Abstract: Columnar multi-axis microelectromechanical systems (MEMS) devices (such as gyroscopes) balanced against undesired linear and angular vibration are described herein. In some embodiments, the columnar MEMS device may comprise at least two multiple-mass columns, each having at least three proof masses and being configured to sense rotation about a respective axis. The motion and mass of the proof masses may be controlled to achieve linear and rotational balancing of the MEMS device. The columnar MEMS device may further comprise one or more modular drive structures disposed alongside each multiple-mass column to facilitate displacement of the proof masses of a respective column. The MEMS devices described herein may be used to sense roll, yaw, and pitch angular rates.

Abstract: Columnar multi-axis microelectromechanical systems (MEMS) devices (such as gyroscopes) balanced against undesired linear and angular vibration are described herein. In some embodiments, the columnar MEMS device may comprise at least two multiple-mass columns, each having at least three proof masses and being configured to sense rotation about a respective axis. The motion and mass of the proof masses may be controlled to achieve linear and rotational balancing of the MEMS device. The columnar MEMS device may further comprise one or more modular drive structures disposed alongside each multiple-mass column to facilitate displacement of the proof masses of a respective column. The MEMS devices described herein may be used to sense roll, yaw, and pitch angular rates.

Abstract: Columnar multi-axis microelectromechanical systems (MEMS) devices (such as gyroscopes) balanced against undesired linear and angular vibration are described herein. In some embodiments, the columnar MEMS device may comprise at least two multiple-mass columns, each having at least three proof masses and being configured to sense rotation about a respective axis. The motion and mass of the proof masses may be controlled to achieve linear and rotational balancing of the MEMS device. The columnar MEMS device may further comprise one or more modular drive structures disposed alongside each multiple-mass column to facilitate displacement of the proof masses of a respective column. The MEMS devices described herein may be used to sense roll, yaw, and pitch angular rates.

Abstract: Columnar multi-axis microelectromechanical systems (MEMS) devices (such as gyroscopes) balanced against undesired linear and angular vibration are described herein. In some embodiments, the columnar MEMS device may comprise at least two multiple-mass columns, each having at least three proof masses and being configured to sense rotation about a respective axis. The motion and mass of the proof masses may be controlled to achieve linear and rotational balancing of the MEMS device. The columnar MEMS device may further comprise one or more modular drive structures disposed alongside each multiple-mass column to facilitate displacement of the proof masses of a respective column. The MEMS devices described herein may be used to sense roll, yaw, and pitch angular rates.

Abstract: Capped microelectromechanical systems (MEMS) devices are described. In at least some situations, the MEMS device includes one or more masses which move. The cap may include a stopper which damps motion of the one or more movable masses. In at least some situations, the stopper damps motion of one of the masses but not another mass.

Abstract: A two-axis microelectromechanical systems (MEMS) gyroscope having four proof masses disposed in respective quadrants of a plane is described. The quad proof mass gyroscope may comprise an inner coupler passing between a first and a third proof mass and between a second and a fourth proof mass, and coupling the four proof masses with one another. The quad proof mass gyroscope may further comprising a first outer coupler coupling the first and the second proof masses and a second outer coupler coupling the third and the fourth proof masses. The outer couplers may have masses configured to balance the center of masses of the four proof masses, and may have elastic constants matching the elastic constant of the inner coupler. The quad gyroscope may further comprise a plurality of sense capacitors configured to sense angular rates.

Abstract: Capped microelectromechanical systems (MEMS) devices are described. In at least some situations, the MEMS device includes one or more masses which move. The cap may include a stopper which damps motion of the one or more movable masses. In at least some situations, the stopper damps motion of one of the masses but not another mass.

Abstract: Capped microelectromechanical systems (MEMS) devices are described. In at least some situations, the MEMS device includes one or more masses which move. The cap may include a stopper which damps motion of the one or more movable masses. In at least some situations, the stopper damps motion of one of the masses but not another mass.

Abstract: Capped microelectromechanical systems (MEMS) devices are described. In at least some situations, the MEMS device includes one or more masses which move. The cap may include a stopper which damps motion of the one or more movable masses. In at least some situations, the stopper damps motion of one of the masses but not another mass.

Abstract: A two-axis microelectromechanical systems (MEMS) gyroscope having four proof masses disposed in respective quadrants of a plane is described. The quad proof mass gyroscope may comprise an inner coupler passing between a first and a third proof mass and between a second and a fourth proof mass, and coupling the four proof masses with one another. The quad proof mass gyroscope may further comprising a first outer coupler coupling the first and the second proof masses and a second outer coupler coupling the third and the fourth proof masses. The outer couplers may have masses configured to balance the center of masses of the four proof masses, and may have elastic constants matching the elastic constant of the inner coupler. The quad gyroscope may further comprise a plurality of sense capacitors configured to sense angular rates.

Abstract: An inertial sensor includes driving piezoelectric transducers for enabling an oscillation of a resonator, sensing piezoelectric transducers for enabling a detection of a movement of the inertial sensor, and piezoelectric compensating elements substantially equidistantly among the driving and the sensing piezoelectric transducers, wherein the compensating elements and the resonator form corresponding capacitors having capacitive gaps, and wherein, during the oscillation of the resonator, changes in electrostatic charges stored in the capacitors are measured with the compensating elements and are modified so as to modify the oscillation of the resonator.

Abstract: An inertial sensor includes driving piezoelectric transducers for enabling an oscillation of a resonator, sensing piezoelectric transducers for enabling a detection of a movement of the inertial sensor, and piezoelectric compensating elements substantially equidistantly among the driving and the sensing piezoelectric transducers, wherein the compensating elements and the resonator form corresponding capacitors having capacitive gaps, and wherein, during the oscillation of the resonator, changes in electrostatic charges stored in the capacitors are measured with the compensating elements and are modified so as to modify the oscillation of the resonator.

Abstract: An inertial sensor includes driving piezoelectric transducers for enabling an oscillation of a resonator, sensing piezoelectric transducers for enabling a detection of a movement of the inertial sensor, and piezoelectric compensating elements substantially equidistantly among the driving and the sensing piezoelectric transducers, wherein the compensating elements and the resonator form corresponding capacitors having capacitive gaps, and wherein, during the oscillation of the resonator, changes in electrostatic charges stored in the capacitors are measured with the compensating elements and are modified so as to modify the oscillation of the resonator.

Abstract: A method of producing a MEMS device provides a MEMS apparatus having released structure. The MEMS apparatus is formed at least in part from an SOI wafer having a first layer, a second layer spaced from the first layer, and an insulator layer between the first layer and second layer. The first layer has a top surface, while the second layer has a bottom surface facing the top surface. After providing the MEMS apparatus, the method increases the roughness of at least the top surface of the first layer or the bottom surface of the second layer.

Abstract: Inertial sensors with reduced sensitivity to quadrature errors and micromachining inaccuracies include a gyroscope incorporating two specially-configured single-axis gyroscopes for sensing rotations about two orthogonal axes (the axes of sensitivity) in the device plane, where each single-axis gyroscope includes a resonator having two rotationally-dithered shuttles interconnected by a fork and each shuttle is configured to tilt out-of-plane along a tilt axis perpendicular to the axis of sensitivity and includes corresponding Coriolis sensing electrodes positioned along an axis perpendicular to the tilt axis (i.e., parallel to the axis of sensitivity). The two single-axis gyroscopes may be interconnected, e.g., by one or more in-phase or anti-phase couplings interconnecting the forks and/or the shuttles.

Abstract: An inertial sensor includes driving piezoelectric transducers for enabling an oscillation of a resonator, sensing piezoelectric transducers for enabling a detection of a movement of the inertial sensor, and piezoelectric compensating elements substantially equidistantly among the driving and the sensing piezoelectric transducers, wherein the compensating elements and the resonator form corresponding capacitors having capacitive gaps, and wherein, during the oscillation of the resonator, changes in electrostatic charges stored in the capacitors are measured with the compensating elements and are modified so as to modify the oscillation of the resonator.

Abstract: In a micromachined devices having a movable shuttle driven in oscillation, measuring the electrical charge accumulated on opposing drive capacitors to determine the displacement of the movable shuttle. Alternately, in such a micromachined device, measuring the electrical charge accumulated on a drive capacitor and comparing the measured electrical charge to a nominal electrical charge to determine the displacement of the movable shuttle.

Abstract: Inertial sensors with reduced sensitivity to quadrature errors and micromachining inaccuracies include a gyroscope incorporating two specially-configured single-axis gyroscopes for sensing rotations about two orthogonal axes (the axes of sensitivity) in the device plane, where each single-axis gyroscope includes a resonator having two rotationally-dithered shuttles interconnected by a fork and each shuttle is configured to tilt out-of-plane along a tilt axis perpendicular to the axis of sensitivity and includes corresponding Coriolis sensing electrodes positioned along an axis perpendicular to the tilt axis (i.e., parallel to the axis of sensitivity). The two single-axis gyroscopes may be interconnected, e.g., by one or more in-phase or anti-phase couplings interconnecting the forks and/or the shuttles.

Abstract: Transducers comprising a frame structure made of piezoelectric material convert energy, through piezoelectric effect, between electrostatic energy associated with voltage differential between the electrodes sandwiching the frame structure and mechanical energy associated with deformation of the frame structure. Inertial sensors such as gyroscopes and accelerators, including inertial sensors comprising ring resonators, utilize said transducers both to generate oscillations of their resonators and to sense the changes in such oscillations produced, in the sensors' frame of reference, by Coriolis forces appearing due to the movement of the sensors.

Abstract: In a micromachined devices having a movable shuttle driven in oscillation, measuring the electrical charge accumulated on opposing drive capacitors to determine the displacement of the movable shuttle. Alternately, in such a micromachined device, measuring the electrical charge accumulated on a drive capacitor and comparing the measured electrical charge to a nominal electrical charge to determine the displacement of the movable shuttle.