip KIM, Hyoung Joon KIM, Jin Yul KIM, Kyung Seob OH
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Patent number: 9960128Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip; and a passivation layer disposed on the second interconnection member.Type: GrantFiled: December 13, 2016Date of Patent: May 1, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Doo Hwan Lee, Jong Rip Kim, Hyoung Joon Kim, Jin Yul Kim, Kyung Seob Oh
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Publication number: 20170365566Abstract: A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor chip; and a passivation layer disposed on the second interconnection member.Type: ApplicationFiled: December 13, 2016Publication date: December 21, 2017Inventors: Doo Hwan LEE, Jong Rip KIM, Hyoung Joon KIM, Jin Yul KIM, Kyung Seob OH