Patents by Inventor Jing-Jie Lin

Jing-Jie Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS device, manufacturing method of the same, and integrated MEMS module using the same
    Patent number: 11939212
    Abstract: A MEMS device is provided. The MEMS device includes a substrate having at least one contact, a first dielectric layer disposed on the substrate, at least one metal layer disposed on the first dielectric layer, a second dielectric layer disposed on the first dielectric layer and the metal layer and having a recess structure, and a structure layer disposed on the second dielectric layer and having an opening. The opening is disposed on and corresponds to the recess structure, and the cross-sectional area at the bottom of the opening is smaller than the cross-sectional area at the top of the recess structure. The MEMS device also includes a sealing layer, and at least a portion of the sealing layer is disposed in the opening and the recess structure. The second dielectric layer, the structure layer, and the sealing layer define a chamber.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: March 26, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Heng-Chung Chang, Jhih-Jie Huang, Chih-Ya Tsai, Jing-Yuan Lin
  • Electronic device
    Patent number: 11360524
    Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: June 14, 2022
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Ming-Chung Peng, Ko-Fan Chen, Chun-Yi Ho, Chien-Ting Lin, Yu-Jung Liu, Hsin-Jung Lee, Hsin-Yu Huang, Jih-Houng Lee, Ming-Feng Liu, Kuo-Jung Wu, Kuo-Pin Chen, Chia-Ling Lee, Jing-Jie Lin
  • ELECTRONIC DEVICE
    Publication number: 20210157369
    Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.
    Type: Application
    Filed: February 4, 2021
    Publication date: May 27, 2021
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Ming-Chung Peng, Ko-Fan Chen, Chun-Yi Ho, Chien-Ting Lin, Yu-Jung Liu, Hsin-Jung Lee, Hsin-Yu Huang, Jih-Houng Lee, Ming-Feng Liu, Kuo-Jung Wu, Kuo-Pin Chen, Chia-Ling Lee, Jing-Jie Lin
  • Electronic device with circuit board and hinge therein
    Patent number: 10963019
    Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: March 30, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Ming-Chung Peng, Ko-Fan Chen, Chun-Yi Ho, Chien-Ting Lin, Yu-Jung Liu, Hsin-Jung Lee, Hsin-Yu Huang, Jih-Houng Lee, Ming-Feng Liu, Kuo-Jung Wu, Kuo-Pin Chen, Chia-Ling Lee, Jing-Jie Lin
  • ELECTRONIC DEVICE
    Publication number: 20200387200
    Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.
    Type: Application
    Filed: January 21, 2020
    Publication date: December 10, 2020
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Ming-Chung Peng, Ko-Fan Chen, Chun-Yi Ho, Chien-Ting Lin, Yu-Jung Liu, Hsin-Jung Lee, Hsin-Yu Huang, Jih-Houng Lee, Ming-Feng Liu, Kuo-Jung Wu, Kuo-Pin Chen, Chia-Ling Lee, Jing-Jie Lin