Patents by Inventor Jing G. Zhou

Jing G. Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
    Patent number: 11823925
    Abstract: An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: November 21, 2023
    Assignee: KLA Corporation
    Inventors: Mei Sun, Earl Jensen, Jing G Zhou, Ran Liu
  • Encapsulated Instrumented Substrate Apparatus for Acquiring Measurement Parameters in High Temperature Process Applications
    Publication number: 20200203200
    Abstract: An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.
    Type: Application
    Filed: October 28, 2019
    Publication date: June 25, 2020
    Inventors: Mei Sun, Earl Jensen, Jing G. Zhou, Ran Liu
  • Encapsulated instrumented substrate apparatus for acquiring measurement parameters in high temperature process applications
    Patent number: 10460966
    Abstract: An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: October 29, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Mei Sun, Earl Jensen, Jing G. Zhou, Ran Liu
  • Encapsulated Instrumented Substrate Apparatus for Acquiring Measurement Parameters in High Temperature Process Applications
    Publication number: 20170365495
    Abstract: An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.
    Type: Application
    Filed: September 27, 2016
    Publication date: December 21, 2017
    Inventors: Mei Sun, Earl Jensen, Jing G. Zhou, Ran Liu