Abstract: A curable silicone composition is provided. The composition comprises: (A) an epoxy-functional silicone resin having monovalent aromatic hydrocarbon groups; (B) an epoxy-functional silicone; and (C) a mixture of cationic photoinitiators comprising: (C-1) an iodonium salt type cationic photoinitiator and (C-2) a sulfonium salt type cationic photoinitiator. The composition has excellent curability with UV radiation, and further with heating, generally forms a cured product with excellent transparency.

Abstract: A curable silicone composition is provided. The composition comprises: (A) an epoxy-functional silicone resin having monovalent aromatic hydrocarbon groups; (B) an epoxy-functional silicone; (C) a cationic photoinitiator; and (D) a silatrane derivative or a carbasilatrane derivative, wherein each derivative has at least one silicon atom-bonded alkoxy group per molecule. The composition has excellent curability with UV radiation, and further with heating, generally forms a cured product with excellent thermal and light resistance, and adhesion properties.

Abstract: A curable silicone composition is provided. The composition comprises: (A) an epoxy-functional silicone resin having monovalent aromatic hydrocarbon groups; (B) an epoxy-functional silicone having monovalent aromatic hydrocarbon groups; and (C) a cationic photoinitiator. Optionally, the composition further comprises (D) an epoxy-functional silicone free of monovalent aromatic hydrocarbon groups. The composition has excellent curability with UV radiation, and further with heating, generally forms a cured product with excellent transparency and mechanical properties.

Abstract: A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements is disclosed. The composition comprises: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises a constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, optionally, constituent (B-3) of an average molecular formula; (C) an adhesion promoter; and (D) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively high hardness.

Abstract: A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements is disclosed. The composition comprises: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises a constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, optionally, constituent (B-3) of an average molecular formula; (C) an adhesion promoter; and (D) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively high hardness.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane represented by the average unit formula: (R13SiO1/2)a(R12SiO2/2)b (R2SiO3/2)c (R3SiO3/2)d, wherein, R1 are the same or different alkyl groups having from 1 to 12 carbons, alkenyl groups having from 2 to 12 carbons, aryl groups having from 6 to 20 carbons, or aralkyl groups having from 7 to 20 carbons, provided that at least two R1 in a molecule are the alkenyl groups; R2 is an aryl group having from 6 to 20 carbons or an aralkyl group having from 7 to 20 carbons; R3 is an alkyl group having from 1 to 12 carbons; and a, b, c, and d are respectively numbers satisfying: 0.01?a?0.5, 0?b?0.7, 0.01?c<0.7, 0.1?d<0.9, and a+b+c+d=1; (B) a linear organopolysiloxane having at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group in a molecule; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a hydrosilylation-reaction catalyst.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane represented by the average unit formula: (R13SiO1/2)a(R12SiO2/2)b (R2SiO3/2)c (R3SiO3/2)d, wherein, R1 are the same or different alkyl groups having from 1 to 12 carbons, alkenyl groups having from 2 to 12 carbons, aryl groups having from 6 to 20 carbons, or aralkyl groups having from 7 to 20 carbons, provided that at least two R1 in a molecule are the alkenyl groups; R2 is an aryl group having from 6 to 20 carbons or an aralkyl group having from 7 to 20 carbons; R3 is an alkyl group having from 1 to 12 carbons; and a, b, c, and d are respectively numbers satisfying: 0.01?a?0.5, 0?b?0.7, 0.01?c<0.7, 0.1?d<0.9, and a+b+c+d=1; (B) a linear organopolysiloxane having at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group in a molecule; (C) an organo polysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a hydrosilylation-reaction catalyst.