Abstract: A semiconductor device includes a stack structure and channel holes penetrating through the stack structure. The stack structure includes alternately stacked dielectric layers and conductive layers, the conductive layers including a top select gate layer. The top select gate layer is provided with a first top select gate isolation structure and a second top select gate isolation structure, and the channel holes are located between the first top select gate isolation structure and the second top select gate isolation structure. The second top select gate isolation structure includes an insulation portion, and the insulation portion is divided into a plurality of second top select gate isolation substructures, so that the critical dimension (CD) of the second top select gate isolation substructure may be matched with the CD of the first top select gate isolation structure.

Abstract: Three-dimensional (3D) memory devices and fabricating methods thereof are disclosed. In certain aspects, a method for forming a 3D memory device can comprise forming a first semiconductor structure, comprising forming a stack structure on a first substrate, and forming a gate line slit structure including a filling structure penetrating the stack structure and extending into the first substrate. The method can further comprise forming a second semiconductor structure including a periphery circuit on a second substrate, and bonding the second semiconductor structure to the first semiconductor structure. The method can further comprise removing a portion of the first substrate and a portion of the gate line slit structure extended into the first substrate, and forming a supplemental semiconductor layer on a remaining portion of the first substrate.

Abstract: A method includes: constructing an on-wafer calibration piece model set that includes one or more on-wafer calibration piece models, where each of the one or more on-wafer calibration piece models has a corresponding on-wafer calibration piece; selecting an on-wafer calibration piece model from the on-wafer calibration piece model set; measuring the on-wafer calibration piece utilizing an on-wafer S parameter measurement system that is calibrated using a multi-thread TRL calibration method in a Terahertz frequency band, to obtain an S parameter of the on-wafer calibration piece; and calculating a plurality of different parameters that represent crosstalk of calibration pieces in the on-wafer calibration piece model, according to an admittance calculated according to the S parameter and an admittance formula corresponding to the on-wafer calibration piece model.

Abstract: A semiconductor device includes a first stack of alternating first word line layers and first insulating layers over a semiconductor layer. A first channel structure extends from the semiconductor layer and through a first array region of the first stack. A second stack of alternating second word line layers and second insulating layers are over the first stack. A second channel structure extends from the first channel structure and through a second array region of the second stack. A thickness of a particular first insulating layer, which is positioned closest to the second stack relative to other first insulating layers, is a sum of at least two times an average thickness of the other first insulating layers and at least one time an average thickness of the first word line layers in the first array region.

Abstract: A structure multi-dimensional loading test system considering real complex boundary conditions considering real complex boundary conditions comprises a main part of machine, a base part, a hydraulic power supply and a control system. The system can simulate the load borne by a structure in a real working environment better and more accurately, realize multi-dimensional loading of the structure with six degrees of freedom in space and provide more real and valuable experimental data for the research on damage of reinforced concrete materials, components and structures under the action of an earthquake, and the research results will help researchers further reveal the damage mechanism of reinforced concrete structures, put forward the corresponding damage criteria and develop the corresponding seismic design methods.

Abstract: The present invention relates to a heat sink structure and a flexible light-emitting device with heat sink structures. The heat sink structure according to the present invention dissipates heat through a heat sink part. A hooking part on one end of the heat sink structure hooks a fixing part of another heat sink structure for forming flexible and bendable heat sink structures. Bending the heat sink structures gives a first nonlinear structure. The flexible light-emitting device can be disposed on the heat sink structures. The heat generated by the flexible light-emitting device can be removed by the heat sink structures. The heat sink structures can adapt to lamps with various designs. Then the design freedom and reliability of lamps can be improved.

Abstract: The present invention relates to a heat sink structure and a flexible light-emitting device with heat sink structures. The heat sink structure according to the present invention dissipates heat through a heat sink part. A hooking part on one end of the heat sink structure hooks a fixing part of another heat sink structure for forming flexible and bendable heat sink structures. Bending the heat sink structures gives a first nonlinear structure. The flexible light-emitting device can be disposed on the heat sink structures. The heat generated by the flexible light-emitting device can be removed by the heat sink structures. The heat sink structures can adapt to lamps with various designs. Then the design freedom and reliability of lamps can be improved.

Abstract: A direct emitting LED illumination module for eliminating chromatic dispersion improves a vehicular LED lamp to comply with related regulations. The LED illumination module includes a LED light source and a plano-convex lens. The LED light source is located at the focus of the plano-convex lens. The LED light source emits light to the plane of the plano-convex lens, and the light exits from the convex surface of the plano-convex lens. The plano-convex lens focuses the light to form a desirable light pattern. Besides, the plane of the plano-convex lens has a microstructure thereon to suppress the angular correlated color temperature deviation of the light pattern and eliminate chromatic dispersion.

Abstract: A direct emitting LED illumination module for eliminating chromatic dispersion improves a vehicular LED lamp to comply with related regulations. The LED illumination module includes a LED light source and a plano-convex lens. The LED light source is located at the focus of the plano-convex lens. The LED light source emits light to the plane of the plano-convex lens, and the light exits from the convex surface of the plano-convex lens. The plano-convex lens focuses the light to form a desirable light pattern. Besides, the plane of the plano-convex lens has a microstructure thereon to suppress the angular correlated color temperature deviation of the light pattern and eliminate chromatic dispersion.

Abstract: The invention relates to a method and system for implementing a relay channel, and an edge node, in which a media location service system monitors the number of orders of all nodes in an IPTV system, and, when monitoring that the number of orders of the central node of the IPTV system is more than a predetermined first threshold, searches edge nodes with the number of orders less than a predetermined second threshold, and sends a relay channel establishing request message to one of the edge nodes; the edge node which receives the message sends an RTSP link establishing request message to the central node, reserves a media distribute unit (MDU) resource for the link, and notifies the central node of the IP address of the reserved MDU resource; and the edge node enables the MDU resource, sends a media stream requesting message to the central node, and stores data of the relay channel.

Abstract: The invention relates to a method and system for implementing a relay channel, and an edge node, in which a media location service system monitors the number of orders of all nodes in an IPTV system, and, when monitoring that the number of orders of the central node of the IPTV system is more than a predetermined first threshold, searches edge nodes with the number of orders less than a predetermined second threshold, and sends a relay channel establishing request message to one of the edge nodes; the edge node which receives the message sends an RTSP link establishing request message to the central node, reserves a media distribute unit (MDU) resource for the link, and notifies the central node of the IP address of the reserved MDU resource; and the edge node enables the MDU resource, sends a media stream requesting message to the central node, and stores data of the relay channel.

Abstract: A method for detecting solid components in ground glass nodules (GGNs) in medical images, includes: performing an intensity-based segmentation on a segmented GGN to identify a high intensity region; and performing a shape analysis to determine whether the high intensity region is a solid component or a vessel, wherein the shape analysis comprises: computing a compactness of the high intensity region; and determining whether the high intensity region is a solid component or a vessel by using an area, a maximum distance on a distance transform map and the compactness of the region; or determining whether the high intensity region is a solid component or a vessel by scaling and normalizing the region and computing a compactness for the scaled and normalized region.

Abstract: A method for detecting solid components in ground glass nodules (GGNs) in medical images, includes: performing an intensity-based segmentation on a segmented GGN to identify a high intensity region; and performing a shape analysis to determine whether the high intensity region is a solid component or a vessel, wherein the shape analysis comprises: computing a compactness of the high intensity region; and determining whether the high intensity region is a solid component or a vessel by using an area, a maximum distance on a distance transform map and the compactness of the region; or determining whether the high intensity region is a solid component or a vessel by scaling and normalizing the region and computing a compactness for the scaled and normalized region.