Patents by Inventor Jinchang ZHOU
Jinchang ZHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240072008Abstract: A semiconductor device has an interposer including a plurality of conductive vias formed through the interposer. A first semiconductor die is disposed over the interposer. A second semiconductor die is disposed over a first substrate. The first semiconductor die and second semiconductor die are power semiconductor devices. The interposer is disposed over the second semiconductor die opposite the first substrate. A second substrate is disposed over the first semiconductor die opposite the interposer. The first substrate and second substrate provide heat dissipation from the first semiconductor die and second semiconductor die from opposite sides of the semiconductor device. A plurality of first and second interconnect pads is formed in a pattern over the first semiconductor die and second semiconductor die. The second interconnect pads have a different area than the first interconnect pads to aid with alignment when stacking the assembly.Type: ApplicationFiled: November 7, 2023Publication date: February 29, 2024Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Jinchang ZHOU, Yusheng LIN, Mingjiao LIU
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Publication number: 20220293499Abstract: Implementations of power modules may include: a substrate having a first side and a second side. The power module may include a plurality of leads coupled to a second side of the substrate and a molding compound over a portion of five or more surfaces of the substrate. The power module may also include an opening extending from a first side of the substrate to an outer edge of the molding compound. The opening may be configured to receive a coupling device and the coupling device may be configured to couple with a heat sink or a package support.Type: ApplicationFiled: May 27, 2022Publication date: September 15, 2022Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Jinchang ZHOU, Asif JAKWANI, Chee Hiong CHEW, Yusheng LIN, Sravan VANAPARTHY, Silnore Tejero SABANDO
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Patent number: 11373939Abstract: Implementations of power modules may include: a substrate having a first side and a second side. The power module may include a plurality of leads coupled to a second side of the substrate and a molding compound over a portion of five or more surfaces of the substrate. The power module may also include an opening extending from a first side of the substrate to an outer edge of the molding compound. The opening may be configured to receive a coupling device and the coupling device may be configured to couple with a heat sink or a package support.Type: GrantFiled: August 30, 2019Date of Patent: June 28, 2022Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Jinchang Zhou, Asif Jakwani, Chee Hiong Chew, Yusheng Lin, Sravan Vanaparthy, Silnore Tejero Sabando
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Publication number: 20200098671Abstract: Implementations of power modules may include: a substrate having a first side and a second side. The power module may include a plurality of leads coupled to a second side of the substrate and a molding compound over a portion of five or more surfaces of the substrate. The power module may also include an opening extending from a first side of the substrate to an outer edge of the molding compound. The opening may be configured to receive a coupling device and the coupling device may be configured to couple with a heat sink or a package support.Type: ApplicationFiled: August 30, 2019Publication date: March 26, 2020Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Jinchang ZHOU, Asif JAKWANI, Chee Hiong CHEW, Yusheng LIN, Sravan VANAPARTHY, Silnore Tejero SABANDO
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Patent number: 10438932Abstract: A semiconductor device has an interposer including a plurality of conductive vias formed through the interposer. A first semiconductor die is disposed over the interposer. A second semiconductor die is disposed over a first substrate. The first semiconductor die and second semiconductor die are power semiconductor devices. The interposer is disposed over the second semiconductor die opposite the first substrate. A second substrate is disposed over the first semiconductor die opposite the interposer. The first substrate and second substrate provide heat dissipation from the first semiconductor die and second semiconductor die from opposite sides of the semiconductor device. A plurality of first and second interconnect pads is formed in a pattern over the first semiconductor die and second semiconductor die. The second interconnect pads have a different area than the first interconnect pads to aid with alignment when stacking the assembly.Type: GrantFiled: April 16, 2018Date of Patent: October 8, 2019Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Jinchang Zhou, Yusheng Lin, Mingjiao Liu
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Publication number: 20180240786Abstract: A semiconductor device has an interposer including a plurality of conductive vias formed through the interposer. A first semiconductor die is disposed over the interposer. A second semiconductor die is disposed over a first substrate. The first semiconductor die and second semiconductor die are power semiconductor devices. The interposer is disposed over the second semiconductor die opposite the first substrate. A second substrate is disposed over the first semiconductor die opposite the interposer. The first substrate and second substrate provide heat dissipation from the first semiconductor die and second semiconductor die from opposite sides of the semiconductor device. A plurality of first and second interconnect pads is formed in a pattern over the first semiconductor die and second semiconductor die. The second interconnect pads have a different area than the first interconnect pads to aid with alignment when stacking the assembly.Type: ApplicationFiled: April 16, 2018Publication date: August 23, 2018Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Jinchang ZHOU, Yusheng LIN, Mingjiao LIU
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Publication number: 20180233491Abstract: A semiconductor device has an interposer including a plurality of conductive vias formed through the interposer. A first semiconductor die is disposed over the interposer. A second semiconductor die is disposed over a first substrate. The first semiconductor die and second semiconductor die are power semiconductor devices. The interposer is disposed over the second semiconductor die opposite the first substrate. A second substrate is disposed over the first semiconductor die opposite the interposer. The first substrate and second substrate provide heat dissipation from the first semiconductor die and second semiconductor die from opposite sides of the semiconductor device. A plurality of first and second interconnect pads is formed in a pattern over the first semiconductor die and second semiconductor die. The second interconnect pads have a different area than the first interconnect pads to aid with alignment when stacking the assembly.Type: ApplicationFiled: April 16, 2018Publication date: August 16, 2018Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Jinchang ZHOU, Yusheng LIN, Mingjiao LIU
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Patent number: 9972607Abstract: A semiconductor device has an interposer including a plurality of conductive vias formed through the interposer. A first semiconductor die is disposed over the interposer. A second semiconductor die is disposed over a first substrate. The first semiconductor die and second semiconductor die are power semiconductor devices. The interposer is disposed over the second semiconductor die opposite the first substrate. A second substrate is disposed over the first semiconductor die opposite the interposer. The first substrate and second substrate provide heat dissipation from the first semiconductor die and second semiconductor die from opposite sides of the semiconductor device. A plurality of first and second interconnect pads is formed in a pattern over the first semiconductor die and second semiconductor die. The second interconnect pads have a different area than the first interconnect pads to aid with alignment when stacking the assembly.Type: GrantFiled: August 8, 2016Date of Patent: May 15, 2018Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Jinchang Zhou, Yusheng Lin, Mingjiao Liu
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Publication number: 20180040593Abstract: A semiconductor device has an interposer including a plurality of conductive vias formed through the interposer. A first semiconductor die is disposed over the interposer. A second semiconductor die is disposed over a first substrate. The first semiconductor die and second semiconductor die are power semiconductor devices. The interposer is disposed over the second semiconductor die opposite the first substrate. A second substrate is disposed over the first semiconductor die opposite the interposer. The first substrate and second substrate provide heat dissipation from the first semiconductor die and second semiconductor die from opposite sides of the semiconductor device. A plurality of first and second interconnect pads is formed in a pattern over the first semiconductor die and second semiconductor die. The second interconnect pads have a different area than the first interconnect pads to aid with alignment when stacking the assembly.Type: ApplicationFiled: August 8, 2016Publication date: February 8, 2018Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Jinchang ZHOU, Yusheng LIN, Mingjiao LIU