Patents by Inventor Jina-Ru Chen

Jina-Ru Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10170508
    Abstract: An optical package structure is provided. The optical package structure includes a substrate, a frame layer, an optical unit, a bonding layer, a transparent plate and an encapsulation layer. The frame layer formed on the substrate surrounds a cavity where the optical unit is located. The bonding layer covers a portion of an upper edge of the frame layer and exposes the other portion of the upper edge of the frame layer. The transparent plate mounted on the bonding layer extends across the optical unit and extends beyond an outer edge of the bonding layer. The encapsulation layer covers a lateral edge of the transparent plate and the outer edge of the bonding layer.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: January 1, 2019
    Assignee: KINGPAK TECHNOLOGY INC.
    Inventors: Hsiu Wen Tu, Chung-Hsien Hsin, Jina-Ru Chen
  • Publication number: 20170365632
    Abstract: An optical package structure is provided. The optical package structure includes a substrate, a frame layer, an optical unit, a bonding layer, a transparent plate and an encapsulation layer. The frame layer formed on the substrate surrounds a cavity where the optical unit is located. The bonding layer covers a portion of an upper edge of the frame layer and exposes the other portion of the upper edge of the frame layer. The transparent plate mounted on the bonding layer extends across the optical unit and extends beyond an outer edge of the bonding layer. The encapsulation layer covers a lateral edge of the transparent plate and the outer edge of the bonding layer.
    Type: Application
    Filed: June 15, 2017
    Publication date: December 21, 2017
    Inventors: Hsiu Wen TU, Chung-Hsien Hsin, Jina-Ru Chen