Abstract: A planar-type magnetron sputtering apparatus capable of forming a uniform thin coating on the entire surface of a substrate having a large area is disclosed. This sputtering apparatus has an insulating target seat, a permanent magnet closed circuit unit consisting of at least two permanent magnet closed circuits, and used for applying an electric field to the target, and a closed circuit moving unit used for continuously moving the permanent magnet closed circuit unit in one direction along an elliptical track parallel to the surface of the target. Due to the movement of permanent magnet closed circuits in one direction, the magnetron discharge tracks continuously moves along the target surface in the same direction. This sputtering apparatus thus allows the target to be uniformly etched on its surface. It is thus possible to form a desired uniform thin coating on the entire surface of a substrate having a large area.

Abstract: A method and apparatus for controlling thin layer sputtering, especially titanium-nitride-type hard, abrasion-proof layers. Ionization current on substrates, especially at greater distances from cathode, is increased and layers are more homogenous. Density and homogeneity of both ionization and electron current on substrates are increased and ionic cladding during layer sputtering and with floating potential of substrates is possible. Substrates are placed in a holding space defined by lines of force of a magnetic multipolar field that includes a closed tunnel of magnetron-type lines of force above the sputtered cathode and whose direction on the boundary of the holding space alternates from positive to negative polarity and vice versa. In the holding space, interaction of the glow discharge with the magnetic multipolar field forms a homogenous plasma whose particles bombard the substrates.