Patents by Inventor Jing Bo Wang

Jing Bo Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230268142
    Abstract: The disclosure provides a key device including a housing, a soft material layer, and a key component. The housing has at least one first assembly hole. The soft material layer is disposed on the housing and has at least one second assembly hole. The key component includes at least one key body and an elastic frame. The key body is exposed to the housing through the second assembly hole and the first assembly hole correspondingly. The elastic frame is connected with the key body and squeezes the soft material layer. The key device of the disclosure has waterproof and dustproof functions and may effectively reduce the cost.
    Type: Application
    Filed: February 16, 2023
    Publication date: August 24, 2023
    Applicants: Maintek Computer (Suzhou) Co., Ltd., PEGATRON CORPORATION
    Inventors: Jing-Bo Wang, Chun-Yen Huang, Yan-Bo An
  • Publication number: 20230268145
    Abstract: The disclosure provides a key device including a casing, a soft material layer, a key, and an elastic support member. The casing has a first assembly hole. The soft material layer is disposed on the casing and has a second assembly hole. The key presses the soft material layer and is disposed on the casing. The key has a key body, and the key body passes through the second assembly hole and the first assembly hole correspondingly and is exposed to the outside of the casing. The elastic support member is assembled on the key and disposed on the casing, and the elastic support member has a sliding groove. The sliding groove corresponds to the key so that the key is slidably disposed in the sliding groove. The key device of the disclosure has slidable, waterproof, and dustproof functions.
    Type: Application
    Filed: February 14, 2023
    Publication date: August 24, 2023
    Applicants: Maintek Computer (Suzhou) Co., Ltd., PEGATRON CORPORATION
    Inventors: Jing-Bo Wang, Chun-Yen Huang, Yan-Bo An
  • Patent number: 10535376
    Abstract: The present disclosure provides a hard disk assembly device for assembling a hard disk into a case. Two opposite sides of the hard disk respectively have at least one first positioning portion and at least one second positioning portion. The hard disk assembly device includes a flexible fixing frame and a fixing bracket. One side of the flexible fixing frame includes at least one third positioning portion and at least one first guiding portion, and the other side of the flexible fixing frame includes at least one fourth positioning portion, a draw tape, and two fastening portions. The two fastening portions are respectively correspondingly connected with two ends of the draw tape. The hard disk is fixed in the flexible fixing frame. The flexible fixing frame is fixed to the fixing bracket.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: January 14, 2020
    Assignees: Maintek Computer (Suzhou) Co., Ltd., Pegatron Corporation
    Inventors: Hui Bian, Yan-Bo An, Jing-Bo Wang, Chia-Cheng Tang, Xue-Bing Cheng
  • Publication number: 20200013433
    Abstract: The present disclosure provides a hard disk assembly device for assembling a hard disk into a case. Two opposite sides of the hard disk respectively have at least one first positioning portion and at least one second positioning portion. The hard disk assembly device includes a flexible fixing frame and a fixing bracket. One side of the flexible fixing frame includes at least one third positioning portion and at least one first guiding portion, and the other side of the flexible fixing frame includes at least one fourth positioning portion, a draw tape, and two fastening portions. The two fastening portions are respectively correspondingly connected with two ends of the draw tape. The hard disk is fixed in the flexible fixing frame. The flexible fixing frame is fixed to the fixing bracket.
    Type: Application
    Filed: May 21, 2019
    Publication date: January 9, 2020
    Applicants: Maintek Computer (Suzhou) Co., Ltd., PEGATRON CORPORATION
    Inventors: HUI BIAN, Yan-Bo An, Jing-Bo Wang, Chia-Cheng Tang, Xue-Bing Cheng
  • Patent number: 9853415
    Abstract: A semiconductor laser device of the present disclosure includes a cooling plate, an insulating sheet, a first cooling block, and a first semiconductor laser element. The conductive cooling plate includes a water supply passage and a drain passage. The insulating sheet is provided to the cooling plate, and includes a first through hole connected to the water supply passage and a second through hole connected to the drain passage. A first cooling block is provided to the insulating sheet, includes therein a first tube connected to the first through hole and the second through hole, and is electrically conductive. The first semiconductor laser element is provided to the first cooling block. The first semiconductor laser element includes a first electrode, and a second electrode opposite to the first electrode. The first electrode is electrically connected to the first cooling block, and the cooling plate is at a floating potential.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: December 26, 2017
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Takayuki Yoshida, Jing-Bo Wang
  • Publication number: 20170149205
    Abstract: A semiconductor laser device of the present disclosure includes a cooling plate, an insulating sheet, a first cooling block, and a first semiconductor laser element. The conductive cooling plate includes a water supply passage and a drain passage. The insulating sheet is provided to the cooling plate, and includes a first through hole connected to the water supply passage and a second through hole connected to the drain passage. A first cooling block is provided to the insulating sheet, includes therein a first tube connected to the first through hole and the second through hole, and is electrically conductive. The first semiconductor laser element is provided to the first cooling block. The first semiconductor laser element includes a first electrode, and a second electrode opposite to the first electrode. The first electrode is electrically connected to the first cooling block, and the cooling plate is at a floating potential.
    Type: Application
    Filed: July 9, 2015
    Publication date: May 25, 2017
    Inventors: TAKAYUKI YOSHIDA, JING-BO WANG
  • Patent number: 9162321
    Abstract: A laser welding apparatus includes laser generator, arc generator, wire feeder, filler feeder, filler-feeding-abnormality detector, and controller. Controller stops welding immediately upon receiving a filler-feeding-abnormality signal from filler-feeding-abnormality detector. This can stop welding before the formation of a defective weld bead, and can also prevent the breakage of the welding apparatus.
    Type: Grant
    Filed: March 18, 2011
    Date of Patent: October 20, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Jing-bo Wang, Hitoshi Nishimura
  • Publication number: 20120298639
    Abstract: A laser welding apparatus includes laser generator, arc generator, wire feeder, filler feeder, filler-feeding-abnormality detector, and controller. Controller stops welding immediately upon receiving a filler-feeding-abnormality signal from filler-feeding-abnormality detector. This can stop welding before the formation of a defective weld bead, and can also prevent the breakage of the welding apparatus.
    Type: Application
    Filed: March 18, 2011
    Publication date: November 29, 2012
    Applicant: Panasonic Corporation
    Inventors: Jing-bo Wang, Hitoshi Nishimura
  • Patent number: 6518536
    Abstract: A joining equipment in which a neural network is employed for controlling a joining process. A dynamic analog model is used for neuron elements configuring the network. The equipment includes a detector, a controller, and a neural network. The detector detects a joining state of a joining portion when work pieces are joined with each other. The controller controls the output of the joining equipment. In response to output signals from the detector, the neural network transmits signals to the controller. Such a structure allows the joining equipment to flexibly respond to complicated changes in joining states. Besides, using similarity with a thermal conduction equation enables to minimize the number of input items fed into the neural network. Furthermore, using an approximate solution to the thermal conduction equation realizes to accelerate the time for numerical calculation without loss of accuracy.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: February 11, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Koji Fujii, Jing Bo Wang, Mamoru Watanabe, Yasuhiro Goto, Makoto Ryudo, Kinichi Matsuyama
  • Publication number: 20020008086
    Abstract: A joining equipment in which a neural network is employed for controlling a joining process. A dynamic analog model is used for neuron elements configuring the network. The equipment includes a detector, a controller, and a neural network. The detector detects a joining state of a joining portion when work pieces are joined with each other. The controller controls the output of the joining equipment. In response to output signals from the detector, the neural network transmits signals to the controller. Such a structure allows the joining equipment to flexibly respond to complicated changes in joining states. Besides, using similarity with a thermal conduction equation enables to minimize the number of input items fed into the neural network. Furthermore, using an approximate solution to the thermal conduction equation realizes to accelerate the time for numerical calculation without loss of accuracy.
    Type: Application
    Filed: March 30, 2001
    Publication date: January 24, 2002
    Inventors: Koji Fujii, Jing Bo Wang, Mamoru Watanabe, Yasuhiro Goto, Makoto Ryudo, Kinichi Matsuyama
  • Patent number: 6066831
    Abstract: In an arc start ancillary apparatus, which is connected in parallel to a welding power source for supplying electric power necessary for arc discharge between an electrode and a base metal, for supplying a pulsed electric current in transferring from spark discharge to arc discharge, an object of the present invention is to solve a problem in that arc is not started, and to keep the effective value of current low. A capacitor with a relatively high capacitance is connected to secure a current for transferring from spark discharge to arc discharge, and a D.C. high voltage of a high voltage generator is applied according to a pulse in a period to which the period of pulse signals of a fixed period type high voltage controller is set so that the effective value of the current between an electrode and a base metal is kept low.
    Type: Grant
    Filed: August 4, 1998
    Date of Patent: May 23, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hideki Ihara, Tetsu Innami, Jing Bo Wang
  • Patent number: 5866873
    Abstract: A welding power control apparatus that removes the effects of shorting and noise to accurately detect droplet separation, thereby reducing spatter during droplet separation and when shorting occurs, and stabilizing welding results is achieved. Welding conditions such as welding voltage, welding current, shorting, and droplet separation are detected. Based on thus detected welding conditions, a pulse wave configuration unit generates a steady-state pulse wave and a compensation pulse wave. The steady-state pulse wave is defined by a pulse height for a pulse period and a base height lower than the first pulse height for a base period. The compensation pulse wave defined by a compensation pulse height lower than the pulse height for a compensation period followed by the pulse wave based on said detected welding conditions.
    Type: Grant
    Filed: January 29, 1997
    Date of Patent: February 2, 1999
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Jing Bo Wang, Tetsu Innami, Hideki Ihara