Abstract: A method of manufacturing a multilayer ceramic electronic component includes: preparing a plurality of first ceramic sheets; forming internal electrode patterns on the first ceramic sheets using a conductive paste, respectively; stacking the first ceramic sheets on which the internal electrode pattern is formed to form a ceramic body including internal electrodes disposed therein to face each other; forming electrode layers by transferring a nickel-containing sheet on both end surfaces of the ceramic body in a length direction of the ceramic body so as to be connected to the internal electrodes, respectively; forming electrically insulating layers by attaching a second ceramic sheet for forming an electrically insulating layer to the electrode layers, respectively; and preparing external electrodes by forming plating layers on one surface of the ceramic body in a thickness direction of the ceramic body, to be connected to the electrode layers, respectively.

Abstract: A multilayer ceramic capacitor includes a capacitor body including a plurality of first to third internal electrodes. The first internal electrodes have opposing ends exposed at third and fourth surfaces of the capacitor body. The second internal electrodes have a portion exposed at either of fifth or sixth surfaces of the capacitor body. The third internal electrodes have portions respectively exposed at the fifth and sixth surfaces. First and second external electrodes are on the third and fourth surfaces, respectively, and are connected to the first internal electrodes. Third and fourth external electrodes are on the fifth and sixth surfaces, respectively, and are connected to the second and third internal electrodes.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes, stacked to be alternately exposed to one end surface and the other end surface of the ceramic body, with each of the dielectric layers interposed therebetween; and external electrodes disposed on outer surfaces of the ceramic body. The external electrodes include electrode layers connected to the internal electrodes, electrically insulating layers disposed on the electrode layers, and plating layers disposed on one surface of the ceramic body in a thickness direction of the ceramic body and connected to the electrode layers, respectively, and the electrode layers contain nickel.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes, stacked to be alternately exposed to one end surface and the other end surface of the ceramic body, with each of the dielectric layers interposed therebetween; and external electrodes disposed on outer surfaces of the ceramic body. The external electrodes include electrode layers connected to the internal electrodes, electrically insulating layers disposed on the electrode layers, and plating layers disposed on one surface of the ceramic body in a thickness direction of the ceramic body and connected to the electrode layers, respectively, and the electrode layers contain nickel.

Abstract: A multilayer ceramic capacitor includes a capacitor body including a plurality of first to third internal electrodes. The first internal electrodes have opposing ends exposed at third and fourth surfaces of the capacitor body. The second internal electrodes have a portion exposed at either of fifth or sixth surfaces of the capacitor body. The third internal electrodes have portions respectively exposed at the fifth and sixth surfaces. First and second external electrodes are on the third and fourth surfaces, respectively, and are connected to the first internal electrodes. Third and fourth external electrodes are on the fifth and sixth surfaces, respectively, and are connected to the second and third internal electrodes.

Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes, stacked to be alternately exposed to one end surface and the other end surface of the ceramic body, with each of the dielectric layers interposed therebetween; and external electrodes disposed on outer surfaces of the ceramic body. The external electrodes include electrode layers connected to the internal electrodes, electrically insulating layers disposed on the electrode layers, and plating layers disposed on one surface of the ceramic body in a thickness direction of the ceramic body and connected to the electrode layers, respectively, and the electrode layers contain nickel.

Abstract: There are provided a multilayer ceramic electronic component and a fabrication method thereof. The multilayer ceramic component includes a ceramic main body in which internal electrodes and dielectric layers are alternately laminated; external electrodes formed on outer surfaces of the ceramic main body; intermediate layers formed on the external electrodes and including one or more selected from the group consisting of nickel, copper, and a nickel-copper alloy; and plating layers formed on the intermediate layers, whereby infiltration of a plating solution can be prevented.

Abstract: Disclosed herein is a small particle oxide powder for dielectrics. The oxide powder has a perovskite structure, an average particle diameter [D50(?m)] of 0.3 ?m or less, a particle size distribution of the average particle diameter within 3%, a particle size distribution satisfying a condition D99/D50<2.5, a content of OH? groups of 0.2 wt % and a C/A axial ratio of 1.006 or more. A method of manufacturing the oxide powder comprises the steps of mixing TiO2 particles and a compound solved with at least one element represented by A of the perovskite structure of ABO3; drying and pulverizing the mixture of TiO2 and the compound; calcining the pulverized mixture; adding the oxide containing the elements of the site A to the coated TiO2 particles and wet-mixing, drying and pulverizing; primarily calcining and pulverizing the pulverized powder under vacuum; and secondarily calcining and pulverizing the powder.