Patents by Inventor Jing-Hua He

Jing-Hua He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250133692
    Abstract: A cold plate comprises a plurality of fins. The individual fins have an opening, and the openings collectively define a first channel through the plurality of fins. During operation of an integrated circuit component attached to the cold plate, coolant is pumped through the cold plate. The coolant flows in a first direction through the first channel and then in a second through second channels located between the fins. The first direction is substantially orthogonal to the second direction. The first channel can comprise a tube that has openings that direct coolant to flow into the second channels. The first channel is located close to the base plate of the cold plate so that there is a high degree of heat transfer between an integrated circuit component attached to the cold plate and coolant flowing through the cold plate.
    Type: Application
    Filed: December 20, 2024
    Publication date: April 24, 2025
    Applicant: Intel Corporation
    Inventors: Christian Amoah-Kusi, Chi-Hung Chuang, Jing-Hua He
  • Publication number: 20240349457
    Abstract: Damping assemblies for heat sinks and related methods are disclosed. An example apparatus includes a chassis; a first heat sink associated with an electronic component in the chassis; a second heat sink coupled to the first heat sink, the second heat sink spaced apart from the first heat sink in the chassis; and damping material proximate to the second heat sink.
    Type: Application
    Filed: June 26, 2024
    Publication date: October 17, 2024
    Inventors: Phil Geng, David Shia, Donald Tiendung Tran, James Trevor Goulding, Jeffory L. Smalley, Ralph V. Miele, Sanjoy Kumar Saha, Jing-Hua He, Steven Adam Klein, Ethan Russell Long, Andres Ramirez Macias, Irving Joseph Castro Guzman
  • Publication number: 20240064931
    Abstract: An apparatus is described. The apparatus includes a coolant distribution unit having a first primary loop output to provide first cooled immersion liquid to an immersion chamber and a second primary loop output to provide second cooled immersion liquid to one or more cold plates within the immersion chamber.
    Type: Application
    Filed: October 31, 2023
    Publication date: February 22, 2024
    Inventors: Jimmy CHUANG, Yuehong FAN, Jing-Hua HE, Sandeep AHUJA, Jay WU, Dongrui XUE, Xiaowei LI
  • Patent number: 6657272
    Abstract: An optical receiver having a silicon substrate with a top surface cleaved from a [100] silicon crystallographic plane and a reflector, and a photodetector coupled to the top surface of the silicon substrate, the photodetector being adapted to receive an incoming signal from a fiber.
    Type: Grant
    Filed: April 19, 2002
    Date of Patent: December 2, 2003
    Assignee: Triquint Technology Holding Co.
    Inventors: Jing-Hua He, Muhammad Arif, Rao Yelamarty, Hak Byun, Christina Arnold
  • Publication number: 20030197236
    Abstract: An optical receiver having a silicon substrate with a top surface cleaved from a [100] silicon crystallographic plane and a reflector, and a photodetector coupled to the top surface of the silicon substrate, the photodetector being adapted to receive an incoming signal from a fiber.
    Type: Application
    Filed: April 19, 2002
    Publication date: October 23, 2003
    Inventors: Jing-Hua He, Muhammad Arif, Rao Yelamarty, Hak Byun, Christina Arnold
  • Publication number: 20030035450
    Abstract: A structure for holding an optical subassembly such as a laser and which minimizes the tilt of the optical subassembly. Pads are placed between the optical subassembly and the housing forming grooves along the inside of the housing and between the pads. The solder for mounting the subassembly to the housing is placed in the grooves. The volume of the solder is chosen so that it does not overflow the grooves. But the solder can be constructed so that its height is greater than the height of the grooves. The optical subassembly is placed against the solder with a downward force and heat is applied to the bottom of the base to melt the solder.
    Type: Application
    Filed: August 20, 2001
    Publication date: February 20, 2003
    Applicant: Agere Systems Inc.
    Inventors: Jing-Hua He, John J. Kilgarriff, Erming Luo, John Osenbach, Brian D. Potteiger, Harry Reichelderfer, Rao Yelamarty