Abstract: A method bonds a first member to a second member. The method provides a first member having a bonding surface. A second member is molded from a metal material so as to have a surface constructed and arranged to be bonded to the bonding surface. The surface of the second member is laser trimmed to remove material and to remove byproducts, resulting from molding the second member, from the surface of the second member to thereby define a clean, laser trimmed surface of the second member. A sealant is provided between and in contact with the bonding surface and the clean, laser trimmed surface. The sealant is permitted to cure to thereby bond the first member to the second member.

Abstract: A method bonds a first member to a second member. The method provides a first member having a bonding surface. A second member is molded from a metal material so as to have a surface constructed and arranged to be bonded to the bonding surface. The surface of the second member is laser trimmed to remove material and to remove byproducts, resulting from molding the second member, from the surface of the second member to thereby define a clean, laser trimmed surface of the second member. A sealant is provided between and in contact with the bonding surface and the clean, laser trimmed surface. The sealant is permitted to cure to thereby bond the first member to the second member.

Abstract: Methods and systems for electrically coupling bonded components, including: a support layer, an electrically conductive wire supported by the support layer, and an electrically conductive adhesive, the electrically conductive adhesive being over the electrically conductive wire, the electrically conductive adhesive being electrically coupled to the electrically conductive wire, the electrically conductive adhesive extending beyond the electrically conductive wire onto the support layer, the electrically conductive adhesive being configured to adhesively bond to the support layer, the electrically conductive adhesive being configured to adhesively bond to one or more additional components above the electrically conductive adhesive, the electrically conductive wire being configured to be electrically coupled to the one or more additional components through the electrically conductive adhesive.

Abstract: A seal includes a housing with an exterior surface. The housing forms a cavity extending from the exterior surface into the housing and defines at least one slanted interior surface. The at least one slanted interior surface extends from the exterior surface of the housing and is in a substantially non-perpendicular and angled relation to the exterior surface of the housing. The seal also includes at least one electrical lead that extends through the housing and has a portion exposed across the cavity therein. The at least one electrical lead extends from the housing and is configured to be in electrical contact with at least one electrical component encased within the electronic control housing. The seal also includes an adhesive material that substantially fills the cavity and surrounds the exposed portion of the at least one electrical lead exposed across the cavity.

Abstract: A silicone composition is provided that is resistant to a hydrocarbon fluid, such as a transmission fluid, and other harsh environments when cured. The silicone composition includes a dihydroxy-terminated silicone fluid, a filler material and amine-cured cross-linking agent, the composition containing substantially no plasticizer, and wherein the cured composition can be utilized as a sealant that is resistant to exposure to transmission fluid and high temperatures for extended periods of time. The silicone composition provides effective sealant properties that withstand the foregoing conditions present in the transmission fluids. Methods of making and using the cured silicone sealants made from the present compositions are also provided.

Abstract: Methods and systems for electrically coupling bonded components, including: a support layer, an electrically conductive wire supported by the support layer, and an electrically conductive adhesive, the electrically conductive adhesive being over the electrically conductive wire, the electrically conductive adhesive being electrically coupled to the electrically conductive wire, the electrically conductive adhesive extending beyond the electrically conductive wire onto the support layer, the electrically conductive adhesive being configured to adhesively bond to the support layer, the electrically conductive adhesive being configured to adhesively bond to one or more additional components above the electrically conductive adhesive, the electrically conductive wire being configured to be electrically coupled to the one or more additional components through the electrically conductive adhesive.

Abstract: A seal includes a housing with an exterior surface. The housing forms a cavity extending from the exterior surface into the housing and defines at least one slanted interior surface. The at least one slanted interior surface extends from the exterior surface of the housing and is in a substantially non-perpendicular and angled relation to the exterior surface of the housing. The seal also includes at least one electrical lead that extends through the housing and has a portion exposed across the cavity therein. The at least one electrical lead extends from the housing and is configured to be in electrical contact with at least one electrical component encased within the electronic control housing. The seal also includes an adhesive material that substantially fills the cavity and surrounds the exposed portion of the at least one electrical lead within the cavity.

Abstract: A seal includes a housing with an exterior surface. The housing forms a cavity extending from the exterior surface into the housing and defines at least one slanted interior surface. The at least one slanted interior surface extends from the exterior surface of the housing and is in a substantially non-perpendicular and angled relation to the exterior surface of the housing. The seal also includes at least one electrical lead that extends through the housing and has a portion exposed across the cavity therein. The at least one electrical lead extends from the housing and is configured to be in electrical contact with at least one electrical component encased within the electronic control housing. The seal also includes an adhesive material that substantially fills the cavity and surrounds the exposed portion of the at least one electrical lead within the cavity.

Abstract: A method of preparing an amine-cured silicone composition is provided that is resistant to a hydrocarbon fluid, such as a transmission fluid, and other harsh environments when cured. The silicone composition includes a dihydroxy-terminated silicone fluid, a filler material and an amine-cured cross-linking agent, the composition containing substantially no plasticizer, and wherein the cured composition can be utilized as a sealant that is resistant to exposure to transmission fluid and high temperatures for extended periods of time. The silicone composition provides effective sealant properties that withstand the foregoing conditions present in the transmission fluids. Methods of using the cured silicone sealants made from the present compositions are also provided.

Abstract: A seal includes a housing with an exterior surface. The housing forms a cavity extending from the exterior surface into the housing and defines at least one slanted interior surface. The at least one slanted interior surface extends from the exterior surface of the housing and is in a substantially non-perpendicular and angled relation to the exterior surface of the housing. The seal also includes at least one electrical lead that extends through the housing and has a portion exposed across the cavity therein. The at least one electrical lead extends from the housing and is configured to be in electrical contact with at least one electrical component encased within the electronic control housing. The seal also includes an adhesive material that substantially fills the cavity and surrounds the exposed portion of the at least one electrical lead within the cavity.

Abstract: A silicone composition is provided that is resistant to a hydrocarbon fluid, such as a transmission fluid, and other harsh environments when cured. The silicone composition includes a dihydroxy-terminated silicone fluid, a filler material and amine-cured cross-linking agent, the composition containing substantially no plasticizer, and wherein the cured composition can be utilized as a sealant that is resistant to exposure to transmission fluid and high temperatures for extended periods of time. The silicone composition provides effective sealant properties that withstand the foregoing conditions present in the transmission fluids. Methods of making and using the cured silicone sealants made from the present compositions are also provided.

Abstract: An apparatus and method for an adhesive assembly for securing a printed circuit board to a substrate. The assembly provides a printing tool with a plurality of apertures defined therethrough. Preferably, the apertures have a top opening with a larger area than a bottom opening. The printing tool is placed upon one of the printed circuit board and/or substrate, and a liquid adhesive is printed onto the printing tool. The liquid adhesive forms islands of adhesive within each aperture. Removing the printing tool deforms each island to form a raised edge at a periphery of each island. A temporary liner can be placed on the raised edges to protect the adhesive until the printed circuit board can be assembled with the substrate.

Abstract: An apparatus is directed to increasing the resolution of digital color imaging that includes a photosensing semiconductor structure. The apparatus provides a monocrystalline silicon substrate, a first buffer layer epitaxially formed and overlying the monocrystalline silicon substrate, and a first photodiode layer overlying the first buffer layer and operable to provide a first signal indicative of a color associated with a first wavelength of light. The apparatus may further provide a second buffer layer overlying the first photodiode layer and a second photodiode layer overlying the second buffer layer operable to provide a second signal indicative of a color associated with a second wavelength of light.

Abstract: An apparatus and method for an adhesive assembly for securing a printed circuit board to a substrate. The assembly provides a printing tool with a plurality of apertures defined therethrough. Preferably, the apertures have a top opening with a larger area than a bottom opening. The printing tool is placed upon one of the printed circuit board and/or substrate, and a liquid adhesive is printed onto the printing tool. The liquid adhesive forms islands of adhesive within each aperture. Removing the printing tool deforms each island to form a raised edge at a periphery of each island. A temporary liner can be placed on the raised edges to protect the adhesive until the printed circuit board can be assembled with the substrate.

Abstract: The invention provides a method and system for digital x-ray imaging. The system includes a silicon substrate, a compound semiconductor including an array of imaging elements on the silicon substrate, and a scintillator layer operably disposed on the compound semiconductor layer. X-rays emitted from an x-ray source pass through a target object and are absorbed in the scintillator layer. The scintillator layer emits light in response to the absorbed x-rays, and the emitted scintillator light is detected by the array of imaging elements to provide an x-ray image corresponding to the x-rays traversing the target object.

Abstract: An apparatus is directed to increasing the resolution of digital color imaging that includes a photosensing semiconductor structure. The apparatus provides a monocrystalline silicon substrate, a first buffer layer epitaxially formed and overlying the monocrystalline silicon substrate, and a first photodiode layer overlying the first buffer layer and operable to provide a first signal indicative of a color associated with a first wavelength of light. The apparatus may further provide a second buffer layer overlying the first photodiode layer and a second photodiode layer overlying the second buffer layer operable to provide a second signal indicative of a color associated with a second wavelength of light.

Abstract: A multiple cure adhesive (204) is used to secure a circuit substrate (104) to an underlying rigid surface (106). The adhesive is screen printed on the underlying surface. A first cure is then applied to the adhesive to at least partially cure the adhesive and to make the adhesive tacky. The circuit substrate is mounted on the tacky adhesive and a second cure is applied to the adhesive to firmly secure the circuit substrate to the housing. By screen printing the adhesive on the underlying surface, the process of mounting a circuit substrate on a rigid surface can be completely automated, providing cost saving and waste reduction.