Patents by Inventor Jing P. Pan

Jing P. Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyimide adhesive composition including barbituric acid modifier
    Patent number: 5200474
    Abstract: A polyimide adhesive composition is a reaction product of polyamic acid and bismaleimide (I) modified by barbituric acid (II) or the derivatives thereof. Once the present composition is directly coated onto copper foil, the bonding force is greatly improved as compared to compositions without (II) or (I) and (II). Therefore, the adhesive normally used in the manufacture of flexible printed circuits boards and tape automated bonding (TAB) is no longer necessary.
    Type: Grant
    Filed: August 22, 1990
    Date of Patent: April 6, 1993
    Assignee: Industrial Technology Research Institute
    Inventors: Ker M. Chen, Jing P. Pan, Gwo Y. Shiau, Tsung H. Wang, Wei C. Chang