Patents by Inventor Jing-Bing YU

Jing-Bing YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10746595
    Abstract: An ambient-light-sensing hole structure package and a method of manufacturing the same are provided. The ambient-light-sensing hole structure package includes a transparent cover, a decorative layer, a porous structure layer, and an optical adhesive. The transparent cover has a surface. The decorative layer is disposed on the surface and the decorative layer has an opening that exposes a portion of the surface. The porous structure layer is disposed on one side of the decorative layer and the porous structure layer covers the portion of the surface. The porous structure layer includes a plurality of through holes, and the through holes overlap with the opening. The optical adhesive is interposed between the decorative layer and the porous structure layer.
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: August 18, 2020
    Assignees: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD., INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD., GENERAL INTERFACE SOLUTION LIMITED
    Inventors: Chun-Hung Chen, Jing-Bing Yu, Tai-Wu Lin, Yen-Chang Yao, Ya-Ting Chang, Pang-Chiang Chia, Yen-Heng Huang
  • Patent number: 10579192
    Abstract: The touch panel includes a transparent substrate, a first touch-sensing electrode structure, a second touch-sensing electrode structure, and a patterned metal layer. The transparent substrate has a touch-sensing region and a peripheral region adjacent to at least one edge of the touch-sensing region. The first touch-sensing electrode structure is disposed on the touch-sensing region of the transparent substrate. The second touch-sensing electrode structure is positioned over the touch-sensing region and is configured to form at least one capacitor with the first touch-sensing electrode structure. The patterned metal layer has a plurality of first through holes located in the peripheral region and is extended on a level the same as the first touch-sensing electrode structure or the second touch-sensing electrode structure.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: March 3, 2020
    Assignees: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD., INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD., GENERAL INTERFACE SOLUTIONS LIMITED
    Inventors: Jing-Bing Yu, Yen-Chang Yao, Chen-Ming Jen, Tai-Wu Lin
  • Publication number: 20190285467
    Abstract: An ambient-light-sensing hole structure package and a method of manufacturing the same are provided. The ambient-light-sensing hole structure package includes a transparent cover, a decorative layer, a porous structure layer, and an optical adhesive. The transparent cover has a surface. The decorative layer is disposed on the surface and the decorative layer has an opening that exposes a portion of the surface. The porous structure layer is disposed on one side of the decorative layer and the porous structure layer covers the portion of the surface. The porous structure layer includes a plurality of through holes, and the through holes overlap with the opening. The optical adhesive is interposed between the decorative layer and the porous structure layer.
    Type: Application
    Filed: May 7, 2018
    Publication date: September 19, 2019
    Inventors: Chun-Hung CHEN, Jing-Bing YU, Tai-Wu LIN, Yen-Chang YAO, Ya-Ting CHANG, Pang-Chiang CHIA, Yen-Heng HUANG
  • Publication number: 20190050077
    Abstract: The touch panel includes a transparent substrate, a first touch-sensing electrode structure, a second touch-sensing electrode structure, and a patterned metal layer. The transparent substrate has a touch-sensing region and a peripheral region adjacent to at least one edge of the touch-sensing region. The first touch-sensing electrode structure is disposed on the touch-sensing region of the transparent substrate. The second touch-sensing electrode structure is positioned over the touch-sensing region and is configured to form at least one capacitor with the first touch-sensing electrode structure. The patterned metal layer has a plurality of first through holes located in the peripheral region and is extended on a level the same as the first touch-sensing electrode structure or the second touch-sensing electrode structure.
    Type: Application
    Filed: January 25, 2018
    Publication date: February 14, 2019
    Inventors: Jing-Bing YU, Yen-Chang YAO, Chen-Ming JEN, Tai-Wu LIN
  • Publication number: 20190011601
    Abstract: A panel for increasing transmittance of a camera lens comprises a substrate, a shielding layer and an anti-reflective coating structure. The substrate comprises a panel region and a peripheral region. The peripheral region surrounds the panel region. The shielding layer is located on the peripheral region. The shielding layer has a camera lens. The camera lens is a window for capturing images. The anti-reflective coating structure comprises an optical adhesive layer, an anti-reflective coating base material layer and an anti-reflective coating layer. The optical adhesive layer is located on the substrate and inside the camera lens. A manufacturing method of a panel is provided for increasing transmittance of camera lens. The anti-reflective coating structure adheres to the camera lens via the optical adhesive layer, so as to increase the production efficiency and to reduce the cost.
    Type: Application
    Filed: August 14, 2017
    Publication date: January 10, 2019
    Inventor: Jing-Bing YU
  • Publication number: 20160209943
    Abstract: The present disclosure provides a transparent conductive structure having metal mesh and including a transparent substrate, a first metal mesh structure, a first transparent insulating layer, a second metal mesh structure and a second transparent insulating layer. The transparent substrate has a top surface and a bottom surface opposite to the top surface. The first metal mesh structure is disposed on the top surface of the transparent substrate. The first transparent insulating layer surrounds the first metal mesh structure, and covers the top surface of the transparent substrate. The second metal mesh structure is disposed on the bottom surface of the transparent substrate. The second transparent insulating layer surrounds the second metal mesh structure, and covers the bottom surface of the transparent substrate.
    Type: Application
    Filed: July 28, 2015
    Publication date: July 21, 2016
    Inventors: Jing-Bing YU, Tai-Wu LIN