Patents by Inventor Ji Na JEUNG

Ji Na JEUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hybrid interposer and semiconductor package including the same
    Patent number: 10811358
    Abstract: A semiconductor package includes an organic frame having first and second surfaces opposing each other, having a cavity, and having a wiring structure connecting the first and second surfaces, a connection structure disposed on the first surface of the organic frame and having a first redistribution layer connected to the wiring structure, at least one inorganic interposer having first and second surfaces, and having an interconnection wiring connecting the first and second surfaces of the at least one inorganic interposer to each other, an encapsulant encapsulating at least a portion of the at least one inorganic interposer, an insulating layer disposed on the second surface of the organic frame and the second surface of the at least one inorganic interposer, a second redistribution layer having portions provided as a plurality of pads, and at least one semiconductor chip having connection electrodes respectively connected to the plurality of pads.
    Type: Grant
    Filed: July 16, 2019
    Date of Patent: October 20, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO. LTD.
    Inventors: Job Ha, Sung Hyun Kim, Ji Na Jeung
  • HYBRID INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
    Publication number: 20200168552
    Abstract: A semiconductor package includes an organic frame having first and second surfaces opposing each other, having a cavity, and having a wiring structure connecting the first and second surfaces, a connection structure disposed on the first surface of the organic frame and having a first redistribution layer connected to the wiring structure, at least one inorganic interposer having first and second surfaces, and having an interconnection wiring connecting the first and second surfaces of the at least one inorganic interposer to each other, an encapsulant encapsulating at least a portion of the at least one inorganic interposer, an insulating layer disposed on the second surface of the organic frame and the second surface of the at least one inorganic interposer, a second redistribution layer having portions provided as a plurality of pads, and at least one semiconductor chip having connection electrodes respectively connected to the plurality of pads.
    Type: Application
    Filed: July 16, 2019
    Publication date: May 28, 2020
    Inventors: Job HA, Sung Hyun KIM, Ji Na JEUNG