Patents by Inventor Jine Liu

Jine Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10866477
    Abstract: An array substrate and a display panel are provided. The array substrate includes a base layer, a first metal layer, a first insulating layer, a second metal layer, a second insulating layer, a first electrode layer, and a reflective layer successively stacked along a direction perpendicular to a plane in which the base layer is located. The second metal layer is used to form a source and a drain of a thin film transistor. The first electrode layer is used to form a pixel electrode. The second insulating layer is provided with a through-hole. The pixel electrode is connected to the drain of the thin film transistor through the through-hole. The reflective layer is provided with a first through-hole, and an orthographic projection of the first through-hole onto the base layer covers an orthographic projection of the through-hole onto the base layer.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: December 15, 2020
    Assignee: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Ming Xie, Qiang Jia, Mingwei Zhang, Xiangjian Kong, Jine Liu, Feng Qin
  • Publication number: 20200365626
    Abstract: A display component and a display device are provided. The display component includes a display panel including a first substrate, a thin-film transistor array layer, a second substrate and a coil-containing film layer. The coil-containing film layer at least includes a first metal layer, a first insulation layer, a second metal layer, and a second insulation layer. The first metal layer includes at least one first coil and the second metal layer includes at least one signal line, where the one first coil of the first metal layer is electrically connected to one or two signal lines of the second metal layer. An orthographic projection of the first coil on the first substrate is at least partially in the display region. The display component further includes a coil drive circuit, where the coil drive circuit is electrically connected to each of the first coil and the signal line, respectively.
    Type: Application
    Filed: August 6, 2019
    Publication date: November 19, 2020
    Inventors: Baiquan LIN, Kerui XI, Junting OUYANG, Qiongqin MAO, Feng QIN, Xiangjian KONG, Jine LIU, Xiaohe LI
  • Patent number: 10809848
    Abstract: A touch-control display panel, driving method, and a touch-control display device are provided. The touch-control display panel includes: a display area including a plurality of pixels; a non-display area; a first substrate; and a second substrate opposing the first substrate. A portion of the first substrate in the first region includes a pixel electrode layer and a first electrode layer. The first electrode layer is located on a side of the pixel electrode layer away from the second substrate and includes a plurality of first electrodes. The pixel electrode layer includes a plurality of pixel electrodes. A touch-control electrode layer is located on a side of the second substrate toward the first substrate and includes a plurality of touch-control electrodes. Along a direction perpendicular to the touch-control display panel, each touch-control electrode of the plurality of the touch-control electrode overlaps with and connects with one or more first electrode of the plurality of the first electrodes.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: October 20, 2020
    Assignee: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Xiangjian Kong, Feng Qin, Jine Liu, Lei Wang, Chunmei Gao, Qiongqin Mao
  • Publication number: 20200328159
    Abstract: A panel-level chip device and a packaging method for forming the panel-level chip device are provided. The panel-level chip device includes a plurality of first bare chips disposed on a supporting base, and a plurality of first connection pillars. The panel-level chip device also includes a first encapsulation layer, and a first redistribution layer. The first redistribution layer includes a plurality of first redistribution elements and a plurality of second redistribution elements. Further, the panel-level chip device includes a solder ball group including a plurality of first solder balls. First connection pillars having a same electrical signal are electrically connected to each other by a first redistribution element. Each of remaining first connection pillars is electrically connected to one second redistribution element. The one second redistribution element is further electrically connected to a first solder ball of the plurality of first solder balls.
    Type: Application
    Filed: June 28, 2019
    Publication date: October 15, 2020
    Inventors: Kerui XI, Feng QIN, Jine LIU, Xiaohe LI, Tingting CUI
  • Publication number: 20200319449
    Abstract: A driving circuit includes a first signal-input terminal, a second signal-input terminal, a third signal-input terminal, a fourth signal-input terminal, a signal-output terminal, and a voltage-boosting unit including a first module, a second module, a third module, and a first capacitor. The first module transmits the signal at the third signal-input terminal to a first terminal of the first capacitor during a first time period, and blocks signal transmission during a second time period. During the first time period and the second time period, the second module transmits the signal at the third signal-input terminal to the third module to allow the signal at the fourth signal-input terminal to be transmitted to a second terminal of the first capacitor. During a third time period, the second module and the third module both block signal transmission. The first terminal of the first capacitor is connected to the signal-output terminal for output.
    Type: Application
    Filed: June 29, 2019
    Publication date: October 8, 2020
    Inventors: Baiquan LIN, Kerui XI, Feng QIN, Yian ZHOU, Xiangjian KONG, Jine LIU
  • Publication number: 20200316591
    Abstract: A drive circuit and its drive method, and a panel and its drive method are provided. The drive circuit includes a step-up unit, a plurality of signal input terminals and a signal output terminal. The step-up unit includes a first module, a second module and a first capacitor. The first module is configured to transmit a signal of a third signal input terminal to a first electrode of the first capacitor. The second module is configured to transmit a signal of a fourth signal input terminal to a second electrode of the first capacitor at a first time period which generates a voltage difference between two electrodes of the first capacitor, and to transmit the signal of the fourth signal input terminal to the second electrode of the first capacitor at a second time period which further increases a signal of the first electrode of the first capacitor.
    Type: Application
    Filed: June 29, 2019
    Publication date: October 8, 2020
    Inventors: Kerui XI, Xiaohe LI, Feng QIN, Jine LIU, Tingting CUI, Baiquan LIN
  • Publication number: 20200312772
    Abstract: Chip package structure and chip package method are provided. The chip package structure includes an encapsulating layer, a redistribution layer, a soldering pad group, and bare chips. Connecting posts is formed on a side of the bare chips. The encapsulating layer covers the bare chips and the connecting posts, while exposes a side of the connecting posts away from the bare chips. The redistribution layer on the connecting posts includes a first redistribution wire, a second redistribution wire, and a third redistribution wire. The first redistribution wire and the second redistribution wire are electrically connected to at least one connecting post respectively, and the third redistribution layer is electrically connected to remaining connecting posts. The soldering pad group on the redistribution layer includes an input soldering pad electrically connected to the first redistribution wire and an output soldering pad electrically connected to the second redistribution wire.
    Type: Application
    Filed: June 14, 2019
    Publication date: October 1, 2020
    Inventors: Kerui XI, Feng QIN, Jine LIU, Xiaohe LI, Tingting CUI, Yuan DING
  • Publication number: 20200306754
    Abstract: A microfluidic chip, a method for driving a microfluidic chip and an analysis apparatus are provided. An exemplary microfluidic chip includes a substrate; a number of M driving electrodes disposed on a side of the substrate and arranged along a first direction; and a number of N signal terminals electrically connected to the number of M driving electrodes. Any three adjacent driving electrodes are connected to different signal terminals, respectively; a number of A of the number of M driving electrodes are connected to a same signal terminal; and M, N and A are positive integers, and M?4, N?3, M>N, and A?2.
    Type: Application
    Filed: June 18, 2019
    Publication date: October 1, 2020
    Inventors: Kerui XI, Feng QIN, Jine LIU, Xiaohe LI, Tingting CUI
  • Publication number: 20200312763
    Abstract: Chip package structure and chip package method are provided. The chip package structure includes an encapsulating layer, a first metal layer, a second metal layer, and bare chips. The bare chips include first bare chips and second bare chips. First-connecting-posts are formed on a side of the first bare chips and on a side of the second bare chips. The encapsulating layer covers the bare chips and the first-connecting-posts. The first metal layer is disposed on the side of the first-connecting-posts away from the bare chips and includes first capacitor polar plates and conductive parts. The first capacitor polar plates are electrically connected to the first-connecting-posts on the first bare chips, and the conductive parts are electrically connected to the first-connecting-posts on the second bare chips. The second metal layer is disposed on a side of the first metal layer away from the encapsulating layer and includes second capacitor polar plates electrically connected to the conductive parts.
    Type: Application
    Filed: June 14, 2019
    Publication date: October 1, 2020
    Inventors: Kerui XI, Feng QIN, Jine LIU, Xiaohe LI, Tingting CUI, Xuhui PENG
  • Publication number: 20200312779
    Abstract: Chip package method and chip package structure are provided. The chip package method includes: providing a transparent substrate including a first side and a second side; coating the first side of the transparent substrate with an organic polymer material layer; depositing a protective layer on the organic polymer material layer; forming alignment parts on the protective layer; attaching a plurality of chips including metal pins; forming an encapsulating layer on the protective layer; polishing the encapsulating layer to expose the metal pins; forming a first insulating layer; forming first through holes in the first insulating layer; forming metal parts extending along sidewalls of the first through holes; and irradiating the second side of the transparent substrate by a laser to lift off the transparent substrate. The metal parts are insulated from each other and electrically connected to the metal pins.
    Type: Application
    Filed: June 28, 2019
    Publication date: October 1, 2020
    Inventors: Kerui XI, Feng QIN, Jine LIU, Xiaohe LI, Tingting CUI
  • Patent number: 10790225
    Abstract: Chip package structure and chip package method are provided. The chip package structure includes an encapsulating layer, a first metal layer, a second metal layer, and bare chips. The bare chips include first bare chips and second bare chips. First-connecting-posts are formed on a side of the first bare chips and on a side of the second bare chips. The encapsulating layer covers the bare chips and the first-connecting-posts. The first metal layer is disposed on the side of the first-connecting-posts away from the bare chips and includes first capacitor polar plates and conductive parts. The first capacitor polar plates are electrically connected to the first-connecting-posts on the first bare chips, and the conductive parts are electrically connected to the first-connecting-posts on the second bare chips. The second metal layer is disposed on a side of the first metal layer away from the encapsulating layer and includes second capacitor polar plates electrically connected to the conductive parts.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: September 29, 2020
    Assignee: SHANGHAI AVIC OPTO ELECTRONICS CO., LTD.
    Inventors: Kerui Xi, Feng Qin, Jine Liu, Xiaohe Li, Tingting Cui, Xuhui Peng
  • Patent number: 10699650
    Abstract: A driving method for an electrowetting panel is provided. The electrowetting panel includes M driving electrodes sequentially arranged along a first direction. The driving method includes providing electrical signals to the M driving electrodes, such that a droplet is acquired from a solution reservoir by the 1st driving electrode, and is driven to move by the M driving electrodes. During a droplet moving period, a pulse width of a driving signal of an mth driving electrode is Wm = ? i = 1 m ? ? W i , a pulse width of a non-driving signal between an ath driving signal and an (a+1)th driving signal of the mth driving electrode is Zma = ? i = m + 1 m + a ? ? W i . M, m, and a are positive integers, 1?m?M, and M?3. The end time of the 1st driving signal of the mth driving electrode and the end time of the mth driving signal of the 1st driving electrode are the same.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: June 30, 2020
    Assignee: SHANGHAI AVIC OPTO ELECTRONICS CO., LTD.
    Inventors: Kerui Xi, Feng Qin, Jine Liu, Xiaohe Li, Tingting Cui, Yuan Ding
  • Publication number: 20200105180
    Abstract: A driving method for a display device. The display device includes a display panel configured to display images and a driving chip configured to provide driving signals and data signals to the display panel. The driving method includes inputting initial image data; determining whether picture switching occurs; and in response to determining that picture switching occurs, using a progressive scanning mode to provide the driving signals to the display panel, and in response to determining that picture switching does not occur, using an interlaced scanning mode to provide the driving signals to the display panel.
    Type: Application
    Filed: December 7, 2018
    Publication date: April 2, 2020
    Inventors: Lei WANG, Xiangjian KONG, Mingwei ZHANG, Dachao LIU, Liang ZHOU, Jine LIU, Feng QIN
  • Publication number: 20190392771
    Abstract: Provided are an array substrate, an electronic paper display panel and a drive method thereof and a display device. A display area includes a plurality of sub-display areas, a plurality of data lines in each sub-display area are electrically insulated from each other, corresponding data lines in different sub-display areas are electrically connected to each other, and a control signal line is configured to control display time of each sub-display area. When a control chip and a flexible circuit board are employed, only a small number of control chips and flexible circuit boards may drive the plurality of sub-display areas to display pictures.
    Type: Application
    Filed: November 13, 2018
    Publication date: December 26, 2019
    Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
    Inventors: Zuzhao Xu, Kerui Xi, Baiquan Lin, Xiaohe Li, Jine Liu, Feng Qin, Qiongqin Mao, Tinghai Wang, Mingwei Zhang
  • Publication number: 20190393245
    Abstract: In an array substrate, an electronic paper display panel and a drive method thereof, and a display device, a display area includes multiple sub-display areas. A plurality of scanning lines in each sub-display area are electrically insulated from each other, corresponding scanning lines in different sub-display areas are electrically connected to each other and display time of each sub-display area is controlled through control signal lines. When a control chip and a flexible circuit board are employed, only a small number of control chips and/or flexible circuit boards, or even only one control chip and/or one flexible circuit board, may drive multiple sub-display areas to display pictures.
    Type: Application
    Filed: November 13, 2018
    Publication date: December 26, 2019
    Applicant: Shanghai AVIC OPTO Electronics Co., Ltd.
    Inventors: Kerui Xi, Tingting Cui, Feng Qin, Jine Liu, Xiaohe Li
  • Patent number: 10503296
    Abstract: A touch display panel includes: a base substrate provided with multiple gate lines and data lines which are insulated from and intersecting with each other to define multiple sub-pixels; a common electrode layer, formed by multiple self-capacitance electrodes arranged in an M*N array; a drive integrated circuit; and multiple touch detection signal lines; at least three adjacent columns of sub-pixels constitute a pixel column, each column of sub-pixels is parallel to an extending direction of the data line; the touch detection signal line is located between two adjacent columns of sub-pixels, the multiple touch detection signal lines connects the self-capacitance electrode with the drive integrated circuit, at least part of two adjacent pixel columns is not provided with the touch detection signal line therebetween; the drive integrated circuit provides common signal or touch detection signal to the touch detection signal line in display stage or touch stage, respectively.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: December 10, 2019
    Assignee: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Hao Guo, Jine Liu, Xiangjian Kong, Min Zhang
  • Publication number: 20190361307
    Abstract: A 3D printed display panel includes two opposing substrates and a black matrix formed on one of the substrates. The light proof areas of the black matrix include multiple first portions, multiple second portions and multiple third portions arranged to form a grid structure. The first portions and the third portions are alternately arranged in a direction of the scanning lines, the second portions and the third portions are alternately arranged in a direction of the data lines. Meshes of the grid structure are aperture zones of the black matrix. The aperture zones are in one-to-one correspondence with the pixel units. A vertical projections of the scanning lines and the data lines on the second substrate are located in the lightproof areas; where a minimum width of one first portion is X, a minimum width of one second portion is Y, and |X?Y|?2 ?m.
    Type: Application
    Filed: August 6, 2019
    Publication date: November 28, 2019
    Inventors: Kerui XI, Chen WANG, Feng QIN, Xiaohe LI, Jine LIU, Tingting CUI
  • Publication number: 20190332219
    Abstract: A touch-control display panel, driving method, and a touch-control display device are provided. The touch-control display panel includes: a display area including a plurality of pixels; a non-display area; a first substrate; and a second substrate opposing the first substrate. A portion of the first substrate in the first region includes a pixel electrode layer and a first electrode layer. The first electrode layer is located on a side of the pixel electrode layer away from the second substrate and includes a plurality of first electrodes. The pixel electrode layer includes a plurality of pixel electrodes. A touch-control electrode layer is located on a side of the second substrate toward the first substrate and includes a plurality of touch-control electrodes. Along a direction perpendicular to the touch-control display panel, each touch-control electrode of the plurality of the touch-control electrode overlaps with and connects with one or more first electrode of the plurality of the first electrodes.
    Type: Application
    Filed: October 22, 2018
    Publication date: October 31, 2019
    Inventors: Xiangjian KONG, Feng QIN, Jine LIU, Lei WANG, Chunmei GAO, Qiongqin MAO
  • Patent number: 10401694
    Abstract: A liquid display panel, and a display device are provided. The liquid display panel includes an array substrate. The array substrate includes a base substrate, a plurality of data lines, a plurality of scanning lines, and an auxiliary electrode. The data lines and the scanning lines intersect to form a plurality of pixels arranged in an array. Each pixel includes a first sub-pixel and a second sub-pixel adjacent to each other. Each first sub-pixel includes a first pixel electrode and a first electrode, while each second sub-pixel includes a second pixel electrode. The second sub-pixel has an area larger than the first pixel; and the second pixel electrode has an area larger than the first pixel electrode. At least a portion of the auxiliary electrode and the first electrode overlap with each other to form a first auxiliary capacitance for the first sub-pixel, and an overlap region between the auxiliary electrode and the first electrode extends into the second sub-pixel of a same pixel.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: September 3, 2019
    Assignee: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Lei Wang, Mingwei Zhang, Xiangjian Kong, Jine Liu, Feng Qin
  • Publication number: 20190227397
    Abstract: A liquid display panel, and a display device are provided. The liquid display panel includes an array substrate. The array substrate includes a base substrate, a plurality of data lines, a plurality of scanning lines, and an auxiliary electrode. The data lines and the scanning lines intersect to form a plurality of pixels arranged in an array. Each pixel includes a first sub-pixel and a second sub-pixel adjacent to each other. Each first sub-pixel includes a first pixel electrode and a first electrode, while each second sub-pixel includes a second pixel electrode. The second sub-pixel has an area larger than the first pixel; and the second pixel electrode has an area larger than the first pixel electrode. At least a portion of the auxiliary electrode and the first electrode overlap with each other to form a first auxiliary capacitance for the first sub-pixel, and an overlap region between the auxiliary electrode and the first electrode extends into the second sub-pixel of a same pixel.
    Type: Application
    Filed: April 11, 2018
    Publication date: July 25, 2019
    Inventors: Lei WANG, Mingwei ZHANG, Xiangjian KONG, Jine LIU, Feng QIN