Patents by Inventor Jing-Ho Kim

Jing-Ho Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead on chip semiconductor package
    Publication number: 20050212099
    Abstract: The present invention provides an LOC package wherein the lead frame is in direct contact with the semiconductor device. The lead frame, which includes openings, is positioned directly on the semiconductor device. An adhesive material is applied in the opening in the lead frame. This adhesive material contacts both the lead frame and the semiconductor device. The lead frame is therefore securely held to the semiconductor device. Wires can then be bonded to contact pads on the semiconductor device and to the lead frame.
    Type: Application
    Filed: March 11, 2005
    Publication date: September 29, 2005
    Inventors: Sang-Hyeop Lee, Se-Yong Oh, Jing-Ho Kim, Chan-Suk Lee, Min-Keun Kwak, Sung-Hwan Yoon, Tae-Duk Nam